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WO/1986/004855A1 |
Displaceable protective cover for handtools using rotary, disc-shaped tools. The protective cover comprises two halves (7, 8) which completely enclose the tool (3) when in their rest position. The cover-halves (7, 8) can be rotated to an...
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WO/1986/001461A1 |
An abrasive surfacing machine (11) having a surfacing head which utilizes a large disk (81) with a fibrous web abrasive medium (85). The disk is sized to be at least as large in diameter as the width of the underlying workpiece conveyor ...
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WO/1985/001004A1 |
A housing (10) for a vacuum sanding device consists of a ring or plate spaced above a backup pad to define a chamber, the periphery of the housing is spaced slightly above the backup pad for the whole periphery of the housing and the out...
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WO/1984/003467A1 |
The device comprises a carrier frame (1, 2) secured to the vehicle in place of the braking means. The carrier frame (1, 2) comprises two supports (5) which are displaceable individually and perpendicularly to the disc (13) to be reworked...
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WO/1981/002130A1 |
An adjustable guard for splintering machine tools, preferably for lathes and circular grinders, the said guard comprising a transparent shield (6) and moving along guide bars (1) parallel to the lathe spindle. The object of the invention...
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WO/1979/000192A1 |
A method and an arrangement for cleaning cutting fluid used for metal machining. The cutting fluid is withdrawn from the collecting tank (1) at a metal cutting machine by means of vacuum and conveyed to a central cleaning plant by way of...
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JP7465986B2 |
This processing device for processing a substrate comprises: a polishing mechanism which is provided with an annular grindstone for processing a substrate held by a holding mechanism; a polishing solution supply mechanism which supplies ...
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JP7466006B2 |
Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each c...
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JP7465579B2 |
The present invention relates to a tool-cooling mechanism, which includes a grinding tool. The grinding tool is provided with a converging disc, and the converging disc rotates with the grinding tool to draw external cooling water into t...
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JP7464327B2 |
A nano-layer (41) lubricated diamond grinding wheel (20) grinding device based on a shock wave cavitation effect. The grinding device comprises a control system, an acceleration module, a shock wave speedup module, a machining module and...
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JP7464088B2 |
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JP7464575B2 |
This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/...
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JP2024046843A |
An object of the present invention is to more efficiently supply grinding water to an arc-shaped area to be ground. [Solution] The grinding unit has a spindle with a longitudinal portion arranged along a first direction, a grinding wheel...
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JP7461118B2 |
A processing method for a wafer includes a thermocompression-bonding sheet arrangement step of arranging, on a front side of the wafer, a thermocompression-bonding sheet of a size sufficient to cover the wafer, an integration step of pre...
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JP2024046448A |
An object of the present invention is to provide a grinding device that can reliably prevent grinding debris from adhering to a contact shaft while saving water. [Solution] A linear gauge 31 provided in a grinding device 1 detects a cont...
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JP2024044839A |
[Problem] To improve work efficiency. In a belt sander 10, a reinforcing part 90 is provided in a side housing 24, and the reinforcing part 90 protrudes from the side housing 24 toward one side in the axial direction of a motor pulley 54...
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JP7460386B2 |
A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step ...
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JP7458760B2 |
A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece b...
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JP7458807B2 |
To provide a cutting device which can accurately detect breakage of a cutting blade during cutting.A cutting device 1 includes a cutting blade 21 which cuts a workpiece 200 by rotation, a holding table 10 which holds the workpiece 200, a...
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JP2024043122A |
[Objective] To provide a device capable of draining treated water mixed with Si scraps from a treatment equipment and recovering Si scraps in the waste water from the treatment equipment without stopping the treatment equipment. [Structu...
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JP2024042530A |
An object of the present invention is to provide a grinding tool that can maintain good visibility of the grinding part while removing chips during grinding. A grinding tool 1 of the present invention includes a main body 11 containing a...
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JP7457637B2 |
To provide a tailstock device capable of inhibiting the formation of rust, and a machine tool.A tailstock device 30 comprises: a tailstock shaft part 32 that has a tailstock center 31 for supporting a workpiece W between itself and a spi...
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JP7457521B2 |
To easily switch an injection direction of processing water while suppressing enlargement of a processing device.A direction of water injected from an injection port 73 can be switched by controlling the opening/closing state of an openi...
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JP7454920B2 |
To provide a processing device to which a cutting blade is attached, which enables a distance between spindles to be shortened without requiring troublesome work.A processing device 100 comprises a spindle housing 11, a mount, a cutting ...
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JP7454312B1 |
An object of the present invention is to provide a floating object recovery device that can efficiently recover floating objects such as scum and oil floating on the liquid surface of a coolant. [Solution] A floating object recovery devi...
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JP2024039285A |
[Objective] To provide a device capable of draining treated water mixed with Si scraps from a treatment equipment and recovering Si scraps in the waste water from the treatment equipment without stopping the treatment equipment. [Structu...
