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JP2023026126A |
To propose a novel technique for preventing particles from sticking to a surface of a workpiece.A workpiece processing method uses a cutting device that comprises a holding table 20 for holding a workpiece, and a cutting unit 5 having a ...
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JP7228750B2 |
A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc pla...
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JP7227754B2 |
To prevent ground chips from adhering to an innermost segment grindstone when grinding a work-piece using a grinding wheel in which positions of segment grindstones are changed in a radial direction.A grinding device 1 comprises: a wheel...
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JP7223922B2 |
To provide an elastic buff annular body (elastic buff) which makes a rubber base material, a special fiber base material and a special leather base material to be polished of an elastic base material and is composed of the elastic base m...
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JP7224244B2 |
To provide a flange mechanism configured so that suction of a foreign matter and the like into a space between a cutting blade and a flange part can be suppressed more than before.A flange mechanism 1 is configured so that a first suppor...
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JP2023023042A |
To adjust liquid to a prescribed temperature by a small-sized configuration which is simple and at operation cost.A constant temperature liquid supply device for supplying liquid with an adjusted temperature to a processing device provid...
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JP2023023578A |
To provide a cutting device which can efficiently clean a light emitting part and a light receiving part while inhibiting adhesion of sawdust to the light emitting part and the light receiving part.A cutting device includes a cutting bla...
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JP2023023057A |
To provide a processing apparatus and a method for manufacturing a processed product, which simplifies a configuration and prevents scattering of working liquid while reducing footprint.A processing apparatus includes processing tables 2...
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JP2023022522A |
To provide a processing device configured so as to prevent processing water from leaking and enable loads acting on processing/feeding means to reduce.A processing device includes holding means 4 that holds a work-piece, processing means...
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JP2023022523A |
To provide a cutting device that can properly cool a cutting blade and a work-piece, while removing powder dust scattering from a cut site.In a cutting device that cuts a wafer W, cutting means 4 comprises: a rotating shaft 44; a cutting...
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JP2023505781A |
A cleaning apparatus for vacuum pedestals and a method for cleaning pedestals used in semiconductor device fabrication are described. The device has a baseplate, a collar attached to the baseplate, a cap disposed on the collar, and a sha...
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JP2023021191A |
To provide a novel technique for setting cleaning conditions in a workpiece cleaning mechanism.There is provided a cleaning mechanism including: a holding table having a holding surface to hold a workpiece; a cleaning nozzle facing the h...
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JP2023021282A |
To provide a compact grinding machine which is suitable for robot-supported grinding, and enables comparatively accurate control of processing force during grinding.A grinding machine has: a housing; a motor arranged inside the housing; ...
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JP2023019355A |
To provide a processing device which can suppress fluctuation of a supply amount of a working fluid.A processing device processes a workpiece, and includes a holding table for holding the workpiece, processing units 20A, 20B which proces...
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JP2023018318A |
To prevent leakage of mist-like grinding water from a processing chamber without using a bellows cover.A processing device includes: a chuck table having a holding surface which suctions and holds a workpiece; a processing unit which has...
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JP2023018559A |
To provide a cutting device which can inhibit occurrence of dew condensation while enabling supply of a low temperature cutting fluid.A cutting device 1 includes: a holding table which holds a workpiece; a spindle to which a cutting blad...
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JP7218731B2 |
The present invention provides a cleaning device for a device which comprises rotatable upper and lower surface plates and a slurry feeding nozzle and which laps a sandwiched workpiece by rotating the upper and lower surface plates while...
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JP2023016165A |
To provide an electric tool having a new structure in which a power distribution to a motor is permitted only in a state where two kinds of accessories are attached thereto, which is improved in degree of freedom of design of the electri...
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JP7216601B2 |
To continuously measure a thickness of a wafer during polishing working.Pressure of a center portion of a first pipe 62 becomes negative with jetting of air (shown by an arrow A) through an annular air jetting port 66. This causes air to...
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JP2023015782A |
To maintain a high processing quality while suppressing movement of processing waste toward a back surface of a substrate.A processing device includes: a holding table 10 having a holding surface 11 for holding a back-surface side of a s...
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JP2023015609A |
To prevent both chipping of a chip and adhesion of cutting waste to the chip.After a second cutting step, a washing step of washing the upper surface of a wafer 100 and a second cutting groove is performed. Thus, it is possible to preven...
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JP2023014896A |
To wash an upper surface of a support plate around a holding table by utilizing cooling water.A holding table 6 includes: a holding portion 610 for holding a workpiece; a frame body 620 having a recessed portion 621 for accommodating the...
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JP2023013913A |
To provide a hook bolt polishing device which can polish a hook bolt in a more proper manner and inhibit scattering of powder dust occurring during polishing.A polishing device 10 includes a cylindrical rotating body 11 and a cover. The ...
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JP2023013331A |
To provide a slate-based tile polishing device which can polish a slate-based tile more properly and yet inhibit scattering of powder dust occurring during polishing.A polishing device includes: a rotary brush which polishes a surface la...
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JP2023012425A |
To provide a method for cutting semiconductor materials that prevents dimensional accuracy of the package after cutting from being reduced due to shrinkage caused by cooling of the workpiece due to spraying of cutting fluid during blade ...
