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Matches 251 - 300 out of 14,344

Document Document Title
WO/2014/185160A1
The purpose of the present invention is to provide a plating device, whereby it becomes possible to make the flow rate to become uniform in an area located between the bottom of a plating bath and a solution level without the need of pro...  
WO/2014/167366A1
An electroplating rack for holding a plurality of sliding bearing shells whilst a coating is electroplated onto their concave inner surfaces, comprising an end bracket, wherein the end bracket comprises a liquid supply conduit for receiv...  
WO/2014/168314A1
The present invention relates to an electroplating device for preventing the excessive plating of an edge, and the electroplating device for plating a steel plate between anodes which are formed at a predetermined distance from each othe...  
WO/2014/167201A1
A method and device for electrodeposition in cylindrical geometry. The invention relates to a method for electrochemically depositing a thin layer on a flexible substrate, comprising the following steps: -providing, in an electrolysis ba...  
WO/2014/153597A1
The present disclosure provides a method of anodising a surface of a semiconductor device comprising a p-n junction. The method comprises exposing a first surface portion of the semiconductor device to an electrolytic solution that is su...  
WO/2014/156310A8
Provided are an apparatus and a method for forming a metal coating film, whereby it becomes possible to form a metal coating film having a desired film thickness on the surfaces of multiple bases continuously and it also becomes possible...  
WO/2014/160886A2
A system for treating at least one surface of a material may include a reaction vessel containing a first electrode and a second electrode separated by a gap. A power source may generate an electrical potential across the first electrode...  
WO/2014/159715A1
Broadly, the present disclosure relates to sidewall features (e.g. inner sidewall or hot face) of an electrolysis cell, which protect the sidewall from the electrolytic bath while the cell is in operation (e.g. producing metal in the ele...  
WO/2014/156310A1
Provided are an apparatus and a method for forming a metal coating film, whereby it becomes possible to form a metal coating film having a desired film thickness on the surfaces of multiple bases continuously and it also becomes possible...  
WO/2014/147180A1
The present invention is related to an apparatus and a method for the electrolytic deposition of a zinc or zinc alloy layer on a workpiece, the apparatus comprising a container to hold the metal plating bath divided into at least two com...  
WO/2014/141736A1
 A molten-salt electrolysis plating apparatus using a molten salt in a liquid electrolyte, wherein the molten-salt electrolysis plating apparatus is one of (i) to (iv) below. (i) At least the portion in contact with the liquid electrol...  
WO/2014/138840A1
An electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; the piece...  
WO/2014/127997A3
A method and a device for the surface treatment of workpieces, in particular using electroplating, said device comprising a container which can be filled with a solvent and into which the workpiece that is provided as a first electrode c...  
WO/2014/127997A2
A method and a device for the surface treatment of workpieces, in particular using electroplating, said device comprising a container which can be filled with a solvent and into which the workpiece that is provided as a first electrode c...  
WO/2014/121121A1
A radiolytic electrochemical system that comprises a cathode, an anode that comprises a semiconductor, an aqueous electrolyte solution disposed between the cathode and anode, and ionizing radiation, wherein the ionizing radiation splits ...  
WO/2014/115203A1
This method for forming a chrome plating film uses electroplating to form a chrome plating film on an object (negative electrode)(1) to be plated. A chrome plating solution (15) is provided with: trivalent chromium ions; an organic carbo...  
WO/2014/114789A1
The invention relates to a device for metalising substrates. In particular, the invention relates to the field of contact elements used to electroplate solar cells within the context of a wet-chemical continuous treatment system. A wet-c...  
WO/2014/112818A1
The present invention relates to a wet processing chamber for wet processing an object to be processed. Provided are a wet processing chamber and an apparatus for wet processing comprising same, the wet processing chamber comprising: a h...  
WO/2014/112817A1
The present invention relates to an apparatus and a method for plating, the apparatus for plating comprising: a transporting part for transporting an object to be plated, the object comprising a pattern to be plated; and a cathode roller...  
WO/2014/112816A1
The present invention relates to a cathode roller assembly and a plating apparatus, the cathode roller assembly comprising: a first roller for coming into contact with one surface of an object to be plated, the first roller being dispose...  
WO/2014/112819A1
The present invention relates to an apparatus and a method for continuous plating, the apparatus comprising: cathode rollers each having at least the outer surface thereof which is electrically conductive, and disposed so as to come into...  
WO/2014/095356A1
The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate wherein the device comprises at least a first device element and a second device element, which are arranged in a vert...  
WO/2014/095355A1
Device (1) for vertical galvanic metal deposition on a substrate characterized in that the device (1) comprises an anode (2) made of a plurality of anode segments and having at least one through- going conduit, a carrier (3) comprising a...  
WO/2014/094998A1
The invention relates to an object (18) such as a wire which is electrolytically coated by dipping the object into an electrolyte tank (10) having an electrolyte (12), in which at least one soluble anode (14), which is connected to a pos...  
