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Patent Searching and Data


Matches 851 - 900 out of 14,289

Document Document Title
WO/2003/019098A1
A very flexible heat pipe is provided constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen (18) which creates a vapor space. The layers on either side o...  
WO/2003/016810A1
The invention relates to a method for preventing the formation of a gas film in an evaporation area in a two-phase cooling system and a device for carrying out said method. According to the invention, mechanical vibrations in the ultraso...  
WO2002052644A3
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2003/016811A2
Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly effic...  
WO/2003/015908A1
An apparatus for carrying out a process of converting hydrocarbon fuel to a hydrogen rich gas utilizes heat pipes (504) to control the temperatures of the reactor beds (502), manage heat and integrate the heat management in a simple and ...  
WO/2003/017365A2
The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a compositi...  
WO/2003/016044A1
A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfe...  
WO2002002201A3
A capillaray pump two phase heat transport system that combines the most favorable characteristics of a capillary pump loop (CPL) with the robustness and reliability of a loop heat pipe (LHP). Like a CPL, the hybrid loop has plural paral...  
WO/2003/014648A1
The invention relates to heat engineering, in particular to heat pipes and can be used for removing heat from miniature high-heat objects, in particular elements of radiotechnical instruments and computers requiring efficient removal of ...  
WO/2003/015234A2
Featured is a heat transferring device (200) being configured and arranged so that at least some of the heat energy being generated by a heat producing device, such as the a bearing assembly of a flywheel energy storage system, is commun...  
WO/2003/014697A2
This invention comprises devices, compositions and methods for quantitative detecting analytes in complex solutions by Raman spectroscopy. Passivating agents associated with enhancing surfaces can decrease direct, non-specific interactio...  
WO/2003/012357A2
A heat exchanger includes a manifold having a number of parallel heat pipes extending between a head pipe and a tail pipe or feeder pipe. The tail pipe is parallel to the head pipe. The heat pipes define many capillaries extending in par...  
WO/2003/009663A1
The present invention provides a thermal energy management architecture (5) for a functioning system of electronic components and subsystems (10) comprising a hierarchical scheme in whic thermal management components are: (i) operatively...  
WO2002072378A9
A solar-based power generating system (10) including an electrical alternator (32) or generator for generating electrical power in which the alternator or generator is driven by a refrigerant circulating through a closed-loop heat transf...  
WO2002058138A3
An electronic assembly (10) is described including a motherboard (12), a semiconductor die (20) mounted to the motherboard (12), and a heat pipe (22) having an evaporator portion (34) adjacent the die n (20), and a condenser portion (36)...  
WO/2003/006910A1
A thermal bus (5) is provided for cabinets (10) housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators (30) interconnected in flow communication with a condenser (36). Each evap...  
WO/2003/004944A2
A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein heat energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is...  
WO/2003/002916A1
An underfloor heating system having a main conduit (2) transporting a heat transfer medium therethrough, at least one heatpipe (4) contactable with said conduit, said heatpipe having means (6) for adjusting its positioning relative to th...  
WO/2003/001861A1
The heat management system (10) for an electronic cabinet (15) which is provided with a first heat exchanger (100) having a cold plate (103) with channels filled with liquid coolant, a second liquid-to-air heat exchanger (200) and tertia...  
WO/2002/099344A1
A refrigeratory for a refrigerating device comprising a refrigerating agent channel (4) which is guided between two side walls (2, 3). At least one of the side walls (3) is made of a non-rigid bending material which can be adapted intern...  
WO2002081996A3
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28)...  
WO/2002/090846A2
A heat transfer system first comprises an air conditioner (111) which includes an evaporator (112). The system further includes a chamber (113) having an air duct (114) comprised of an input end (115) for receiving fresh ambient make up ...  
WO/2002/090846A3
A heat transfer system first comprises an air conditioner (111) which includes an evaporator (112). The system further includes a chamber (113) having an air duct (114) comprised of an input end (115) for receiving fresh ambient make up ...  
WO/2002/087741A1
A hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen storage alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure conta...  
WO2002056396A3
0 hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure container. Th...  
