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Matches 551 - 600 out of 14,377

Document Document Title
WO/2008/148580A2
The present invention relates to a vertical system for the plating treatment of a work piece (W), the said system including at least two treatment modules (100) and at least one transport device for conveying at least one work piece (W) ...  
WO/2008/150541A1
An electrochlorination and electrochemical system for the on-site generation and treatment of municipal water supplies and other reservoirs of water, by using a custom mixed oxidant and mixed reductant generating system for the enhanced ...  
WO/2006/065580A3
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (107). The multi-layered wafer support apparatus includes a bottom film layer (201) and a top film layer (301). The bot...  
WO/2008/137951A2
A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point...  
WO/2008/131790A1
The invention relates to the electrical contacting of treatment good (1) that is to be electroplated using e.g. continuous pass equipment, immersion bath equipment, so called cup-platers or fountain-platers and the like. The electrical c...  
WO/2008/035199A3
The invention relates to an equipment for the surface treatment of parts, that comprises a plurality of treatment vats (4) arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be...  
WO/2008/128734A1
The invention relates to a drum, comprising - a wall, wherein at least the inside of the wall is provided with a surface of insulating material, - an opening, defined by wall segments, radially spaced from one another with respect to a c...  
WO/2008/013783A3
An electrolyzer cell (100) is disclosed which includes a cathode (104) to reduce an oxygen-containing molecule, such as H2O, CO2, or a combination thereof, to produce an oxygen ion and a fuel molecule, such as H2, CO, or a combination th...  
WO/2008/123930A1
A method of depositing materials on a non-planar surface is disclosed. The method is effectuated by rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneou...  
WO/2008/117403A1
An insulating spacer (30) comprising a plurality of unit spacers (40), and a flexible coupling portion (41) for coupling the unit spacers (40) along the axial direction thereof wherein the unit spacer (40) comprises a plurality of annula...  
WO/2007/111729A3
An apparatus and a method with fluid flow assist elements for electrochemical mechanical processing is provided in this invention. In one embodiment, the apparatus includes a first conductive layer having an upper surface adapted to cont...  
WO/2005/076977A3
The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circul...  
WO/2008/080515A3
The invention relates to a set for creating a process reactor for forming metallic layers on at least one substrate, the layers being formed by the precipitation of metal ions contained in a fluid onto the substrates. Said set essentiall...  
WO/2008/108341A1
[PROBLEMS] To provide a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retard...  
WO/2008/101740A1
To achieve uniform electroplating of a metal on a work piece a device is provided, which comprises at least one anode and a diaphragm comprising a fill made of packing material. The diaphragm is located in the device such that electric f...  
WO/2008/096235A1
The apparatus for electrophoretic repainting of metal objects, in particular lids for containers for food use, comprises a tank (30) containing an electrophoretic bath; an electrode, immersed in the eletrophoretic bath, a conveyor line (...  
WO/2008/097218A1
Clip devices contemplated herein comprise a metal-containing base, wherein the base comprises a lower clip body and an upper clip body, and wherein the lower clip body further comprises at least two sets of electrically conducting wire s...  
WO/2007/118875A3
The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anod...  
WO/2008/066571A3
A plated substrate comprises a plating layer disposed outwardly from a substrate. The substrate comprises a substrate material, where the substrate material comprises a metal. The plating layer comprises a plating material and blocking p...  
WO/2008/030474A3
The present invention comprises an automated apparatus capable of spray depositing polyelectrolytes via the LbL mechanism with minimal or no human interaction. In certain embodiments, the apparatus sprays atomized polyelectrolytes onto a...  
WO/2008/081504A1
A surface treatment apparatus having, arranged in a single device body (100), a treatment container (11), a vertical rotating shaft (12), a mounting/dismounting mechanism, a receiving tank (15), a cover body (16), tanks (21), surface tre...  
WO/2008/081490A1
A description is given of a gripping device and cathode electrification of a dielectric substratum for making printed circuit boards, wherein a number of gripping devices are mounted on a chain conveyor that guides the substratum, held b...  
WO/2008/081536A1
[PROBLEMS] To efficiently derive accurate operating condition parameters most suitable for plating operation. [MEANS FOR SOLVING PROBLEMS] First, preliminary test operation (S12) is carried out in current passage condition. Taking result...  
WO/2008/014987A3
The invention relates to a method for deposition of chromium layers as hard-chrome plating for protection against wear or corrosion and/or for decorative purposes and also an electroplating bath with which chromium layers of this type ca...  
WO/2008/080515A2
The invention relates to a set for creating a process reactor for forming metallic layers on at least one substrate, the layers being formed by the precipitation of metal ions contained in a fluid onto the substrates. Said set essentiall...  
WO/2008/071239A1
The invention relates to the wet chemical or electrolytic treatment of planar good, i.e. a wafer, that is, according to the state of the art, treated by the aid of technically complex frames or grippers inside treatment chambers. Especia...  
