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JP2024001508A |
The present invention provides a surface texture estimating device that can improve the durability of an acceleration sensor. [Solution] A surface texture estimating device 2 includes a sizing device 3 that measures the diameter of a gri...
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JP2024001496A |
[Problem] A cap capable of protecting a portion located at the opening of a spindle and a portion located around the opening of a housing, as well as suppressing air jetting along the distal end surface of the housing, and this cap. To p...
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JP2024001495A |
An object of the present invention is to provide a processing device that can prevent proper polishing from being inhibited by liquid adhering to a workpiece. [Solution] A processing device for processing a workpiece, which includes a ch...
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JP2024000701A |
An object of the present invention is to provide a method for removing foreign matter that can effectively remove foreign matter stuck in the outer periphery of a porous plate of a chuck table. A fluid is ejected from the outer periphery...
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JP2024000060A |
An object of the present invention is to provide a grinding device that can improve the efficiency of work related to maintenance of the grinding device and is advantageous in saving space. [Solution] A grinding device used when grinding...
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JP7408306B2 |
To enable suppression of generation of a defective wafer.A cutting device comprises: a chuck table; a cutting unit; a transfer unit that performs carrying or export of a wafer into the chuck table by sucking and holding a front surface s...
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JP2024000059A |
An object of the present invention is to efficiently and effectively eliminate scraps generated by processing a workpiece. The present invention includes a holding unit that holds a workpiece, a processing unit equipped with a processing...
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JP2024000251A |
An object of the present invention is to provide an offcut processing device that can collect and efficiently dispose of offcuts generated by processing a workpiece while reducing manual labor by an operator. [Solution] Offcuts discharge...
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JP2024000233A |
[Problem] To achieve both reduction in the number of dimples and wafer productivity. A chuck table that suction-holds a wafer, a grinding unit for grinding the wafer, a positioning unit having a positioning table, and a transport arm tha...
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JP2024500156A |
An extension handle system for a hand-held power tool, such as a right-angle grinder, consists of an extension shaft with a fork assembly attached to one end for pivotally mounting the power tool, and a power outlet for the tool and exte...
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JP7406980B2 |
An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. ...
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JP7406943B2 |
The present invention relates to a polishing device and a polishing method for polishing the back side of a substrate such as a wafer. The present invention further relates to a substrate processing device provided with the polishing dev...
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JP2023184251A |
To provide a coolant circulation device which can suppress accumulation of sludge in a recovery path of a coolant while suppressing increase in the device.A first supply part 23 supplies a coolant pressure-fed by a pump 22 to a processed...
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JP2023182041A |
To provide a processing device for facilitating collection of a workpiece after processing.A processing device for processing a workpiece has a holding table for holding the workpiece, a processing unit for processing the workpiece held ...
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JP2023553999A |
Embodiments herein include a carrier loading station and associated method that may be used to beneficially remove nanoscale and/or micron scale particles attached to beveled edges of a substrate prior to polishing the substrate. . By re...
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JP2023182226A |
To provide a machining device capable of quickly drying the lower surface of a workpiece without removing the workpiece held on a table within a short time.A grinding device (machining device) 1, which is provided with a third table 43 f...
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JP7403634B2 |
A removing apparatus includes a table, multiple chucks, a nozzle and a table cover. The table is horizontally provided and configured to be rotated around a vertical rotation center line. The multiple chucks are disposed at a distance th...
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JP2023180487A |
To provide a conveying unit and/or a processing apparatus including the conveying unit that dry a workpiece of a lower face of a frame unit including the workpiece and can suppress reduction in throughput.With a workpiece or a frame unit...
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JP2023180400A |
To effectively remove a burr generated in a kerf of a workpiece without using a large amount of high-pressure water.A burr removal device 40 removes a burr in a workpiece W in which the burr is formed in a kerf cut by a cutting blade 32,...
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JP7402737B2 |
A tool includes a first accessory, at least two first attachment portions for detachably and selectively attaching the first accessory, and a single first intermediate member provided in common for the at least two first attachment porti...
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JP2023180023A |
To take out an end material from a machining chamber even in a course of grinding in a grinding device.A grinding device 1 including: a chuck table 20 which holds a wafer 100 on a holding surface 210, a grinding mechanism 30 which grinds...
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JP2023179005A |
To immediately notify an operator of the occurrence of abnormality when abnormality occurs in air exhaustion of a treatment chamber.A processing device for processing a workpiece includes: a chuck table for holding a workpiece; a process...
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JP2023552256A |
The present invention is an embedding press for automatically embedding a sample in an embedding material, comprising: a pressurizing unit having a pressurizing cylinder; a charging device for charging the embedding material; a sample lo...
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JP7398946B2 |
To provide a polishing device which can recover a larger amount of powder dust (polishing waste) accumulating around a dress part.A polishing device 1 includes: a chuck table 13; a polishing mechanism 2 having a polishing tool 23, a spin...
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JP7398977B2 |
To provide a processing device capable of restraining grease from being discharged into the device.A processing device 1 includes: a supply passage 92 having therein an air actuator 50 that uses grease and supplying compressed air from a...
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JP2023177689A |
To provide a workpiece processor and a method for processing a workpiece that can prevent a foreign material from attaching on a holding surface.A workpiece processor 1 includes: a holding table 10 having a holding surface 11 for holding...