WO/2014/086399A1
A plant (1) for the anodic oxidation of aluminum profiles (10) which comprises first overhead transport means (11) of said aluminum profiles hanging on said first overhead transport means (11) along an advance direction and at least one ...  
WO/2014/083144A1
The invention relates to an electrode for electrolytic processes, in particular to an anode suitable for oxygen evolution comprising a valve metal substrate, a catalytic layer, a protection layer consisting of oxides of valve metals inte...  
WO/2014/079911A2
This invention relates to a method for electrodeposition of a chromium containing metal coating on an electrically conductive object from a trivalent chromium based electrolyte wherein the object acts as the cathode and wherein at least ...  
WO/2014/076078A3
The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the ...  
WO/2014/076664A3
A method for electrochemical surface treatment of metal parts by immersion in at least one treatment liquid contained in at least one treatment tank (1), and a tank and machine for carrying out this method, comprising at least one electr...  
WO/2014/076781A1
The purpose of the present invention is to provide a plating jig, which is capable of forming metal plating films at the same time on both the surfaces of a semiconductor wafer by performing plating one time, and which has a simple confi...  
WO/2014/069023A1
Provided is a plating device characterized by being provided with a plating tank as a means for performing electroplating uniformly and at high speed regardless of the shape of a plated member, an insoluble anode disposed in the plating ...  
WO/2014/067937A1
The invention relates to a method for manufacturing a strip made of aluminum or an aluminum alloy as well as to a coated aluminum or aluminum alloy strip, a formed metal part made of said aluminum or aluminum alloy strip as well as to an...  
WO/2014/061352A1
Provided is a method for producing a metal plate having an alloy plating layer, which comprises a step wherein electroplating is carried out in a plating bath by having a metal strip continuously passed through the plating bath that is p...  
WO/2014/060333A1
The invention relates to an anodizing device for anodizing at least one internal surface element (22) of a metal tubular body (18) having an extension direction (24), comprising: an anodizing tank (10) for accommodating an electrolyte (1...  
WO/2014/053563A9
The invention relates to a holder device and a carrier with components made from aluminium and titanium materials for anodizing supports. The invention also relates to a method for producing a holder device with a carrier for anodizing s...  
WO/2014/053563A3
The invention relates to a holder device and a carrier with components made from aluminium and titanium materials for anodizing supports. The invention also relates to a method for producing a holder device with a carrier for anodizing s...  
WO/2014/053563A2
The invention relates to a holder device and a carrier with components made from aluminium and titanium materials for anodizing supports. The invention also relates to a method for producing a holder device with a carrier for anodizing s...  
WO/2014/053300A1
A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for esta...  
WO/2014/040224A1
A method for plating connector frames (105) is provided. The method comprises the step of placing the frames in a vibrating bowl (200)to enable the bowl's vibrations load the frames in a predefined orientation onto the vibrating bowl's c...  
WO/2014/042782A1
Methods and systems for electrochemical conversion of carbon dioxide to organic products including formate and formic acid are provided. A method may include, but is not limited to, steps (A) to (C). Step (A) may introduce an acidic anol...  
WO/2014/038401A1
An iron plating apparatus (100) according to the present invention is provided with: a plating unit (10) for forming an iron plating layer on the surface of an object to be plated, which is formed of an aluminum alloy; a main tank (20) f...  
WO/2014/037229A3
A device is designed for electroplating a material being treated (8) and has a hollow space (9) with an inner surface (51) to be coated. The device comprises a first frame part (11) with a first electrode (21) for holding and electricall...  
WO/2014/032084A9
The present invention relates to a system and method for monitoring, in real time, the electric current that passes through each one of a plurality of single cathodes or anodes forming an electrolytic cell. The system comprises a plurali...  
WO/2014/032085A1
The present invention relates to an electric current management (ECM) system andmethod comprising at least one electrolytic cell having at least two electrodes in contact with electrolyte media; a plurality of sensor means for measuring ...  
WO/2014/029667A3
The invention relates to a method for light entrapment in coating baths, in order thereby to deposit metal on a surface of a semiconductor component in a light-induced or light-supported manner. The method comprises at least the followin...  
WO/2014/028045A1
A method of monitoring an electrolytic cell including detecting information indicative of a thermite reaction, comparing the information indicative of a thermite reaction to a threshold, generating a thermite response signal according to...  
WO/2014/025727A2
Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first an...  
WO/2014/018084A3
A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an el...  
WO/2014/002520A1
[Problem] To provide a device and method for forming a partial anodic oxidation film on a portion of an outer peripheral surface of a section comprising a modified cross sectional shape. [Solution] Provided is a partial anodic oxidation ...  
WO/2013/189828A3
The galvanization plant has a plurality of baths (22, 24, 26), at least one goods carrier (28) for accommodating goods (30) to be treated, and a transporting device (36) for transporting the at least one goods carrier (28) to the individ...  

Matches 251 - 300 out of 14,344