WO/2008/072897A1
A device for fabricating a flexible film is provided. The device includes a serving unit providing an insulation film; a main processing unit including at least one of a dust removing unit, an etching unit, a neutralizing unit, a couplin...  
WO/2008/065069A1
The invention relates to a device for the electroplating of a surface of a substrate (7) with a structured or fully flat base layer (9), which device comprises at least one electrolytic bath (3) with at least one rotatably mounted roller...  
WO/2008/066571A2
A plated substrate comprises a plating layer disposed outwardly from a substrate. The substrate comprises a substrate material, where the substrate material comprises a metal. The plating layer comprises a plating material and blocking p...  
WO/2008/061641A1
The invention relates to a workpiece carrier (110) for conveying a workpiece to be painted, particularly a vehicle body, through at least one electrophoretic painting bath and by means of at least one conveyance device following the elec...  
WO/2008/064159A1
An electrolyte electrolyzer adapted to create hydrogen and oxygen from electrolyte fluid at or near atmospheric pressure. The electrolyzer is comprised in a preferred form of a plurality of cells which collectively create oxygen and hydr...  
WO/2007/118810A3
The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least ...  
WO2008016541B1
A copper electroplating bath is provided with a constant source of copper ions by monitoring the copper concentration in the bath. Copper metal is dissolved with sulfuric acid in the separate system which comprises one or more reactors t...  
WO/2008/010090A3
A device which is suitable for electrochemically processing an object comprises at least an electrolyte-containing chamber, means for supporting the object to be processed in the chamber, a counter electrode disposed in the chamber as we...  
WO/2007/014778A3
The invention relates to a contacting device for a galvanization apparatus (11), comprising contacting rollers (20) with a continuous rigid external face (26, 27) which is joined to a jacket section (22). The jacket section (22) is provi...  
WO/2008/047509A1
This invention provides a plating apparatus which can apply at a high speed a magnetic alloy plating having a uniform thickness and a homogeneous composition on the surface of a shaft-shaped member. A plating apparatus (1) has a plating ...  
WO/2008/015158A3
The invention relates to a method of producing corrosion-resistant and workable sheet metal consisting of uncoated steel sheets (1, 1'), comprising the following steps: - placing the steel sheets (1, 1') in abutting relationship, - weldi...  
WO/2008/034739A1
The invention relates to a method for electrochemically coating or stripping the coating from components (1). In said method, the component (1) acts as an electrode and an electric field is established between the component (1) and a cou...  
WO/2008/035199A2
The invention relates to an equipment for the surface treatment of parts, that comprises a plurality of treatment vats (4) arranged in series and comprising rotating drums (2) provided with means for temporarily attaching the parts to be...  
WO/2008/027761A2
Methods and apparatus are provided for selective modification of the surface of a workpiece (100). In some embodiments, using a workpiece-surface-influencing device (120) that preferentially contacts the top surface (130) of the workpiec...  
WO/2008/023974A1
The present invention relates to a device (1, 501) for treating a plate-shaped substrate (21) in a bath (7, 7' ' ) comprising a bath (7, 7' ' ), a process container (55, 503) for at least one substrate (21), transfer means (32,33,36,37,4...  
WO/2006/048569A3
The invention relates to a holder for parts to be subjected to a surface treatment, for a vehicle comprising a chassis (57). Said holder comprises means (49, 65) for fixing parts in translation to the holder, at least one means (49, 65) ...  
WO/2008/018471A1
Provided are a partial plating method capable of plating a contact portion or the like of a connector terminal with hard gold, a laser plating apparatus capable of partially plating a small area on an object of plating in a highly positi...  
WO/2008/014987A2
The invention relates to a method for deposition of chromium layers as hard-chrome plating for protection against wear or corrosion and/or for decorative purposes and also an electroplating bath with which chromium layers of this type ca...  
WO/2008/015158A2
The invention relates to a method of producing corrosion-resistant and workable sheet metal consisting of uncoated steel sheets (1, 1'), comprising the following steps: - placing the steel sheets (1, 1') in abutting relationship, - weldi...  
WO/2008/016541A1
A copper electroplating bath is provided with a constant source of copper ions by monitoring the copper concentration in the bath. Copper metal is dissolved with sulfuric acid in the separate system which comprises one or more reactors t...  
WO/2008/013535A1
A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of...  
WO/2008/009325A1
A device (20) for the surface treatment of a workpiece (1), in particular electroplating, cleaning and the like, is described, which device comprises a space (3, 17) which is complementary to at least one cross section of the workpiece (...  
WO/2008/009439A1
A clamping device for a printing cylinder with two holding devices (11) on a common axis, each of which has a recess (17) to receive one end (19) of the printing cylinder, with their recesses (17) directed towards one another, and which ...  
WO/2008/010090A2
A device which is suitable for electrochemically processing an object comprises at least an electrolyte-containing chamber, means for supporting the object to be processed in the chamber, a counter electrode disposed in the chamber as we...  

Matches 551 - 600 out of 14,377