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WO/2021/011639A1 |
Provided herein is an electrodeposition apparatus for producing long polymeric threads, yarns, or ropes. A method of preparing long polymeric threads, yarns or ropes also is provided.
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WO/2020/263795A1 |
Systems and methods for electroplating are provided. An electroplating system may include an electroplating cell configured to contain an anode and an electroplating solution, a wafer holder configured to support a wafer within the elect...
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WO/2020/263837A1 |
Tungsten-containing metal films may be deposited in recessed features of semiconductor substrates by electrodeposition. The tungsten-containing metal film is electrodeposited under conditions so that the tungsten-containing metal film is...
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WO/2020/250696A1 |
Proposed are an anode holder and plating device such that depletion of additives on the plating device can be suppressed. The anode holder, which is for holding an anode used in a plating device, is provided with: an internal space whi...
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WO/2020/242838A1 |
An electrochemical deposition system includes: an electrochemical deposition chamber including an electrolyte for electrochemical deposition; a substrate holder configured to hold a substrate and including a first cathode that is electri...
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WO/2020/236497A1 |
In one example, the disclosed apparatus is a substrate contact-ring to support a substrate. The substrate contact-ring includes a peripheral structure sized and configured to support the substrate within the substrate contact-ring. The p...
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WO/2020/235406A1 |
The present invention provides a plating method whereby consumption of an additive in a plating solution can be suppressed during plating of a substrate having a via or hole for forming a through electrode, and provides an insoluble anod...
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WO/2020/227841A1 |
A cathode and anode positioning device, for installation on the edge of the anodes for metal electrowinning cells, enabling a normal flow of current at the edge of the anode, and comprising: an electrode separation body, which can be cou...
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WO/2020/230036A1 |
Galvanic tank (100) with double casing adapted to contain leaks of toxic fluids, comprising: - external casing (20) with suction hole (22), connected to a suction duct (45) which, by means of a common suction pump (44), suctions air from...
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WO/2020/218671A1 |
The present invention relates to a plating hanger transfer apparatus and, specifically, in order for plating hangers to be transferred without interruption while being maintained at predetermined intervals, a sprocket and a pinion rotate...
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WO/2020/217796A1 |
Provided is an anode holder with which a valve can be operated without using a link mechanism. This anode holder has: an internal space that is formed inside the anode holder and is for accommodating an anode; a diaphragm configured to...
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WO/2020/213719A1 |
This titanium alloy plate has a chemical composition containing, in terms of mass%: a total of 0.2-7.0% of one type or two or more types selected from the group consisting of 0-2.0% of Sn, 0-5.0% of Zr, and 0-7.0% of Al; at most 0.100% o...
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WO/2020/200789A1 |
The invention relates to a coating apparatus (1) for coating components (2), in particular for nickel plating spark-plug housings. The coating apparatus comprises: a housing (3) with an outer anode (4), which is designed to receive the c...
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WO/2020/177066A1 |
An array composite electric field metal electrochemical micro-nano scale additive manufacturing device and method, relating to the field of metal material electrochemical 3D printing. An array type high speed electrochemical 3D printing ...
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WO/2020/175934A1 |
An anodizing device is disclosed. The anodizing device according to an embodiment of the present invention may comprise: a base for supporting a product to be anodized, the product having a first bore for which an anodizing surface treat...
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WO/2020/173950A1 |
This invention relates to a method for electrolytically depositing a chromium oxide layer onto i) blackplate or onto ii) blackplate coated with a chromium electrodeposited coating produced based on chromium(III) technology electroplating...
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WO/2020/173953A1 |
This invention relates to a method for electroplating a steel strip with a plating layer and an improvement thereof.
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WO/2020/169439A1 |
The invention relates to an assembly (1) for electrically contacting a microchip substrate (2) during electrolytic metallization comprising: - a holder (6) having a recess (10), to which negative pressure can be applied, for receiving th...
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WO/2020/168881A1 |
Disclosed are a device and a method for fine electrodeposition by means of a laser assisted flexible following tool electrode, which relate to the technical field of localized fine electrodeposition. The method comprises: enhancing local...
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WO/2020/168074A1 |
Systems and methods are provided for method for etch assisted gold (Au) through silicon mask plating (EAG-TSM). An example method comprises providing a seed layer on a substrate and providing a silicon mask on at least a portion of the s...
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WO/2020/158567A1 |
A workpiece-holding jig (30), which can hold a workpiece (20) having a surface to be processed and can electrically connect to a rectifier that controls voltage so as to conduct a constant current, wherein a conductive member that can el...
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WO/2020/158570A1 |
A workpiece holding jig (30), which holds a workpiece (20) having a surface to be processed so as to hang down and is capable of being electrically connected to a rectifier, comprises: a conductive upper clamping part (510) that clamps t...
