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WO/2024/069992A1 |
Provided are: an adhesive composition that is highly bio-based and has suitable adhesion and high thermal resistance; and a production method for the same. This adhesive composition comprises: a block copolymer (X) that includes a polyme...
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WO/2024/048055A1 |
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an ...
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WO/2024/040582A1 |
Conductive adhesives include a pressure sensitive adhesive composition, electrically conductive particles dispersed within the pressure sensitive adhesive composition, and at least one nanoparticle additive dispersed within the pressure ...
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WO/2024/040583A1 |
Conductive adhesives include a pressure sensitive adhesive matrix and electrically conductive particles. The matrix includes at least one non-linear block copolymer with aromatic end blocks and aliphatic elastomeric blocks, at least one ...
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WO/2024/028298A1 |
The present invention relates to a hot melt adhesive composition for secured paper packaging which comprises a plasticizer blend, the use of said hot melt adhesive composition in secure paper packaging as well as an article produced with...
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WO/2024/023646A1 |
High-performance, hot melt pressure-sensitive adhesives ("hmPSAs") including 40 weight percent ("wt.%") to 60 wt.% of a block copolymer comprising polystyrene and polyisoprene, 30 wt.% to 60 wt.% of a first tackifying resin, 1 wt.% to 15...
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WO/2024/013345A1 |
The invention relates to an adhesive composition comprising an elastomer and tackifying resins wherein one of said tackifying resins comprises a liquid resin prepared from a liquified waste polymer, being preferably a pyrolysis oil via p...
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WO/2024/007852A1 |
Disclosed in the present invention are an optically clear pressure sensitive adhesive (OCA) and a preparation method therefor. The optical pressure-sensitive adhesive is composed of one or more block copolymers. In the method, reversible...
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WO/2023/248007A1 |
A counter tapered diblock copolymer composition comprises a monovinyl aromatic monomer A polymerized with a conjugated diene monomer B to form the structure A- [A/B], where the [A/B] block is a copolymer of the A and B monomers that is c...
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WO/2023/242201A1 |
The present invention relates to a hot melt adhesive composition comprising: − at least one block copolymer (P1) comprising : o a polymer block (A) containing a structural unit derived from an isoprenoid conjugated diene, o a non-elast...
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WO/2023/242208A1 |
The present invention relates to a hot melt pressure-sensitive adhesive composition comprising: − at least 20% by weight of one or more block copolymer(s) (P1) comprising : - a polymer block (A) containing a structural unit derived fro...
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WO/2023/234054A1 |
Provided is an adhesive agent composition which contains an alkyl radical scavenger and a block copolymer composition containing a specific block copolymer A1 represented by general formula (1) and a specific block copolymer A2 represent...
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WO/2023/234063A1 |
Provided is an adhesive composition capable of forming an adhesive having high heat resistance while maintaining strong adhesive force with a configuration having a composition containing a styrenic block copolymer capable of achieving s...
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WO/2023/234208A1 |
Provided is an adhesive sheet which can exhibit sufficient adhesion to a rough polar surface and to a non-polar surface. Provided is an adhesive sheet having an adhesive layer. The adhesive layer contains a styrene-based block copolymer ...
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WO/2023/226133A1 |
Disclosed in the present invention are an ultralow-hardness low-temperature activated thermoplastic polyurethane hot melt adhesive film and a preparation method therefor. The hot melt adhesive film comprises 30-40 parts of a hot melt adh...
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WO/2023/230559A1 |
Cell engineering, soft robotics and wearable electronics often desire soft materials that are easy to deform, self-heal, and relax stress. Hydrogel, a type of hydrophilic networks, which can be made responsive to environmental stimuli, a...
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WO/2023/218010A1 |
The present invention relates to a pressure-sensitive adhesive composition comprising at least one polymer, at least one liquid resin comprising an oligoester composition as described herein, and at least one further plasticizer, wherein...
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WO/2023/210453A1 |
The present invention provides a hot-melt adhesive for positioning an absorbent article, the hot-melt adhesive containing a styrene-based block copolymer (A), a tackifying resin (B), a wax (C), and a liquid plasticizer (D), wherein: the ...
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WO/2023/195539A1 |
The present invention provides a hot melt composition from which an expandable member having excellent extensibility, expansion/contraction recovery, and stress maintenance during extension at a high temperature can be formed, and which ...
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WO/2023/186793A1 |
The invention relates to a hot melt adhesive composition comprising from 5 to 35 % by weight of at least one styrene block polymeric component, from 40 to 65 % by weight of at least one tackifying resin, from 15 to 40 % by weight of at l...
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WO/2023/176833A1 |
The purpose of the present invention is to provide an adhesive agent composition capable of forming and adhesive agent layer that exhibits low surface resistivity and has excellent antistatic performance. An adhesive agent composition ...
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WO/2023/176788A1 |
[Problem] To provide a thermoplastic resin composition having excellent flexibility and excellent mechanical strength with a good balance therebetween. [Solution] A thermoplastic resin composition comprising: 100 parts by mass of a therm...
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WO/2023/176834A1 |
The purpose of the present invention is to provide an adhesive agent composition capable of forming and adhesive agent layer that exhibits low surface resistivity and has excellent antistatic performance. An adhesive agent composition ...
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WO/2023/161761A1 |
The invention relates to hot melt adhesive composition comprising 20 to 70 wt% of a polymer, 1 to 15 wt% of an additive comprising a hydrocarbon wax and, in addition to the hydrocarbon wax, an alcohol and/or a carboxylic acid, 20 to 70 w...
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WO/2023/158042A1 |
The present invention relates to a reusable nail tip, and specifically, to a nail tip that can be easily attached to a nail and used for a certain period of time and then removed, and used again. The nail tip according to the present inv...
