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JP2012220179 |
To provide a heat pipe manufacturing method that makes it possible to reduce manufacturing costs.The heat pipe where capillary members inside are formed by sintering of copper powders is manufactured by the following steps: a core rod 13...
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JP2012220160 |
To provide a channel structure of a self-excited vibration heat pipe, which can accelerate a circulation flow of a refrigerant.A cavitary small pipe 7 formed in a closed loop is reciprocated by the multiple number of times between a heat...
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JP2012220180 |
To provide a flat heat pipe manufacturing method that makes it possible to maintain the quality of a product.The heat pump to be formed using a pipe 11 and a core rod 13 having a part 14 to be removed is manufactured by the following ste...
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JP2012220108 |
To improve heat conductivity and dissipation efficiency by reducing the weight of the heat dissipation device of an electronic apparatus.The heat dissipation device is composed of a first cavity 30, the second cavity 40, and a plurality ...
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JP2012215375 |
To provide a heat pipe capable of easily switching between top heat and bottom heat by performing opening and closing operations of a valve, superior in heat transfer properties, capable of being used in a heating and air conditioning sy...
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JP2012216543 |
To provide a light-emitting diode lamp having a high heat radiation efficiency.The light-emitting diode lamp includes a heat radiator, a heat pipe connected to the heat radiator, and a light-emitting diode connected to the heat pipe. The...
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JP2012207849 |
To form a loop type heat pipe with high cooling capacity within a small space.A heating element 20 is mounted on a base plate 10. The heating element 20 is housed in an evaporation part 30. A steam flow path 40 connected to the evaporati...
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JP2012202570 |
To provide an evaporator and a cooling apparatus capable of stably cooling a heat source body.The evaporator includes a hollow container having a first opening for a liquid refrigerant to flow in and a second opening for a gaseous refrig...
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JP2012197994 |
To provide an ebullient cooling device that uses a reduced amount of refrigerant compared with the related art with a relatively simple configuration, cools a heating element sufficiently even when the ebullient cooling device is located...
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JP2012198019 |
To provide a loop heat pipe that starts circulation of working fluid so as not to prevent the circulation after starting the circulation in a top heat state or the like, and to provide an electronic apparatus with the loop heat pipe moun...
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JP2012197765 |
To achieve a hermetic compressor and a refrigerating device with high efficiency, in which heating in a suction pipe of the hermetic compressor is prevented and a cooling effect of a refrigerant gas is further enhanced.The hermetic compr...
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JP2012198015 |
To provide a heat insulation system of a U-shaped pipeline that prevents thermal energy loss when fluid with temperature difference passing through the U-shaped pipeline where piping segments of a fluid inlet end and a fluid outlet end a...
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JP2012198000 |
To prevent overcooling without decreasing cooling performance or increasing the size of a product, concerning a cooling device and a heating element storage apparatus using the same.The cooling device includes natural-circulation-system ...
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JP2012192916 |
To provide a structural panel of an artificial satelite, having a built-in heat exchanger.The structural panel (PS) for an artificial satelite includes an outer plate (PE) intended to be arranged in the outside of an artificial satelite,...
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JP2012193912 |
To provide a loop heat pipe that supplies working fluid of a liquid phase to an evaporator in a stable manner.The evaporator 16 includes a first wick 30; and a second wick 31 arranged to come into contact with the first wick 30, and part...
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JP2012189260 |
To provide a radiation unit having a hydrophilic compound thin film capable of easily improving heat transferring efficiency at low costs, and a method of depositing hydrophilic compound thin film.This radiation unit includes a chamber 1...
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JP2012184913 |
To provide a radiation device and an assembling method of the same, that can improve a heat transfer effect between heat pipes adjacent to each other.This method includes a step (A) for providing a heat transfer base and the plurality of...
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JP2012186246 |
To restrain accumulation of dusts by making an electric potential of a heat sink approximate to a reference electric potential.A portable computer 100 houses a heat radiation unit 200 in a system housing 105. The heat radiation unit radi...
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JP2012184875 |
To provide a plane type heat pipe structure and a method of manufacturing the same, for improving a yield, by strengthening bearing power of a plane type heat pipe.The plane type heat pipe structure includes a pipe body 11, a thin piece ...
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JP2012183978 |
To simplify a configuration of a heating device using a plurality of heat sources.The heating device uses a heat transferred by a loop heat pipe 10. An evaporation part 11 of the loop heat pipe 10 is configured so that fluid 17 of a work...
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JP2012182159 |
To improve a heat dissipation efficiency in a cooling device of a semiconductor power module in which the semiconductor power module is installed onto a heat sink, a groove is provided in a plane of the heat sink on a side where the semi...
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JP2012177530 |
To provide an auxiliary cooling device capable of cold storage by using outside cold, and cooling a data center using the stored cold in the case where such a situation occurs as the data center cannot be cooled by a cooling system.An ic...
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JP2012172901 |
To provide a chemical heat storage heat transfer device that has superior heat transfer capability, and in reactivity in ammonia immobilization and desorption, while the cracks and pulverization of a heat storage material molding can be ...
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JP2012172896 |
To provide an antifreezing device for a tank storage liquid, along with a liquid storage tank with an antifreezing function, capable of performing the heat insulation of the inside of a tank so that storage liquid can be prevented from b...
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JP2012172940 |
To provide a heat transport device for removing factors which block circulation of a working medium and for suppressing a decrease in heat transport capacity.The heat transport device 1 includes: a vaporizer 2 for heating and vaporizing ...