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JP7452960B2 |
To provide a processing device equipped with a cleaning unit, which can sufficiently clean dirt adhering to a lower surface of a work-piece.Carrying-out means 5 comprises a carrying pad 50 that can move in horizontal and vertical directi...
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JP7451948B2 |
To provide a processing quality prediction system that can predict a state of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP7451949B2 |
To provide a processing quality prediction system that can predict a depth of an affected layer generated in a work-piece, with higher accuracy.A processing quality prediction system 1 comprises: a grinder main body 11 that performs grin...
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JP7451324B2 |
A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding ...
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JP7450385B2 |
To provide a cleaning device capable of moving a cleaning member from a retracted position to a cleaning position, in which the footprint of a cleaning tank can be reduced.A cleaning device 16 includes: a cleaning tank 41 defining a clea...
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JP2024036403A |
An object of the present invention is to provide a magnetic separator that is unlikely to cause a decrease in magnetic sludge recovery performance or to cause malfunctions in the device even if the content of magnetic sludge in a liquid ...
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JP7450700B2 |
A processing apparatus includes a chuck configured to hold a substrate; a moving unit to which a processing tool configured to process the substrate is mounted; a sprinkler configured to spray a cleaning liquid configured to clean the mo...
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JP2024033112A |
An object of the present invention is to provide a cutting device that can reduce the probability that a liquid containing cutting waste will drip from a partition plate onto a workpiece held by a holding table. [Solution] When moving a ...
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JP2024032712A |
An object of the present invention is to enable good cutting of a wafer. A crack propagation device for propagating a crack inside a wafer, comprising a crack propagation means for changing the degree of propagation of the crack by contr...
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JP2024032131A |
The present invention provides a cutting device that can prevent cutting debris from adhering to a device and prevent electrodes from oxidizing and rusting. [Solution] A chuck table that holds a workpiece in which a plurality of devices ...
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JP7446668B2 |
To provide a processing waste liquid treatment apparatus which can reduce a frequency of reproduction processing of an ion exchange resin.A processing waste liquid treatment apparatus that is connected to a processing device for processi...
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JP7446677B2 |
In general, provided is a processing apparatus that monitors the pressure in an exhaust duct of the processing apparatus and does not issue an alarm about a temporary decrease in the magnitude of negative pressure in the exhaust duct. Th...
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JP7446683B2 |
The present invention aims to provide a cutting apparatus which is able to definitely replace a cutting blade and prevent the occurrence of a processing fault. The cutting apparatus comprises: a cutting means which has a rotatable cuttin...
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JP3245967U |
An object of the present invention is to provide a construction material polishing machine that is easy to operate and improves the dust removal effect. A construction material polishing machine includes a base plate 1 and further has a ...
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JP7446084B2 |
To provide a technique that can suppress chips from being accumulated.A grinding device comprises: a chuck that holds a substrate; a grinding unit which a grinding tool for grinding the substrate is attached; a housing in which a grindin...
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JP2024030826A |
An object of the present invention is to provide a cutting device capable of suppressing the movement of a sliding door from being hindered by the accumulation of unnecessary materials scattered during cutting of an object to be cut. [So...
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JP7444582B2 |
To reduce costs by improving the versatility of holding means of an angular bearing, to shorten replacement time of a machined workpiece and an unmachined workpiece, and to prevent rolling during carrying.A grinding device 1 for grinding...
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JP7444633B2 |
To quickly wash the upper surface of a wafer.A processing device 1 includes a chuck table 2 that holds a workpiece 15 on a holding surface 200, processing means 3 that processes the workpiece 15 held on the holding surface 200, and a fir...
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JP7444632B2 |
To easily adjust a water reception point of processing water injected from a water nozzle.A control part adjusts the amount of water that flows in first to third inclined pipes 201-203 by controlling first to third flow rate adjustment p...
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JP2024029312A |
An object of the present invention is to reduce the amount of dust remaining on a support table of a dressing unit. [Solution] A polishing device that performs dry polishing on a workpiece, which includes a holding table that holds the w...
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JP2024029658A |
[Problem] A method for processing a workpiece comprising a substrate and a protective member affixed to the front side of the substrate, which can prevent the back side of the substrate from becoming uneven due to grinding of the back si...
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JP7442314B2 |
A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid...
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JP2024027260A |
The present invention provides a cutting device that prevents cutting fluid containing cutting waste from adhering to a workpiece. [Solution] A holding table (12) that holds a workpiece (1) on a holding surface (13), a rotatable cutting ...
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JP2024027610A |
An object of the present invention is to provide a grinding device that can perform grinding according to the conditions of a grinding wheel. [Solution] A grinding device for grinding a workpiece, which includes a chuck table that holds ...
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