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WO/2004/044966A1 |
An aligning method in a proximity exposure, wherein a first object is disposed close to a second object, and a pattern on the second object is transferred onto the first object using an electron beam or an X-ray. A first reference mask h...
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WO/2004/044967A1 |
Accuracy of position of a mask pattern is improved by reducing stress change in a thin film layer which occurs during a manufacturing process of a transfer mask. A method for manufacturing a transfer mask is characterized by comprising a...
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WO2002093253A9 |
A system (10) and method for performing alignemnt of a substrate (60) using alignment marks (66B) on the backside (64) of a substrate supported by a movable chuck (50) is disclosed. The system includes an imaging optical system (20) arra...
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WO/2004/038504A2 |
Photomask repair and fabrication with use of direct-write nanolithography, including use of scanning probe microscopic tips for deposition of ink materials including solgel and metallic inks. Additive methods can be combined with substra...
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WO/2004/034149A1 |
The invention relates to a lens, in particular to a projection lens which is used for microphotography for producing semiconductor components and which consists of several individual casing structures (4,5). Optical elements are arranged...
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WO/2004/034446A1 |
When performing pattern formation by complementary division, it is possible to preferably maintain the connection accuracy between the complementary division regions and suppress lowering of yield even if, for example, an undercoat shot ...
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WO/2004/031856A2 |
A photomask assembly is described having a frame for supporting a transparent pellicle above a photomask substrate, defining a closed pellicle space overlaying the substrate. The frame is formed of a porous material configured to allow t...
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WO/2004/032212A1 |
Two fixed guides (6) extending in the Y-direction of a stage device (1) are each provided with a Y-slider (7) driven by a linear motor (16). Two movable guides (21, 22) extending in the X-direction are laid across the two Y-sliders (7), ...
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WO/2004/023534A1 |
An alignment method capable of providing an alignment without providing an alignment mark on a mask and preventing a decrease in exposure throughput/latent image contrast; an alignment substrate and a production method therefore; an expo...
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WO/2004/021081A2 |
A first (20) and a second phase-shifting, semi-transparent layer (30) are formed on a substrate (10). First raised structure elements (80) on the substrate (10) with a first degree of transmission are formed therefrom by means of lithogr...
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WO/2004/019389A1 |
When detecting a mark position on a substrate, it is possible to accurately detect the mark position even if a waveform of an edge signal associated with the edge pair of the mark is asymmetric. In an image processing device (19), one or...
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WO/2004/019135A1 |
The present invention includes a method for aligning a workpiece with a known shape, including the actions of fetching said workpiece by means of a pick and place robot, providing a laser beam, detecting with a detector when a first posi...
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WO/2004/018443A1 |
Pellicles are provided, which are excellent in permeability to light of short wavelengths and endurance and usable even in photolithography with KrF excimer laser. A pellicle for exposure to light having a wavelength of 200 nm or below w...
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WO/2004/017140A1 |
A method wherein occurrence of defect of a thin film on which a mask pattern is formed is prevented and a high-quality mask blank is manufactured with high yield, a method for manufacturing a transfer mask by patterning the thin film of ...
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WO/2004/013904A1 |
Conventionally, a plurality of complementary division masks having an alignment mark are used to manufacture a semiconductor having patterns of layers, frequently causing misaligment of the layers. According to the invention, division al...
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WO/2004/008245A2 |
A method for inspecting lithography masks (108) includes generating integrated circuit design data (102) and using context information from the integrated circuit design data to inspect a mask.
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WO/2004/008246A2 |
A method for generating lithography masks 118 includes generating integrated circuit design data and using context information from the integrated circuit design data to write a mask 106.
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WO/2004/003469A1 |
Under a first state where the positional relation between a wafer W and an alignment sensor (14) is in a specified state, a main controller (20) irradiates an area in the vicinity of an alignment mark on the wafer W with a first imaging ...
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WO/2004/001820A1 |
An exposure apparatus includes a projection optical element that includes at least one reflection element and projects light from a reticle that forms a pattern onto an object, and a drive part that moves at least one of the reticle and ...
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WO/2004/001508A2 |
The present invention pertains to a method and apparatus to create two dimensional and three dimensional structures using a maskless photolithography system that is semi-automated, directly reconfigurable, and does not require masks, tem...
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WO2002079880A9 |
The invention relates to a method for optimising the overlay adjustment of two masking planes in a photolithographic process for the production of an integrated circuit comprising the following steps: Preparation of a substrate (S) with ...
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WO/2003/105217A1 |
It is easily determined that a wafer is located to a predetermined measuring position, and then a measurement instruction is outputted to a sensor controller, whereby a measurement can be commenced. There are provided wafer rotating mean...
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WO/2003/104746A1 |
A position measurement method includes a step of illuminating a mark formed on an object by an illumination beam, a step of imaging a beam generated from the mark via an observation system, and a step of processing the imaging signal so ...
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WO/2003/104929A2 |
Disclosed are methods and apparatus for analyzing the quality of overlay targets. In one embodiment, a method of extracting data from an overlay target is disclosed. Initially, image information or one or more intensity signals of the ov...
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WO/2003/102691A1 |
The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving ...
