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JP2023170933A |
To evenly grind all of a plurality of wafers by preventing thermal expansion of a chuck table.A grinding method of a wafer 100 grinds the wafer 100 held on a holding surface 11 of a porous plate 13 of a chuck table 10 with a grinding whe...
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JP2023169791A |
To provide a grinding device that can suppress adhesion of grinding chips to a holding surface of a chuck table in a state where it is not operating so as to hold a workpiece on the holding surface (a non-operational state).When a chuck ...
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JP7388781B2 |
This wire saw machine having a dust collecting apparatus comprises a main roller for moving a wire by rotation; a first pulley system including a first upper dust collecting roller, a first lower dust collecting roller, and a first suppo...
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JP7388925B2 |
An apparatus for processing an edge of a substrate sheet. The apparatus includes a finishing member, a shroud, and a tubular member. The finishing member is rotatably maintained within a chamber of the shroud. The shroud includes a wall ...
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JP7386411B2 |
To provide a work-piece observation device which performs temperature measurement of a heating state of a work-piece by a processing tool including a cutting tool with a grindstone as a main constituent, and non-contact in-process measur...
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JP2023168248A |
To provide a method and a system for recycling a polishing slurry waste liquid.There are provided a method and a system for recycling a polishing slurry waste liquid according to embodiments of the present invention. The system comprises...
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JP2023167564A |
To save water and power by cleaning an inner wall of a processing chamber by using a cleaning drain water.In a grinding device (processing device) 1 comprising: a chuck table 10 holding a wafer W with a holding surface 10a; grinding unit...
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JP2023167939A |
To provide a dust collector having air cleaning function capable of safely removing powder dusts and so on generated during a processing work, and supplying cleaned air to indoor spaces such as factories and so on.A dust collector compri...
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JP7384687B2 |
To wash a holding surface without consuming power.A washing device 5 comprises: a washing tool 50; and rotation means 51 having a rotation shaft 55 coupled with the washing tool 50, a bearing 52 rotatably supporting the rotation shaft 55...
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JP7385067B2 |
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JP7385007B2 |
A tool includes a prime mover, switch, operation member for the switch, first accessory, second accessory, third intermediate member moved in conjunction with displacement of the operation member, first intermediate member configured to ...
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JP7383342B2 |
Provided is a washing method for a grinding chamber, which can reduce a usage amount of grinding water compared to a grinding wheel having a wheelbase with a through-hole penetrating substantially in a lateral direction. The washing meth...
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JP7383118B2 |
A grinding apparatus includes a rotary table, multiple chuck, a rotational driving unit, a grinding position cover, a cleaning unit and an attachment/detachment position cover. The horizontal rotary table is configured to be rotated arou...
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JP7382794B2 |
To provide a cutting device that allows for suppression of ingress of chip and cutting water into the device and furthermore allows for reduction of scattering of the cutting water caused by movement of a chuck table.A cutting device 1 c...
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JP7381254B2 |
To grind a wafer while preventing discharge of static electricity between a top face height gauge and a wafer.After performing a holding process in which a wafer W is held on a holding surface 20a of a chuck table 2, a first probe 510 is...
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JP2023163405A |
To provide a processing device that can prevent processing chips adhering to a cleaning liquid supply nozzle from falling on a work-piece or a holding table.A processing device 1 comprises: a holding table 10 on which a work-piece 200 is...
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JP2023162641A |
To reduce a degree of dryness in a duct connected to a processing chamber.A processing device 2 includes: a processing chamber cover 34 which covers a chuck table 4, a processing tool 28, and a processing water supply mozzle 32 from abov...
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JP7376037B1 |
An object of the present invention is to easily and inexpensively remove sludge contained in dirty coolant liquid discharged from a machine tool and discharge it to the outside of the machine tool, thereby improving the maintainability o...
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JP2023161339A |
To grind a wafer into a uniform thickness over the entire surface while suppressing heat deformation of the wafer due to grinding water.A wafer grinding method for grinding a wafer W with a rotating annular grindstone 26b by rotating the...
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JP7373861B2 |
Cleaning water CW is supplied to the outer surface of a draining roll 10 from a pipe 70 arranged above the draining roll 10 that is in pressure contact with a contact roll 8 via a polishing belt PB. Accordingly, the cleaning water CW adh...
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JP7373938B2 |
To enable a grinding liquid to be supplied to a center in a thickness direction of a grinding stone during processing.A grinding stone 101 comprises: a circular base 110 in which a penetration hole 115 into which a spindle is penetrated ...
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JP2023158691A |
To provide a spindle unit capable of reducing a frequency of cleaning a tip of a spindle by suppressing adhesion of treated liquid containing treatment wastes to the tip.A groove is formed around a spindle in a region opposite an inner s...
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JP2023158793A |
To provide a processing waste liquid treatment device which can remove processing chips from processing waste liquid efficiently with a small-sized structure.A processing waste liquid treatment device comprises: centrifugal separation un...
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JP7370584B2 |
To enable a dress timing to be set during grinding processing.In a grinding machine 11, a state of a grinding surface 19a of a rotary grindstone 19 is photographed with a camera 38 during grinding processing by the rotary grindstone 19. ...
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JP7370262B2 |
A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpie...