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WO/2023/155395A1 |
The present invention relates to a pre-applied polymer waterproofing sheet and a preparation method therefor. The pre-applied polymer waterproofing sheet comprises a base material layer, an adhesive layer and a protective coating which a...
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WO/2023/130609A1 |
The present disclosure relates to the technical field of pressure-sensitive adhesives, in particular to a water-resistant and sweat-resistant hot-melt pressure-sensitive adhesive, and a preparation method therefor and the use thereof. Th...
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WO/2023/130722A1 |
The present invention relates to a hot melt adhesive film for bonding a metal and PVC, and a preparation method therefor. The hot melt adhesive film comprises a first adhesive layer for bonding with PVC, a second adhesive layer for bondi...
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WO/2023/126722A1 |
Adhesive compositions including 20 wt.% to 80 wt.% of a polymer selected from the group consisting of a radial styrene-isoprene block copolymer, a radial styrene-butadiene block copolymer, and combinations thereof, and 3 wt.% to 80 wt.% ...
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WO/2023/127235A1 |
The purpose of the present invention is to provide: a skin-patch thermometer which is not susceptible to the ambient temperature and has properties that are suitable for attachment to the skin; and a temperature indicating material-conta...
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WO/2023/126997A1 |
[Problem] To provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which, even when adopted in communication devices for conducting high-speed communication, is less apt to reduce the co...
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WO/2023/119752A1 |
An adhesive sheet according to the present invention has a substrate, and an adhesive layer laminated on at least one surface of the substrate, the adhesive layer containing a butyl rubber as an active component, the ratio of the value G...
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WO/2023/110326A1 |
The present invention relates to containers with a handle (1), said containers comprising: a container (2); a handle (3); and an adhesive layer (4), which is arranged between the container (2) and the handle (3) and bonds the plastic con...
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WO/2023/113971A1 |
Hot melt adhesives may comprise linear alpha olefins (LAOs) or LAO-derived compounds as an at least partial replacement for paraffinic white oil diluents. Such adhesive compositions may comprise an ethylenically unsaturated polymer or co...
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WO/2023/104726A1 |
The present invention relates to hot melt adhesive composition comprising: a) from 22% to 60% by weight of at least one styrene block copolymer (A) (designated as "SBC (A)") comprising:. at least one linear styrene block copolymer (A1); ...
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WO/2023/093168A1 |
Provided in the present invention are a base membrane of a swelling adhesive tape for a lithium battery and a swelling adhesive tape for a lithium battery. The base membrane has a three-dimensional network structure, and the three-dimens...
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WO/2023/095816A1 |
To provide a hot melt adhesive having excellent coatability and adhesiveness to a member of a disposable product, excellent storage stability, and both having high natural resin use ratio and low odor; and a disposable product obtained b...
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WO/2023/065311A1 |
Provided is a hot melt adhesive composition, comprising: (a) from 30 to 45% by weight of at least one thermoplastic block copolymer; (b) from 0.1 to 5% by weight of at least one wax having a melting point of no less than 100℃; (c) from...
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WO/2023/069970A1 |
A disposable absorbent article is described. The disposable absorbent article includes a topsheet forming at least a portion of a wearer-facing surface of the absorbent article; a backsheet forming at least a portion of a garment-facing ...
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WO/2023/061135A1 |
The present application relates to a binder compound of formula (I) and a preparation method therefor, and an electrode plate containing same. In formula (I), R1, R2 and R3 each independently represent an unsubstituted or substituted lin...
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WO/2023/057987A1 |
The multilayer pressure sensitive adhesive assembly includes a polymeric foam layer and a first pressure sensitive adhesive layer. The polymeric foam includes a plurality of activated carbon particles. The first pressure sensitive adhesi...
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WO/2023/054483A1 |
The present invention provides: an adhesive tape in which anchoring fractures are suppressed; and a method for manufacturing the same. An adhesive tape according to an embodiment of the present invention includes, in the following order:...
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WO/2023/054482A1 |
The present invention provides: an adhesive composition which has sufficient initial adhesive force and is capable of achieving a good balance between resealability and easy openability; and an adhesive tape which uses this adhesive comp...
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WO/2023/052864A1 |
A crosslinkable composition comprises components: (a) at least one polymer comprising isobutylene monomer units; and (b) at least one star polymer represented by the formula SiRn(OSi(R)2-PIB-T)4-n. Each R independently represents a hydro...
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WO/2023/048013A1 |
The purpose of the present invention is to provide: an adhesive sheet that has a low dielectric loss tangent for high-frequency bands and does not readily generate bubbles at an interface with an adherend, even at high temperatures; a la...
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WO/2023/033176A1 |
The purpose of the present invention is to provide an adhesive tape for semiconductor device manufacturing, which is excellent in chip component delamination performance, and which is capable of preventing adhesive residue from remaining...
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WO/2023/022193A1 |
To provide a hot melt adhesive having excellent low temperature coatability and creep resistance, a good balance between tack and cohesive force, and being able to bond and keep an elastic material to a non-woven fabric or a plastic film...
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WO/2023/019562A1 |
It provides embodiments of a reactive hot melt adhesive. In embodiments, the reactive hot melt adhesive may comprise at least one isocyanate compound, at least one polyester polyol, at least one polyether polyol, and at least one thermop...
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WO/2023/008183A1 |
Provided is an adhesive composition that: includes (A) an acid-modified styrene elastomer and (B) an alicyclic epoxy resin that includes a structure formed by epoxidation of the unsaturated bond of a cyclic olefin structure; but does not...
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WO/2023/288259A1 |
The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range. The invention features a ...
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