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JP2024026991A |
An object of the present invention is to provide a technique that can suppress a decrease in abnormality detection accuracy. An abnormality detection device 11 is a device for a grinding device 2 that performs a grinding process on a wor...
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JP7440361B2 |
To provide a device which efficiently polishes an outer periphery of a steel pipe while moving in a circumferential direction.A polishing device 1 comprises a polishing unit 2 and a carrier unit 3, and polishes an outer circumference of ...
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JP7439614B2 |
To provide a method for producing an R-T-B based sintered magnet capable of increasing the utilization efficiency of a diffusion material for a sintered body.There is provided a method for producing an R-T-B based sintered magnet which c...
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JP2024508767A |
A containment and evacuation system for substrate polishing components is disclosed. In one aspect, a substrate carrier head includes a polishing pad, a substrate carrier head configured to hold a wafer against the polishing pad, and a s...
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JP7439613B2 |
To provide a method for producing a novel R-T-B-based sintered magnet capable of further increasing a yield.There is provide a method for producing an R-T-B based sintered magnet which comprises: a step of preparing a workpiece of a powd...
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JP2024508534A |
A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit that conveys fluid from the fluid source into the chemical mechanical polishing system. A chemical mechanical polishing sy...
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JP2024025198A |
[Problem] To propose a new configuration for ensuring the flow of waste liquid from a drain port without requiring energy such as air injection or electric power. [Solution] A holding unit that holds a workpiece, a processing unit that p...
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JP2024025383A |
An object of the present invention is to provide a processing device and a method for processing a workpiece that can prevent cleaning liquid from entering the loading/unloading area and spray from scattering. [Solution] A holding table ...
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JP2024025302A |
An object of the present invention is to improve the dustproof performance of a switch with a simple configuration. In a grinder 10, a switch holder 30 holding a switch 40 is provided on a frame section 28 of a motor housing 24, and a ta...
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JP2024025598A |
[Problem] Processing technology using a wire mesh grindstone that enables a variety of cutting processes such as straight groove machining, arbitrary groove width processing, and straight line cutting to arbitrary curve cutting on workpi...
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JP2024024325A |
[Problem] To notify and alert a worker that polishing liquid or cleaning liquid is attached to the outside of a processing chamber. [Solution] A chuck table 10 that holds a wafer W on a holding surface, a polishing mechanism 20 that poli...
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JP7436250B2 |
To provide a holding table newly configured in consideration of a problem caused in a holding table due to deterioration of an adhesive for fastening a porous plate.A holding table 50, which holds a work-piece (a wafer 10), comprises: a ...
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JP2024022852A |
An object of the present invention is to make it easier to replace a cylindrical filter in an apparatus equipped with a filter unit, and to downsize the apparatus. [Solution] A cylindrical filter unit 3 extending in the vertical directio...
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JP2024023654A |
The present invention provides a system for supplying fluid for a grinder/polisher, a grinder/polisher, and a method for controlling the fluid supply device. A method and apparatus for controlling a fluid supply device in a metallurgical...
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JP7433951B2 |
The invention refers to a filter arrangement for filtering dust-laden air (7) generated by a hand-guided power tool (1) having a pneumatic or electric motor, in particular a sander or a grinder, during operation of the power tool (1). Th...
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JP7432912B2 |
To achieve down-sizing of a polishing device while enabling easy replacement of a buff wheel in the polishing device.In a connection structure of a buff wheel 12 and a drive shaft 11 for rotating the buff wheel, the buff wheel has a coup...
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JP2024022107A |
An object of the present invention is to suppress spray containing processing debris from being ejected from a processing chamber. A first seal plate 135 and a second seal plate 136 are arranged above a passage port 132 and close the pas...
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JP2024021602A |
An object of the present invention is to provide a method for manufacturing a chip that can suppress the remaining of foreign matter attached to a protective tape. [Solution] A chip manufacturing method that divides a workpiece divided i...
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JP2024020719A |
An object of the present invention is to provide a processing device that can simplify the work for properly processing a workpiece and shorten the time required. [Solution] When it is determined that processing of a workpiece cannot be ...
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JP2024017100A |
[Problem] To efficiently clean the entire lower surface of a curved workpiece in a short time. [Solution] A cleaning device 1 that cleans a curved wafer (work) W by bringing a cleaning brush 71 into contact with the lower surface of the ...
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JP2024016941A |
An object of the present invention is to provide a grinding device which is highly economical by reducing the displacement of an exhaust means. [Solution] A chuck table 6, a moving means 55 for moving the chuck table 6 between a loading/...
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JP2024018207A |
An object of the present invention is to suppress the generation of dust when transporting a workpiece to a processing unit. [Solution] A transport unit 61 of a transport device 60 includes a battery 123 as a power source for each compon...
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JP2024019225A |
The present invention provides a wafer chuck cleaning method and apparatus for removing minute foreign matter from the surface of a wafer chuck. A wafer chuck cleaning device 1 includes a grindstone 3 for grinding a chuck surface 21 and ...
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JP2024017196A |
[Problem] To adjust extremely humid air to an appropriate humidity and then discharge it. [Solution] An electrical component, an air cooling unit that supplies a first gas to the electrical component to cool the electrical component, and...
