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WO/2014/053300A1 |
A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for esta...
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WO/2014/040224A1 |
A method for plating connector frames (105) is provided. The method comprises the step of placing the frames in a vibrating bowl (200)to enable the bowl's vibrations load the frames in a predefined orientation onto the vibrating bowl's c...
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WO/2014/042782A1 |
Methods and systems for electrochemical conversion of carbon dioxide to organic products including formate and formic acid are provided. A method may include, but is not limited to, steps (A) to (C). Step (A) may introduce an acidic anol...
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WO/2014/038401A1 |
An iron plating apparatus (100) according to the present invention is provided with: a plating unit (10) for forming an iron plating layer on the surface of an object to be plated, which is formed of an aluminum alloy; a main tank (20) f...
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WO/2014/032085A1 |
The present invention relates to an electric current management (ECM) system andmethod comprising at least one electrolytic cell having at least two electrodes in contact with electrolyte media; a plurality of sensor means for measuring ...
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WO/2014/028045A1 |
A method of monitoring an electrolytic cell including detecting information indicative of a thermite reaction, comparing the information indicative of a thermite reaction to a threshold, generating a thermite response signal according to...
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WO/2014/025727A2 |
Generally stated, provided is a sealed laminated metal structure. This laminated metal structure has a metal layer, where the metal layer has a first surface and an opposite second surface. A material is laminated on each of the first an...
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WO/2014/002520A1 |
[Problem] To provide a device and method for forming a partial anodic oxidation film on a portion of an outer peripheral surface of a section comprising a modified cross sectional shape. [Solution] Provided is a partial anodic oxidation ...
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WO/2013/189828A2 |
The galvanization plant has a plurality of baths (22, 24, 26), at least one goods carrier (28) for accommodating goods (30) to be treated, and a transporting device (36) for transporting the at least one goods carrier (28) to the individ...
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WO/2013/169477A1 |
An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is atta...
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WO/2013/169015A1 |
The present invention relates to a continuous plating apparatus, and more particularly, to a continuous plating apparatus comprising: a frame; a driving roller on which an object to be plated, having a predetermined width and extending i...
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WO/2013/160160A2 |
For improving the current transfer during the electrolytic metallization of workpieces WS, a method comprising the following method steps is proposed: (a) providing a metal depositing apparatus (17), in which the workpiece WS, at least o...
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WO/2013/157129A1 |
The present invention relates to a plating jig and a plating device that are used for substrate plating processing, and the purpose thereof is to provide a plating jig that has a rotation driving means for a substrate holder and, togethe...
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WO/2013/151365A1 |
The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and ...
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WO/2013/151381A1 |
An apparatus for anodizing the inner surface of a tube of the present invention comprises: an electrolyte container for storing an electrolyte solution; a first solution conduit connected to the electrolyte container to be supplied with ...
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WO/2013/150163A1 |
The invention relates to a head (1) for suspending an anode plate (2) in order to improve current distribution in the electrode and reduce the corrosion on the elements of said suspension head (1) during zinc electrolysis processes, whic...
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WO/2013/141166A1 |
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% ...
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WO/2013/125643A1 |
Provided are a film formation device for forming a metal film and a film formation method for forming same, with which it is possible to continuously form, on the surfaces of a plurality of base materials, metal films having a desired fi...
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WO/2013/122046A1 |
Provided is a method for Sn-alloy electrolytic plating that allows use of a soluble anode in resolving the problem of metal deposition on an anode when an Sn alloy such as a Sn-Ag alloy is electrolytically plated. The interior of a plati...
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WO/2013/117269A1 |
A process of sequentially plating a plurality of elongated metal members (100, 200) in two or more plating cells (102, 110, 116, 126) comprises the following steps: a) guiding the plurality of elongated metal members (100, 200) at a firs...
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WO/2013/114417A1 |
A machine for the electrochemical marking treatment of metallic surfaces, includes: an electrode (4) placed in sliding movement on the metallic surface (2) to be treated; a buffer impregnated with an etching solution; an electric current...
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WO/2013/105420A1 |
Disclosed is a plating device (1) that has a plating tank (3) that retains a plating fluid (2) and carries out magnetic metal plating on a shaft shaped member (5) immersed in the plating fluid (2) as a negative electrode. The plating dev...
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WO/2013/103263A1 |
The present invention relates to a substrate carrier apparatus for electroplating of a solar cell, which comprises a panel portion that accommodates a substrate, and a supporting portion that is connected to a transfer device. The presen...
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WO/2013/087455A1 |
In order to create a coating unit with a flexible and reliable operation for coating workpieces, which has a dip tank into which the workpieces to be coated can be introduced, a current conversion system for providing a coating current t...
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WO/2013/084927A1 |
Provided is a single-motor-driven gravure cylinder chuck mechanism that causes the contact of a chuck cone to a roll to be platemade to be increased at each processing unit of a fully automatic platemaking system. The gravure cylinder ch...