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JP7398325B2 |
A tool includes a first accessory, a second accessory, a first attachment portion configured to allow the first accessory to be detachably attached thereto, a second attachment portion configured to allow the second accessory to be detac...
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JP2023177773A |
To prevent coming off of a pipe nozzle for jetting a fluid such as air.A fixing member to which a pipe nozzle is inserted and that fixes the pipe nozzle includes a columnar support part, and a truncated cone-shaped pressing holding part ...
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JP2023176891A |
To provide a grinding device comprising a valve which adjusts flow volume of grinding liquid according to grinding resistance.A grinding device comprises: a workpiece support portion which supports a workpiece rotatably around an axis; a...
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JP2023176237A |
To provide a silicon wafer polishing method capable of obtaining a silicon wafer of high LPD quality as a whole surface of the silicon wafer.In succession to a polishing step, a rinse step performs rinse treatment by pressing a silicon w...
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JP2023176322A |
To reduce a machine size.In a dust collector 10 of a dust collecting apparatus 1, a motor 30 and a fan 38 are housed in a housing 12, the battery 22 is attached to the battery attachment part 12L of the housing 12; and power is supplied ...
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JP7397617B2 |
There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-te...
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JP2023176323A |
To improve workability.In a dust collector 10 of a dust collecting device 1, a cap 50 is attached to an intake pipe 12F of a housing 12, and the cap 50 is configured to be switchable between an open state to open an intake port 12F1 of t...
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JP7396785B2 |
The present invention relates to a grinding apparatus, which prevents a defect on an outer circumferential surface of a wafer. To this end, a grinding apparatus (1) comprises cleaning nozzles (50A, 50B) which spray cleaning water (53) on...
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JP2023175130A |
To provide a cutting device that can efficiently prevent chips from adhering to the device.A cutting device 1 is configured to include: a chuck table 8a for holding a work-piece W; cutting means 9 that rotatably comprises a cutting blade...
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JP7395264B2 |
A stationary cutting machine for metalworking, backflow of, for example, sparks toward an operator is prevented. A dust collector box is installable behind a cutting blade of a stationary cutting machine for metalworking for cutting a wo...
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JP7395105B2 |
[Problem] To provide a coolant quality management system for detecting the quality of a coolant for cooling a machining tool while a metal-machining device is operating or stopped, and a coolant quality detection unit to be used therein....
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JP7394531B2 |
To provide a wafer chuck washing method and a device, capable of removing a fine foreign substance from a wafer chuck surface.A wafer chuck washing device 1 includes a grindstone 3 for grinding a chuck surface 21, and a nozzle 4 for disc...
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JP2023173270A |
To supply at low operation cost, processing water in which carbon dioxide is mixed.A processing water supply device for supplying processing water to a processing unit arranged in a processing device, is provided, including: a processing...
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JP2023173451A |
To provide a cutting method of a workpiece capable of cooling an ingot efficiently, a slice device, and a slice base.According to a cutting method of a workpiece for cutting a workpiece into a wafer shape, a wire column is formed by wind...
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JP7393963B2 |
A grinding apparatus includes a grinding unit, a grinding feeding mechanism, and a grinding water supply unit. The grinding water supply unit includes a nozzle that jets grinding water to grindstones, and a biasing mechanism that biases ...
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JP2023173997A |
To provide a processing device including a foreign matter removal unit capable of removing a foreign matter further appropriately.A processing device includes: a chuck table that holds an object to be processed in a holding surface; a pr...
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JP2023173586A |
To remove a polishing liquid adhering to an upper surface of a chuck table base easily.A chuck table 31 is removed from a chuck table base 33 to expose a support surface 330 and the exposed support surface 330 is cleaned by a polishing p...
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JP2023174510A |
To provide a crank shaft having excellent fatigue strength.A crank shaft 10 comprising a mechanical structure steel material includes a circular column-shaped sliding part 121, a fillet part 122 and a thrust part 123. The thrust part 123...
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JP7393301B2 |
The present invention realizes a polishing device that is suitable for surface reference polishing. A polishing device 100 includes: a plurality of substrate holding mechanisms 200 disposed along a first direction (X direction) of a su...
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JP2023172162A |
To surely prevent a wafer from being damaged by polishing chips even when dry- polishing is continuously performed for a long time.A plurality of suction ports 12a are annularly arranged in an upper surface of a frame body 10A of a chuck...
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JP2023171989A |
To provide a cutting device capable of keeping a blade suction surface in a clean state.A blade replacement device includes: a blade replacement mechanism including at least a first suction part configured to suction a blade; a cover bod...
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JP2023171983A |
To provide a grinding device that is configured to render washing of an adsorption surface of a conveying pad unnecessary, by preventing grinding dust or spray including grinding dust from adhering to the adsorption surface.The grinding ...
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JP2023170374A |
To provide a lubricant oil oxidation degree determination method capable of easily and quickly determining the oxidation degree of lubricant oil including base oil and fullerene, to provide a lubricant oil oxidation degree determination ...
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JP2023171001A |
To provide an auxiliary device which can automatically replace a cutting blade, which can be attached later to a cutting device that has been already delivered to a user, and in which a cutting edge detection sensor or the like can be cl...
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