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JP7428519B2 |
To provide a new technique that enables cutting liquid to be optimally supplied to a cutting blade.A cutting device comprises: a cutting unit 34 having a cutting blade 38; a holding table 8 including a holding surface for holding a work-...
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JP7427921B2 |
To provide a new method for determining a slicing processing condition of a semiconductor ingot.A determining method of a processing condition of slicing processing in which a semiconductor ingot is cut with a wire saw includes determini...
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JP7427326B2 |
An objective of the present invention is to correct a setting temperature to reduce the temperature change of a processing unit and a workpiece to supply water to a processing apparatus. A constant temperature water supply apparatus is c...
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JP2024503978A |
Provided herein are advanced substrate polishing methods that use machine learning artificial intelligence (AI) algorithms or software applications generated using AI to control one or more aspects of a polishing process. . An AI algorit...
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JP2024012279A |
The present disclosure relates to the use of water vapor for cleaning or preheating during chemical mechanical polishing. A water vapor generation device (410) includes a barrier (426) within a canister (420) that divides the canister (4...
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JP7422558B2 |
To provide a technology which suppresses adhesion of particles, which fly up when cleaning a suction surface of a chuck, to a substrate.A grinding system includes a grinding part which grinds a substrate, a conveying part which carries t...
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JP2024011575A |
An object of the present invention is to provide a structure for recovering valuable metals, etc. in a dental treatment waste liquid separator, which can recover valuable metals in the waste liquid with simple operations and in a short t...
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JP7418885B1 |
[Problem] It is possible to wrap a filter material around the rotating drum of a filtration unit and a backwash unit almost all the way around the circumference, and to obtain a filtration capacity twice that of the conventional wrapping...
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JP2024007152A |
The present invention provides a cleaning tool that can more appropriately remove debris from a processed area after processing. [Solution] It is used by being attached to a spindle configured to be able to attach an annular cutting blad...
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JP7416600B2 |
An issue is to provide a cutting apparatus capable of suppressing a leakage of mist from a processing chamber while suppressing the clogging of a blade cover. To solve the issue, the cutting apparatus includes: a spindle on which a cutti...
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JP2024006214A |
The present invention provides an automatic replacement device that can reliably hold a cutting blade even when the cutting blade is replaced repeatedly, and can maintain the ID of the cutting blade in a readable state. [Solution] An aut...
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JP2024006601A |
[Problem] To quickly recognize the size of a spinner table in a short time. [Solution] A grinding device (processing device) comprising a chuck table 10, a grinding unit (processing device) 20, a spinner cleaning device 30 for cleaning a...
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JP7413780B2 |
To provide a filter which is suitably held without providing a housing with a new configuration and without accompanying deformation with respect to the housing, and a work machine to/from which the filter can be attached/detached.A disc...
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JP7412542B2 |
A replacing apparatus is configured to replace a processing tool in a processing apparatus. The processing apparatus includes a holder configured to hold a processing target object, a processing mechanism to which the processing tool con...
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JP2024001508A |
The present invention provides a surface texture estimating device that can improve the durability of an acceleration sensor. [Solution] A surface texture estimating device 2 includes a sizing device 3 that measures the diameter of a gri...
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JP2024001496A |
[Problem] A cap capable of protecting a portion located at the opening of a spindle and a portion located around the opening of a housing, as well as suppressing air jetting along the distal end surface of the housing, and this cap. To p...
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JP2024001495A |
An object of the present invention is to provide a processing device that can prevent proper polishing from being inhibited by liquid adhering to a workpiece. [Solution] A processing device for processing a workpiece, which includes a ch...
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JP2024000701A |
An object of the present invention is to provide a method for removing foreign matter that can effectively remove foreign matter stuck in the outer periphery of a porous plate of a chuck table. A fluid is ejected from the outer periphery...
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JP2024000060A |
An object of the present invention is to provide a grinding device that can improve the efficiency of work related to maintenance of the grinding device and is advantageous in saving space. [Solution] A grinding device used when grinding...
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JP7408306B2 |
To enable suppression of generation of a defective wafer.A cutting device comprises: a chuck table; a cutting unit; a transfer unit that performs carrying or export of a wafer into the chuck table by sucking and holding a front surface s...
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JP2024000059A |
An object of the present invention is to efficiently and effectively eliminate scraps generated by processing a workpiece. The present invention includes a holding unit that holds a workpiece, a processing unit equipped with a processing...
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JP2024000251A |
An object of the present invention is to provide an offcut processing device that can collect and efficiently dispose of offcuts generated by processing a workpiece while reducing manual labor by an operator. [Solution] Offcuts discharge...
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JP2024000233A |
[Problem] To achieve both reduction in the number of dimples and wafer productivity. A chuck table that suction-holds a wafer, a grinding unit for grinding the wafer, a positioning unit having a positioning table, and a transport arm tha...
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JP2024500156A |
An extension handle system for a hand-held power tool, such as a right-angle grinder, consists of an extension shaft with a fork assembly attached to one end for pivotally mounting the power tool, and a power outlet for the tool and exte...
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JP7406980B2 |
An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. ...
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JP7406943B2 |
The present invention relates to a polishing device and a polishing method for polishing the back side of a substrate such as a wafer. The present invention further relates to a substrate processing device provided with the polishing dev...
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