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WO/2003/094582A2 |
A system and method for fabricating an electrical circuit in which a digital control image (46) is generated by non-uniformly modifying (44) a representation of an electrical circuit (40), such that an electrical circuit pattern (72) rec...
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WO/2003/094212A1 |
An alignment system and an alignment method capable of achieving a higher-accuracy alignment, with an alignment mark position detected without interference with an exposure EB and without the need of tilting the optical axis significantl...
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WO/2003/090969A1 |
The invention relates to a device for positioning an element (2) with respect to at least two reference points (4a, 4c), in which said device (1) acts upon a working point on the element (2) to be positioned and comprises a positioning a...
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WO/2003/088319A2 |
Thinning and dicing substrates using inductively coupled plasma reactive ion etching (ICP RIE). When dicing, a hard photo-resist pattern or metal mask pattern that defines scribe lines is formed on a sapphire substrate or on a semiconduc...
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WO/2003/085456A2 |
The invention relates to a method for imaging a mask (1) onto a substrate (2) by means of an illuminating unit (8) and an optical unit (9). The invention also relates to a device for carrying out the method. The aim of the invention is t...
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WO/2003/083914A1 |
A position detection mark capable of surely detecting an object mark to be detected even when a plenty of similar marks are present in the vicinity of the object mark to be detected. The position detection mark (10) arranged on a photose...
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WO/2003/077030A2 |
A position detecting system including a detecting system for detecting positions, at different points on a surface of a reticle having a predetermined pattern formed thereon, with respect to a direction substantially perpendicular to the...
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WO/2003/075099A2 |
An optical measurement method and system are presented for imaging two target structures (T1, T2) in two parallel layers (L1, L2), respectively, of a sample (W), to enable determination of a registration between the two target structures...
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WO/2003/074966A1 |
A position detecting unit capable of detecting the position of an asymmetric low-step-difference-pattern mark with high precision. The position detecting unit comprises an optical system (7-14) for guiding light from a mark (WM) provided...
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WO/2003/071358A1 |
A system and method for repairing a photomask (52) for use in a photolithography process is disclosed, the photomask (52), consisting of a substrate layer (38) and a chrome layer (36) over the substrate layer (38), having a defect (42) i...
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WO/2003/071471A1 |
An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data (30) that contains overlay information relating the ove...
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WO/2003/069276A1 |
A position measuring method capable of correctly measuring the position information of a mark even if only part of the mark can be observed via an observation visual field or the mark is out of an observation visual field. An observation...
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WO/2003/065120A2 |
A microcontact printing tool having a print unit including a stamp head with a stamp and a wafer chuck for retaining a substrate. The stamp contained by the stamped head movable relative to the substrate by an actuator and a stage. A plu...
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WO/2003/065119A2 |
Overlay measurements for a semiconductor wafer (102) are obtained by forming a periodic grating (104) on the wafer having a first set of gratings and a second set of gratings. The first and second sets of gratings are formed on the wafer...
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WO/2003/062919A1 |
A method for photo-imageable lacquer deposition for a display device. In one embodiment, a layer of photo-imageable lacquer is deposited on top of a faceplate of a display device. Portions of the lacquer layer are removed and selected po...
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WO/2003/052803A1 |
A mask allowing an alignment of TTR method and a complementary division and having a high strength. A method for making the mask. A method for making semiconductor devices having high pattern accuracy. A stencil mask having, in four smal...
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WO/2003/046963A1 |
An exposure method and an exposure apparatus using a complementary division mask, wherein the alignment of the complementary division mask is achieved with high precision over all the regions of a semiconductor wafer. A semiconductor dev...
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WO/2003/042759A2 |
A method of manufacturing an optical device using a stepper photolithographic process, in which the device is defined on the surface of wafer substrate (420) using a plurality of image fields which are 'stitched' together during the step...
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WO/2003/021360A2 |
An optical monitor (108) includes a body (110) having a first plurality of parallel, substantially opaque, spaced apart lines (112) thereon, and the second plurality of parallel, substantially opaque, spaced apart lines (122) thereon, wi...
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WO/2003/019272A2 |
A mask for fabricating a liquid crystal display with a substrate includes a first mask pattern placed at the center of the substrate with the center line to expose the center of the substrate to light. A second mask pattern is placed to ...
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WO/2003/017006A2 |
A method is described for improving the exposure focus for modern steppers used in the lithography of semiconductor substrates such as wafers. A wafer (52) is sawed from a semiconductor ingot in a particular direction (50) relative to a ...
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WO/2003/014660A1 |
Two light beams are incident on the same position on a surface of an object (105) to be measured obliquely from upper sides facing each other, and positions at which the reflecting light beams are incident on respective predetermined det...
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WO/2003/010803A1 |
An exposure device (100) having a vertically movable stage device (120) and adapted to effect exposure by projecting a pattern recorded on a hologram mask (130) onto an exposure subject substrate (110) formed with a photosensitive materi...
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WO/2003/010802A1 |
A stage control system (19), while restricting a reduction in a control performance in one stage when an exposure operation is performed in that stage (WST1), performs an alignment operation in the other stage (WST2), thereby restricting...
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WO2001088467A9 |
A method for compensating data age in measurement signals from an interferometer includes measuring a value of the measurement signal and adjusting the measured value based on the measurement signal with a data age adjustment value to co...
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