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Matches 551 - 600 out of 14,662

Document Document Title
WO/2010/036758A2
A material (20) is coated to enhance and add desirable properties through a metalliding process employing an atmosphere (14) substantially free of oxygen and an electrolytic bath (18) within the atmosphere (14). An electrically conductiv...  
WO/2010/036298A1
Stainless steel (8) sinks are disclosed which have a chrome surface coating layer. In one highly preferred form the layer is electroplated in a non-uniform manner such that high wear areas automatically receive an extra thickness of the ...  
WO/2010/037085A1
In one aspect, described herein are field effect chemical sensor devices useful for chemical and/or biochemical sensing. Also provided herein are methods for single molecule detection. In another aspect, described herein are methods usef...  
WO/2010/031516A1
The invention relates to a device for dip coating a bodywork part (1), comprising a bath (2) for receiving a coating liquid (3). Said device has two parallel guides (10, 11) for guiding the bodywork part (1) and an anode body (6). The bo...  
WO/2010/033367A2
Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outs...  
WO/2010/031215A1
The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers beari...  
WO/2010/026958A1
A device for plating a cylinder block for subjecting the cylinder inner peripheral surface of a cylinder of a cylinder block to plating pretreatment or plating treatment by circulating a treatment liquid with one end side of the cylinder...  
WO/2009/152915A3
The invention relates to a method for the copper electroplating of a workpiece (50), in particular an impression cylinder (50), according to which copper carbonate (74, 79) is fed to a sulphuric-acid copper plating bath (30, 32, 34) for ...  
WO/2010/022824A2
The invention relates to the wet processing and electroplating of one side and/or the edge of a flat product (1) used as a substrate in production systems containing process chambers (4), through which treatment liquid flows (8), wetting...  
WO/2010/019767A1
A method for reclaiming a semiconductor material from a glass substrate is disclosed, the method comprises the steps of providing at least one glass substrate having the semiconductor material disposed thereon, reducing the glass substra...  
WO/2009/146684A3
The present invention relates to a device for use in a method for the galvanic production of a protective layer comprising hard material particles on a component of a turbomachine, particularly a blade tip armoring of a blade tip of a ro...  
WO/2009/044266A3
The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an an...  
WO/2009/142864A3
An electrochemical co-deposition method and solution to plate uniform, defect free and smooth (In3Ga)-Se films with repeatability and controllable molar ratios of (In3Ga) to Se are provided. Such layers are used in fabrication of semicon...  
WO/2009/077146A3
The invention relates to an alkali, galvanic bath for applying zinc or zinc alloys to substrates, wherein the anode chamber and the cathode chamber are separated from each other by a bipolar membrane. The galvanic bath is operated with z...  
WO/2009/055116A3
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide...  
WO/2009/152915A2
The invention relates to a method for the copper electroplating of a workpiece (50), in particular an impression cylinder (50), according to which copper carbonate (74, 79) is fed to a sulphuric-acid copper plating bath (30, 32, 34) for ...  
WO/2009/152896A1
The invention relates to the wet-chemical or electrolytic treatment of flat material, for example a wafer, which according to the prior art is treated by means of technically complex frames or grippers in treatment chambers. Particularly...  
WO/2009/150083A1
The invention relates to a method for selectively depositing a precious metal (32) on a metal substrate (10), the method sequentially comprising: a masking step, consisting of depositing a mask element (16) on one treated surface (12) of...  
WO/2009/016291A3
The invention relates to a method for the electrolytic tinning of steel bands (20), using an insoluble anode (60). The invention also relates to a unit (1) for implementing same and a module (80, 800) for recovering acid from the electro...  
WO/2009/146773A1
The invention relates to the electrical contact of flat material (1) as sections in straight-through installations for the electrolytic and/or chemical wet treatment of the treatment side (10) of the material using external electric curr...  
WO/2009/146684A2
The present invention relates to a device for use in a method for the galvanic production of a protective layer comprising hard material particles on a component of a turbomachine, particularly a blade tip armoring of a blade tip of a ro...  
WO/2009/145994A1
An apparatus for protection of metallic materials from corrosion comprising an electrical power source (5) and a conductor (7) coupled to the power source. An anode (11) is electrically coupled to the conductor. The anode is configured t...  
WO/2009/126021A3
The present invention provides a method for producing solar cells, comprising the steps of - providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, - success...  