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WO/2013/084929A1 |
Provided are: a processing unit that has a condenser and that is caused to be able condense and reuse as processing liquid a processing liquid that is in a mist state having been vaporized during platemaking processing at the processing ...
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WO/2013/076277A2 |
The present invention concerns an electrode for oxygen evolution in electroplating plants comprising a valve metal substrate and an outer catalytic layer, the substrate consisting of a metal plate provided with slits of area ranging from...
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WO/2013/073872A1 |
The present invention relates to an apparatus and a method for manufacturing metal foil by electroforming. Provided is a horizontal electroforming apparatus comprising: base plate supply means for continuously supplying flexible and cond...
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WO/2013/073942A1 |
The present invention provides a transport member for transporting strip-like elements to be treated in a bath. The transport member is provided with a horizontally oriented endless carrier belt with resilient wire-like clamping members ...
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WO/2013/069711A1 |
The present invention provides an electrode for electrochemistry with a high quality, in which the surface area of the polycrystalline conductive diamond layer is increased and the crystal plane is controlled. In addition, when the catal...
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WO/2013/057802A1 |
The purpose of the invention is to provide a plating jig: which does not expose the conducting pins or conducting members to the plating solution during plating of substrates such as semiconductor wafers, glass plates or ceramic plates; ...
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WO/2013/040710A1 |
An electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack. The piece...
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WO/2013/038928A1 |
Provided are: a positive electrode for electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein the positive electrode has a lower electric potential, and the electrolysis voltage and basic units of ...
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WO/2013/029481A1 |
Disclosed is a clamp dedicated to electroplating comprising a conductive fixing bracket and a clamping device. An insulating plate is arranged at one end of the clamping device and is in insulation connection with the conductive fixing b...
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WO/2013/030870A1 |
Provided is a metal foil electrolytic deposition device in which the surface of the anode plate, on the side thereof furnished with the power supply terminals, is faced toward the outside of the electrolytic bath, and a single-bath desig...
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WO/2013/015491A1 |
The present invention relates to an apparatus and method for vacuum coating, and more particularly, the present invention relates to an apparatus and method for vacuum coating which can effectively prevent a coated material from electric...
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WO/2013/011202A1 |
The invention relates to an internal box (16) for an electrolytic manganese cell, of the type comprising: a plurality of anode frames (66); a plurality of cathode frames (64) placed between the anode frames (66); a plurality of diaphragm...
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WO/2013/011203A1 |
The invention relates to a box comprising a plurality of anode frames (66), a plurality of cathode frames (64) placed between the anode frames (66) and a plurality of diaphragms (68) disposed between each cathode frame (64) and each anod...
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WO/2013/013119A1 |
The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthe...
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WO/2013/010681A1 |
To create an installation for the surface treatment of workpieces which comprises at least one heat sink/treatment zone (118), to which heat is to be supplied during operation of the installation (100), and at least one heat source/treat...
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WO/2013/004414A1 |
An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21', 21") with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21', 21") are travelling. Th...
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WO/2012/173144A1 |
An anodizing device has: a power supply drum that supports, in close contact therewith, a belt-like object consisting of a anodizable metal or consisting of a composite conductive metal foil that is a metal anodizable at least on one sid...
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WO/2012/117533A1 |
Using a substrate intermediate (4) having through-holes (7) passing through an insulating layer (6) and two electroconductive masks (5) having openings at positions corresponding to the through-holes (7), the entirety of front and rear s...
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WO/2012/112313A2 |
The present invention relates to an anode assembly for use in an electrolytic cell for recovery of metal. The assembly includes a hanger bar, a first perimeter bar, a second perimeter bar, optionally one or more center conductor bars, a ...
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WO/2012/096850A2 |
Methods and apparatus are described for electrodeposition of Group IIB- VIA materials out of electrolytes comprising Group IIB and Group VIA species onto surfaces of workpieces. In one embodiment a method of electrodeposition is describe...
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WO/2012/084047A1 |
An ECPR master electrode(10) and a method for providing such master electrode is provided. The master electrode comprises a carrier element (20) having an electrically conducting electrode surface(23) on a backside (21) and a topographic...
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WO/2012/080078A2 |
The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode is in...
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WO/2012/078589A1 |
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution...
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WO/2012/073820A1 |
An electrode structure (100) according to the present invention is provided with: an aluminum electrode (10) which makes contact with the surface of an aluminum substrate; a fixing member (20) for fixing the aluminum electrode (10) to th...
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WO/2012/067332A1 |
The present invention relates to a substrate transfer apparatus. The substrate transfer apparatus, which is configured to transfer a substrate when the substrate is vertically fixed, includes: a pair of support brackets arranged in paral...
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