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JP2023012423A |
To provide a technique for enhancing the removal efficiency of particles with a cleaning brush.A cleaning brush cleans a chucking surface of a chuck. The cleaning brush includes a brush base linearly extending radially to an outside in a...
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JP2023011176A |
To provide a spindle unit capable of preventing residence of processing fluid including processed waste, in a gap between a cover and a spindle.A spindle unit 6 comprises: a casing 62 which surrounds a spindle 60 whose axial direction is...
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JP7210444B2 |
Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.
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JP2023501839A |
A connection assembly (10) for connecting a tool head (202) and a further machine module (204) of a machine tool (200), the connection assemblies (10) being mutually aligned along a longitudinal axis (12). at least two subsequent connect...
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JP2023009430A |
To provide a disc grinder including a cover which allows a polishing disc to reach a narrow portion and can protect a hand of a worker.A typical structure of a disc grinder 100 according to the invention includes: a handle 120 in which a...
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JP2023010304A |
To simplify a device configuration, reduce footprint, and reduce a size of a storage space for segmentalized workpieces.A processing apparatus includes processing tables 2A and 2B for holding a sealed substrate W, a first holding mechani...
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JP2023010274A |
To provide a new object polishing device which is suitable for non-metal objects, and to provide an object polishing method and an object manufacturing method using the object polishing device.An object polishing device 1 rotates multipl...
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JP2023010121A |
To prevent sticking of a stain to a frame holding part for holding a frame used for machining a workpiece.A stain sticking prevention cover is fitted to a frame holding part of a machining device provided with a chuck table having a hold...
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JP2023007512A |
To provide a substrate processing device and a substrate processing method capable of improving substrate cleaning efficiency.A substrate processing device includes a polishing unit for polishing a substrate, a cleaning unit for cleaning...
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JP2023007513A |
To provide a substrate processing device and a substrate processing method capable of improving substrate cleaning efficiency.A substrate processing device includes a polishing unit for polishing a substrate, a plurality of cleaning line...
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JP2023008342A |
To provide a processing liquid tank capable of uniformly dispersing a processing liquid, for improving processing accuracy and processing efficiency.A processing liquid tank 1 has: a cylindrical peripheral wall part 2; a bottom 3 forming...
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JP2023008104A |
To ensure that processed waste does not remain on a washed holding surface, in a processing device that holds a plate-like workpiece with warpage on the holding surface and grinds it with a grinding stone.A chuck table 3 has a holding su...
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JP2023006220A |
To provide a liquid supply device and a polishing device, which can secure a space for installing apparatuses other than a first nozzle and a second nozzle on a polishing table and can retract at least one of the first nozzle and the sec...
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JP2023501118A |
A method of controlling operation of a dust collector comprising: obtaining (S1) sensor data (235) regarding airflow (240) entering the dust collector; Determining whether it is operating (S2), and if the dust collector is operating in t...
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JP2023006991A |
To provide a new nozzle adjustment jig that is able to adjust the position of a cutting-water nozzle without requiring a measuring device such as a scale.A nozzle adjustment jig 90 is used in a cutting device including a pair of cutting-...
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JP7205925B2 |
To provide a dust collection circulation device which prevents bubbles generated when passing through a filter from reaching a dust collection pump.In a dust collection circulation device S, a housing 31 has a partition plate 44 for part...
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JP7203712B2 |
Provided are a cutting device in which a blade and a working fluid are sufficiently in contact when the blade is rotated and a manufacturing method of a cut product. The cutting device includes a cutting table, a processing liquid supply...
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JP7202152B2 |
To provide a grinding device which prevents grinding dusts produced by grinding processing from attaching to a lateral plate or a top board of a processing chamber.A grinding device 1 provided with a first processing chamber 30a in which...
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JP2023002933A |
To clean a wider range of a processing chamber cover than that of fluid jet from a nozzle.A processing device includes: a chuck table which holds a workpiece; a processing unit which has spindles and processes the workpiece suctioned and...
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JP2023002270A |
To provide processing apparatus which is able to reduce an operator's burden caused by preparation and connection of pipes in washing a cooling water passage.Processing apparatus includes: a chuck table for holding a workpiece; a spindle...
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JP2023001663A |
To improve working efficiency in processing work in a processing device and method, as well as a robot.A processing device comprises: a cutter; a cutter driving device that drives to rotate the cutter with a rotation shaft; a cutter movi...
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JP2023000610A |
To suppress adhesion of a processed waste to an exposed holding surface.In a first grinding device 1 including a first chuck table 21 for sucking and holding a workpiece on a suction surface 610, and a grinding mechanism 3 for grinding t...
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JP2023000348A |
To enable grinding chips generated in metalworking to be collected and also enable a dust collector to collect dust.Provided is a dust collection attachment 1 for metalworking that can be attached to and detached from a grinder 50 having...
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JP2023000803A |
To provide a processing device which achieves high efficiency in cooling of a motor driver compared to conventional processing devices and enables reduction of a possibility of a short circuit which may be caused in a circuit board of th...
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JP2022190859A |
To remove polishing waste generated by polishing a workpiece and adhering to an outer peripheral part of a chuck table.A polishing device polishes a workpiece and includes: a chuck table which has a holding surface and suctions and holds...
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