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JP7368167B2 |
A dust collecting treatment apparatus is connected to a dry type polishing apparatus, sucks dust-containing air from the dry type polishing apparatus, and separates the dust and the air from each other. The apparatus includes a cylindric...
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JP2023155947A |
To provide a processing apparatus which has a simple structure and can prevent processing water from being scattered to the outside of a processing chamber.A processing chamber cover of a processing apparatus is provided with a first tra...
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JP7366987B2 |
A portable power tool having a plate tool (30), in particular a sanding plate or polishing plate, and a drive motor, arranged in a machine housing, for driving the plate tool into an oscillating and/or rotating and/or eccentric movement ...
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JP2023154464A |
To provide a grinding device configured so that the inside of a processing chamber cover is washed at a warm-up time and also at a grinding time.The grinding device is provided with: a chuck table for holding a work-piece; a grinding uni...
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JP2023155151A |
To provide a substrate treatment system capable of supplying a treatment liquid including highly concentrated microbubbles to a substrate to be treated without generating large bubbles on the way to a supply line of the treatment liquid....
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JP7364341B2 |
To provide a waste liquid treatment apparatus for taking clear water from processing waste liquid including processed waste, the treatment apparatus making it possible to check whether the clear water is properly taken through a water in...
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JP7364338B2 |
To prevent grinding dust from remaining on and re-adhering to a holding surface and prevent reduction of flatness of the holding surface in a holding surface cleaner which cleans a holding surface of a chuck table.A holding surface clean...
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JP2023148227A |
To provide a polishing method that can suppress polishing liquid such as slurry from influencing accuracy in measuring a film thickness of a work-piece, so as to enable the film-thickness to be measured accurately.In a polishing method, ...
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JP2023148574A |
To provide a dicing device that can appropriately perform work for maintaining even a large-sized work-piece.A dicing device is provided with a housing 52 housing a work table 12 that moves while holding a work-piece W and a spindle 18 t...
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JP2023148462A |
To provide an air nozzle for microscope that can effectively remove water from a surface to be observed of a microscope.An air nozzle for microscope includes a first injection port 84 that injects air toward a surface to be observed S fr...
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JP2023148230A |
To shorten a time for washing a wafer whose electrode is exposed to an upper surface by being ground.When a grinding step is completed, supply of pure water is stopped and scrap metal-dissolved water L2 is supplied to an upper surface 10...
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JP2023145215A |
To provide a wafer processing device with a structure which inhibits thermal expansion of a fixing screw fixing a chuck to a chuck base to reduce change of axial force and thereby enable high precision processing.A wafer processing devic...
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JP7358231B2 |
To provide carrier washing equipment capable of easily washing a carrier for use in workpiece polishing.Carrier washing equipment 1, which washes a carrier C for being used to hold a workpiece while polishing the workpiece by a polishing...
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JP2023542458A |
A chemical mechanical polishing system includes a platen supporting a polishing pad, a carrier head, a motor generating relative motion between the platen and the carrier head, a vessel having a water inlet and one or more steam outlets,...
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JP2023140438A |
To provide a holding pad which is excellent in retainability for a workpiece having irregularities on an upper surface and a workpiece having a small thickness, and to provide a transport device.A holding pad (40) suctions and holds an u...
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JP2023140906A |
To provide an edge trimming device which can prevent smudges on a rear surface of a wafer.An edge trimming device 10 includes: a processing part 14 which uses a blade 56 to perform edge trimming to a wafer W held by a first table 100; an...
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JP2023140627A |
To provide a processing device which can clean a holding surface for holding a work-piece without relying on a dedicated cleaning mechanism.A processing device comprises: a holding unit including a chuck table which has a first holding s...
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JP2023141626A |
To provide a portable cutter capable of preventing a belt from slipping with a pulley of a belt while maintaining preferable assemblability and maintainability.According to an aspect of the present invention, provided is a portable cutte...
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JP2023140626A |
To provide a cutting device which can easily remove foreign matters such as scraps and so on adhered to a detection unit.A cutting device for cutting a work-piece comprises: a cutting unit comprising a spindle, and a blade mount attached...
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JP2023140558A |
To provide technique for improving dust collection efficiency in a dust box that can be attached to and detached from a belt sander.A dust box attachable to and detachable form a belt sander including a discharge nozzle that discharges d...
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JP2023541943A |
A recirculation system 200 and a material removal system 100 for the material remover 102 are provided. The material removal system 100 includes a recirculation system 200 in fluid communication with a material removal cabinet 104 that h...
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JP7356248B2 |
To provide a composition for rinse, which contains a water-soluble polymer and no polishing grains, and which can decrease the number of defects of target objects after polishing.A composition for rinse, which is provided according to th...
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JP2023139802A |
To provide a portable polishing machine which can reduce at least one of mass and size of a weight.A portable polishing machine comprises: a rotatable output shaft which extends in an axial direction; a polishing part which performs an e...
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JP2023139675A |
To transfer a wafer to a cleaning unit while maintaining a state where a water layer is formed onto the upper surface.A processing device 1 comprises: a chuck table 10; a processing unit 20; a first transfer unit 61 and a second transfer...
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JP7355861B2 |
A steam generating apparatus includes a canister having a water inlet and a steam outlet. The steam generating apparatus includes a barrier in the canister dividing the canister into a lower chamber and an upper chamber. The lower chambe...
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