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WO/2020/158568A1 |
A workpiece holding jig (30), which is capable of holding a workpiece having a surface to be processed and being electrically connected to a rectifier, comprises: at least one conductive support part (521, 522) that can conduct a current...
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WO/2020/158569A1 |
A workpiece holding jig (30), which holds a workpiece (20) so as to hang down and can electrically connect to a rectifier, comprises support parts (531, 532) that can conduct power in conjunction with the rectifier, and conductive clamps...
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WO/2020/152920A1 |
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to able...
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WO/2020/152208A1 |
The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc- nickel alloy layer on a substrate to be treated using a membrane anode system, and...
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WO/2020/152921A1 |
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be a...
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WO/2020/152922A1 |
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be a...
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WO/2020/144880A1 |
Provided is a technique for treating a surface of a rolling element without leaving uncoated portions or without causing scratching. A jig for a rolling element is used, which can be used in the treatment of a surface of a rolling elem...
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WO/2020/133149A1 |
A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first a...
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WO/2020/124649A1 |
The invention relates to the technical field of electroplated thin PCB manufacturing. Specifically disclosed are a method and system for manufacturing an electroplated high-precision thin circuit PCB. The system comprises a PCB conveyor ...
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WO/2020/123458A1 |
An electrodeposition system, for additive manufacturing of a three-dimensional structure, includes at least one electrochemical cell. The at least one electrochemical cell includes a receptacle containing an electrolytic bath. At least o...
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WO/2020/114000A1 |
A water retaining device and a vertical electroplating device, comprising a fixing frame (2), a water blocking component (5), a gear set, a transmission shaft (4), a rotating component (3) and transmission guide rods (6); the fixing fram...
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WO/2020/105524A1 |
A jig conveyance member (100) comprises: a jig-holding section (110) on which a workpiece-holding jig (10) for holding a workpiece W suspended therefrom is detachably installed; a support section (120) for supporting the jig-holding sect...
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WO/2020/106253A2 |
The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the...
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WO/2020/106590A1 |
The embodiments herein relate to apparatuses and methods for electroplating one or more materials onto a substrate. Embodiments herein utilize a cross flow conduit in the electroplating cell to divert flow of fluid from a region between ...
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WO/2020/095152A1 |
The metallization of a metallic rack employed in galvanic metallization processes of plastic material items, coated by immersion in PVC Plastisol, is inhibited thanks to the fact that PVC Plastisol is mixed with a C8-C18 thiol selected f...
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WO/2020/072649A1 |
In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an ...
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WO/2020/071321A1 |
A plating device 1 is provided with a first plating tank 11A filled with a plating solution 3, an anode 14 disposed in the first plating tank 11A so as to face an article 2 to be plated, a cathode 12 for supplying power to the article 2 ...
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WO/2020/069630A1 |
The invention relates to a system having a self-supporting structure that can be assembled by pieces and can be adapted to the space for the electrowinning of metals, both in an already operational cell or in a tank (SELLE NG), character...
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WO/2020/067622A1 |
Disclosed is a method comprising the steps of: preparing an electrolyte containing a metal oxide active material precursor; and forming a metal oxide coating layer by loading a titanium (Ti) substrate into the electrolyte, wherein the me...
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WO/2020/050009A1 |
The present invention relates to a substrate processing device for processing a substrate using a processing fluid. The substrate processing device according to an embodiment is provided with: a support unit which has a mounting surface ...
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WO/2020/034557A1 |
Disclosed in the present invention is a continuous plating method. The method comprises: connecting onto a second continuous material strip a plurality of products to be plated, the main body direction of said products forming a set angl...
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WO/2020/032476A1 |
An electroplating system according to one embodiment of the present invention, which has a constant current control function and includes a reservoir having a plating solution received therein, may comprise: a power source; a positive el...
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WO/2020/025351A1 |
The invention relates to an electrode for electroplating or electrodeposition of a metal and to the method for obtaining the same. The electrode comprises a conductive sub- strate, at least one layer of an electrochemically active coatin...
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WO/2020/025090A1 |
The invention relates to a flow generator (2a, 2b), which has an electrolyte feed device (12) for feeding an electrolyte (7), and an electrolyte distribution device (13). The invention also relates to a deposition device (1, 33, 35) havi...
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WO/2020/015672A1 |
The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive mat...
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WO/2020/015673A1 |
Provided are a conductive structure and an electric plating device, wherein the conductive structure is configured to transmit an electric signal to a circuit board, and the conductive structure comprises a conductive frame made of a con...
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WO/2020/015674A1 |
A transmission structure and an electroplating device. The transmission structure comprises a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) that is connected to the mounting member (...
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WO/2020/014423A1 |
Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber ...
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