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JP2012172866 |
To provide an ebullient cooling apparatus for reducing heat resistance.The ebullient cooling apparatus 1 includes: a hollow heat receiving part 3 for receiving heat from outside; a hollow heat radiation part 4 for radiating heat outside;...
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JP2012167866 |
To provide a boiling refrigerant type cooling device allowing use of a seal member on a joining portion between a cooling container and a heat exchanger.The boiling refrigerant type cooling device includes the cooling container 11 storin...
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JP2012167900 |
To provide a heat relay that facilitates switching modes of heating and cooling.This heat relay includes a first wickless heat pipe and a second wickless heat pipe respectively having first ends and second ends, both of the first ends of...
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JP2012163227 |
To provide a heat pipe that can more efficiently cool electronic components requiring inductance.A heat pipe 20 is a laminate 21 constituted by laminating flat plates includes: the laminate 21 formed by laminating flat plates and having ...
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JP2012160490 |
To provide a cooling device which enables, in a space-saving manner, a cooling method for reducing the temperature on an air intake side of an electronic device to be cooled, while enabling implementing various cooling methods.A cooling ...
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JP2012157821 |
To provide a hot-water washing system which can decrease the amount of heating by a boiler and produce hot-water with good thermal efficiency.The hot-water washing system 1 includes a hot-water tank 5 which heats washing water by steam o...
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JP2012154622 |
To provide an elliptical heat pipe having an excellent capillary force without blocking a vapor channel.A shaft 12 which is provided with a notch 15 of a predetermined shape is longitudinally inserted into a tubular container 10, metal p...
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JP2012154569 |
To improve the heat transport capacity of a heat pipe by minimizing a gap generated between a wick of mesh structure and a pipe inner wall in a flatly worked pipe.In the thin heat pipe, the wick of the mesh structure is arranged on the i...
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JP2012149786 |
To provide a combination method for heat dispersion modules enhanced in the yield and reduced in a manufacturing cost.At least one end of a heat pipe 2 is tightly pressed with a single time or a plurality of times of pressurizations to t...
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JP2012149819 |
To provide a loop heat pipe that includes a low-profile evaporation part that can be easily manufactured.The loop heat pipe includes: the evaporation part 20 for evaporating operating fluid by heat from a heating element; and a condensat...
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JP2012145404 |
To use a simple structure to excellently cool an ultrasonic sensor.A cooling device comprises: an ultrasonic sensor 4 which applies supersonic waves to a high-temperature body 1 to be checked in order to check a deterioration level; and ...
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JP2012145240 |
To provide a temperature control system that bonds a heat conduction plate and heat pipe with high bonding strength without allowing the heat pipe to be damaged by heat, and to provide a method of manufacturing the same.The temperature c...
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JP2012141094 |
To provide a thin, lightweight and flexible heat sheet with an easy structure and a suppressed manufacturing cost, the heat sheet maintaining performance thereof even when repeating bending thereof.The flexible heat sheet includes a plur...
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JP2012141082 |
To provide a technique in a cooling device of an electronic apparatus, the cooling device which can be miniaturized and is capable of contributing to component sharing.The cooling device is provided for cooling a heating element stored i...
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JP2012138439 |
To provide a heat pipe type cooling apparatus of power converter, capable of achieving reductions in its size and weight by making temperatures of heat receiving members with a power semiconductor element on uniform.The cooling apparatus...
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JP2012132582 |
To provide a thin sheet type heat pipe that has a thinner thickness than a conventional thin sheet type heat pipe and has high heat transport and diffusion performance.The thin sheet type heat pipe 1 is fabricated by enclosing a flow pas...
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JP2012132613 |
To provide a loop type heat pipe that is less likely to cause drying-out.A unit is employed where a primary wick 22 is inserted into an evaporator container 21 as an evaporator 20 in the loop type heat pipe, and sequentially a secondary ...
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JP2012132661 |
To obtain a cooling device capable of easily removing vapor bubbles so as to gain stable cool performance even if the vapor bubbles are generated in a liquid-phase working fluid.A cooling device includes: an evaporator 1 having a porous ...
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JP2012127642 |
To provide a thin film type heat pipe that can be suitably used for electronic equipment of a compact thin film structure.The thin film type heat pipe is produced by extrusion and comprises a body part having a flat plate shape, a penetr...
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JP2012127583 |
To prevent a pipe member from being damaged due to contact of the upper end of the pipe member in an excavation pipe with the excavation pipe, when extracting the excavation pipe from the excavation hole.The method for building the pipe ...
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JP2012122694 |
To provide a thin sheet-like heat pipe which is thin and very strong, and achieves high heat radiation efficiency even for a small light source.The thin sheet-like heat pump 10 includes: a container 11; working fluids (not shown) filled ...
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JP2012117786 |
To provide a heat pipe that is manufactured more easily.The heat pipe includes: a pipe body 12 having a sealed space 20 inside; and working fluid enclosed in the sealed space 20. The pipe body 12 includes: a heat generating part 14 that ...
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JP2012112373 |
To provide a multi-cooling device for a vehicle, which is capable of simultaneously cooling refrigerants for engine cooling, electric parts cooling, and a condenser, and also which is capable of satisfying reference cooling temperatures ...
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JP2012109604 |
To provide a highly efficient inexpensive contact member which can achieve a highly efficient cooling and can ensure high durability, and to provide a cooling device for an electronic apparatus, an electronic apparatus and an image formi...
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JP2012107801 |
To provide an air conditioning system capable of appropriately controlling introduction of outside air according to the temperature and humidity of outside air and further reducing power consumed in an air conditioning facility.An indoor...
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