WO/2009/143426A1
A continuous electro-cleaning, pickling and electroplating apparatus and method using a plurality of elongate tubes that are electrically conductive.  
WO/2008/061641A8
The invention relates to a workpiece carrier (110) for conveying a workpiece to be painted, particularly a vehicle body, through at least one electrophoretic painting bath and by means of at least one conveyance device following the elec...  
WO/2009/127037A1
An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coati...  
WO/2009/126021A2
The present invention provides a method for producing solar cells, comprising the steps of - providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, - success...  
WO/2001/004928A3
A plating apparatus (100) and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer (102...  
WO/2009/114965A1
An electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface (10) for receiving semiconductor wafers, a mainframe (11) comprising a mainframe transfer robot (102,106) and a plurality of wafer ho...  
WO/2009/016292A3
The invention relates to a method for the electrolytic tinning of steel bands (2), using a soluble anode (600, 6000). The invention also relates to an electrotinning unit (1) and a removable, renewable soluble anode (600, 6000) for imple...  
WO/2009/111582A2
Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar bo...  
WO/2008/148580A3
The present invention relates to a vertical system for the plating treatment of a work piece (W), the said system including at least two treatment modules (100) and at least one transport device for conveying at least one work piece (W) ...  
WO/2009/106269A1
The invention relates to a coating method for a work piece, comprising the following steps: a) applying a coating liquid onto the work piece, wherein the coating liquid comprises an ionic liquid containing ions of at least one element, b...  
WO/2009/100455A1
Coaxial disk armatures, counter-rotating through an axial magnetic field, act as electrolysis electrodes and high shear centrifugal impellers for an axial feed. The feed can be carbon dioxide, water, methane, or other substances requirin...  
WO/2009/093449A1
Provided is a process tank with a simple construction that can allow process fluid to flow and be stirred to reliably prevent the precipitation of process fluid. An electrodeposition tank (2), wherein an electrodeposition coating (1), in...  
WO/2009/077146A2
The invention relates to an alkali, galvanic bath for applying zinc or zinc alloys to substrates, wherein the anode chamber and the cathode chamber are separated from each other by a bipolar membrane. The galvanic bath is operated with z...  
WO/2009/071292A1
The invention relates to an energy conversion system (10) comprising at least one electrically conductive component (11, 12, 13, 14) having at least two cells connected in series. At least one of the electrically conductive components (1...  
WO/2009/067850A1
A conductor (2) of plug, socket or connector is provided. The substrate of the conductor (2) is steel and the conductor is obtained by plating a coating of Ni on the substrate, and then plating Cu on the outer surface of the substrate by...  
WO/2009/065557A1
The invention relates to the electric contacting of flat products to be treated electrolytically in flow-through systems. The products are particularly solar cells and printed circuit boards that are to be galvanized. The necessary elect...  
WO/2007/056380A3
The present invention relates to an electroplating method in the manufacture of the surface mount precision metal resistor, the manufacturing steps are as below: a flat-shaped metal substrate strip being die stamped with predefined resis...  
WO/2009/055992A1
The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose su...  
WO/2009/057422A1
This invention provides a copper anode or a phosphorus-containing copper anode for use in electrolytic copper plating on a semiconductor wafer, characterized in that the purity of the copper anode or the phosphorus-containing copper anod...  
WO/2009/055116A2
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide...  
WO/2007/002656A3
Contact assemblies and machines with contact assemblies for electroprocessing workpieces are disclosed herein. The contact assemblies include a support member and a contact member coupled to the support member. The support member include...  
WO/2006/091937A3
A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution t...  
WO/2007/021956A3
An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during ...  
WO/2009/048223A1
The present invention relates to a device for eletroplating the surface of a vehicle wheel, and more particularly, to an auxiliary anode for plating a vehicle wheel that can form uniform plating thickness on the entire vehicle wheel by a...  
WO/2009/048338A1
Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises : - a container filled with the liquid; - a transportation device comprising a wafer carrier device for tr...  
WO/2005/086880A3
A lithography device (200) includes one or more conductive strips (202, 204) monolithically embedded in an insulative structure (214). A method of manufacturing a lithography device includes monolithically forming a conductive strip thou...  
WO/2009/044266A2
The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an an...  

Matches 551 - 600 out of 14,662