WO/2002/084195A1
A heat transfer fluid medium (25) within the closed system is arranged to boil to form a vapor in the evaporation section (12) and such that release of heat from the condensation section (11) to the fluid to be heated (4A) causes the vap...  
WO/2002/081996A2
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28)...  
WO/2002/077558A3
A heat pipe (105) having particle structures (160, 161) and a polymer (145, 146) thereon.  
WO2002052644A9
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2002/077647A1
This invention comprises devices, compositions and methods for detecting analytes in complex solutions. In certain embodiments of this invention, the receptor molecules can be lacking in a Raman signal generating moiety that is present i...  
WO/2002/077558A2
A heat pipe (105) having particle structures (160, 161) and a polymer (145, 146) thereon.  
WO/2002/077547A1
An enclosure (100) for a refrigerated space (100). The enclosure includes a thermosiphon (250) and a Stirling cooler (300). The thermosiphon (250) includes a condenser end (260) and an evaporator end (270). The ends are connected by a sm...  
WO/2002/076165A1
An electronic module (20) includes a cooling substrate (21a), an electronic device (22) mounted thereon, and a heat sink (23) adjacent the cooling substrate (21a). More particularly, the cooling substrate (21a) may have an evaporator cha...  
WO/2002/072378A1
A solar-based power generating system (10) including an electrical alternator (32) or generator for generating electrical power in which the alternator or generator is driven by a refrigerant circulating through a closed-loop heat transf...  
WO2001088456A3
A capillary wick (312) for use in capillary evaporators (310) has properties that prevent nucleation inside the body of the wick, resulting in suppression of back-conduction of heat from vapor channels (316) to the liquid reservoir (320)...  
WO/2002/058879A1
An environmentally unrestricted plate heat pipe with excellent radiation characteristics, a hollow stacked body used for the plate heat pipe, and a plate stacked body used for the hollow stacked body, wherein the plate stacked body is fo...  
WO/2002/058138A2
An electronic assembly (10) is described including a motherboard (12), a semiconductor die (20) mounted to the motherboard (12), and a heat pipe (22) having an evaporator portion (34) adjacent the die n (20), and a condenser portion (36)...  
WO/2002/056396A2
0 hydrogen storage bed system (1) which includes a pressure container (2), a hydrogen alloy (3) disposed within the pressure container (2), and an integrated thermal management system integrally disposed within the pressure container. Th...  
WO/2002/054002A1
The present invention discloses an apparatus including a magnesium alloy vessel substantially free of aluminum and zinc, with the having a hollow interior cavity containing a working fluid, wherein the improvement includes the formation ...  
WO/2002/053999A1
A semiconductor package is provided that includes a substrate (7) having a top surface (11), a cover (20), and at least one semiconductor device (9) attached to the top surface of the substrate. The cover is secured to the substrate so a...  
WO/2002/052644A2
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit packag...  
WO/2002/050488A1
A heat pipe comprised of a condenser (12), an evaporator (11) and a capillary device (13).  
WO/2002/044639A1
Disclosed is a heat pipe with a wick structure containing pipe type continuous air holes, produced by positioning a tool at a center of the pipe and multiple wires (6) at a position attached to an inner wall of the pipe, respectively; ch...  
WO/2002/043224A1
The superconducting device (2) comprises a rotor (5) which is rotatable about an axis of rotation (A) and is provided with a superconductive winding (10) in a heat conducting winding carrier (9). The winding carrier (9) has a central coo...  
WO/2002/031418A1
A heat exchanger with an excellent heat exchanging efficiency and a refrigerator having the heat exchanger; the refrigerator, comprising a Stirling refrigerator machine (6) and a heat exchanger (10) allowed to abut-on the cold heat (62) ...  
WO/2002/023114A1
A die (400) containing a metal line (406) and a polymer (410).  
WO/2002/016832A1
A floor heater, comprising an integral-formed resin insulating panel (10), heat sources (20) laid down on the insulating panel (10), a radiating plate (30) supportedly placed on supporting columns (12) formed integrally with the insulati...  
WO/2002/014769A1
A heater, particularly for hanging articles thereon to dry, having a primary heatpipe and a plurality of secondary heatpipes extending therefrom, one or more of the heatpipes being connected to a heat source. The primary heatpipe may be ...  
WO/2002/014772A1
A high thermal conductive stainless steel plate (1) of a laminated structure, wherein the surface (5a) with loop-shaped meandering groove (7) of a grooved stainless steel plate (5) is stacked on a flat stainless steel plate (3), a meande...  
WO/2002/013588A1
A cooling apparatus using 'low profile extrusions' is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electroni...  

Matches 851 - 900 out of 14,289