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WO/2011/064239A1 |
The invention relates to a method (18) for quantitatively determining flux material residues remaining on a heat exchanger (3) after a preceding soldering process. To this end, a fluid is applied to the heat exchanger (3), wherein the re...
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WO/2011/063526A1 |
A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for clea...
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WO/2011/049187A1 |
Disclosed are a soldering device and soldering method whereby it is possible to can solder a tab lead to a solar battery cell in a short time without damaging the solar cell. The soldering device (100), which is used to solder a tab lead...
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WO/2011/040890A1 |
A self-illuminating soldering iron comprising on the one hand a grip (1) together with a soldering tip (2), and on the other hand a depositing support (3), which is adapted for depositing said grip (1) together with the soldering tip (2)...
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WO/2011/040313A1 |
A semiconductor chip (40) is bound to one main surface of an insulating substrate (60). A metal base plate (50) is bound to the other main surface of the insulating substrate (60). Subsequently, a resin case is fixed to the peripheral pa...
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WO/2011/037529A1 |
A method for controlling a brazing process, including the steps of applying a welding current through an electrode (52) pressed to a metal surface (83) of a workpiece to form a welding arc. Further steps are continuously measuring the we...
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WO/2011/036948A1 |
A nozzle for a heating device provides an improved heat exchange rate (heat transfer coefficient) without an increase in the output of a fan motor. Gas which is heated by a heater section or gas which is cooled by a cooling section is de...
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WO/2011/029907A1 |
The invention relates to a method for assembling at least two plates (2) using a brazing process, said plates (2) being separated by a filler material (3) situated therebetween. Said method comprises the following steps: - placing said t...
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WO/2011/026761A1 |
The invention relates to a device (1) for supplying inert gas in order to protect the surface (13) of a solder bath (12) in a wave soldering installation (11) against oxidation. The device (1) is in the form of a cover (2) which can be a...
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WO/2011/024813A1 |
Disclosed is a heating and melting treatment device which is capable of directly cooling an object to be treated, and which eliminates the need to dispose an additional cooling plate. Specifically disclosed is a heating and melting treat...
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WO/2011/022514A1 |
The present disclosure provides a solder dross removal apparatus (10) and methods useful for collecting and treating metal oxides (dross) formed in a soldering process, as well as for reclaiming solder from the dross. Among numerous othe...
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WO/2011/012175A1 |
A soldering apparatus for connecting solar cells (1) includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an ind...
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WO/2010/149189A1 |
According to the invention, the solder rod (22) comprises a stop-off (25) at the end (28) so that the solder cannot drip from an opening.
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WO/2010/147170A1 |
In brazing of a semi-sealed heat exchanger, while performing preferable brazing by applying a flux into a refrigerant chamber, brazing environment contamination due to dropping of the flux is minimized. In a brazing method for a heat exc...
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WO/2010/142725A1 |
The invention relates to a brazing crucible intended for a device for the partial brazing of electronic components through-mounted on a printed circuit, characterised in that said crucible is shaped as a right prism, preferably with a he...
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WO/2010/137616A1 |
A joined body comprising a first material (1) comprising a sintered body of a super-hard alloy and a second material (3) comprising a sintered body of cBN or a sintered body of diamond, wherein the first material (1) and the second mater...
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WO/2010/136259A1 |
The invention relates to a hand tool (1) including a regulator (3) and a system (2) for controlling the temperature of the regulator (3), wherein the system (2) for controlling the temperature of the regulator (3) includes a fluid circul...
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WO/2010/131752A1 |
Provided are a jet solder bath and a soldering apparatus, wherein an liquid level error can be reduced and soldering failures can be eliminated. An operating unit sets the liquid level of a melted solder (20). An arm (81) is at a level t...
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WO/2010/131751A1 |
Flux is supplied to the entire interior of a through-hole provided in a printed substrate, and the area coated by the flux is increased. A first and a second nozzle (11, 12) are adjacent to each other in the X direction, and so that the ...
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WO/2010/120836A1 |
A heating apparatus (20) for induction heating is disclosed. The heating apparatus may comprise a bearing ring (32), at least one bearing element (74) disposed in the bearing ring (32), and a braze material (80) adjacent to the at least ...
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WO/2010/116750A1 |
A high-frequency induction heating system for a soldering iron includes a power assembly capable of supplying power with various voltages and frequencies. A control assembly supplies power to a coil with voltages including the voltage ra...
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WO/2010/116664A1 |
A solder bath, inside which a primary jet nozzle and a secondary jet nozzle are disposed, is filled with molten Sn-Ag-Cu solder; the primary jet nozzle spouts molten solder in a disturbed state and the secondary jet nozzle spouts molten ...
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WO/2010/114482A1 |
The long thermode assembly for precision thermal bonding, comprises of a heating element, a thermally stable rigid electrical insulator pressure pad held by a rigid bar, air nozzle for cooling and maintaining the overall temperature of t...
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WO/2010/108284A1 |
A thermode comprising: a shank; a tip; and a transition zone between the shank and the tip, the transition zone configured to provide resistance gradients to improve containment of heat in the tip. The thermode may also include an integr...
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WO2010110341A1 |
Even when a nozzle with a small aperture is used in a localized jet solder tank, molten solder can be jetted locally and stably into a component mounted member, without lowering the rotational frequency of a pump in said localized jet so...
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WO/2010/103861A1 |
A method of soldering an electronic component, which is free of leftover solder existing between electrodes and allows a suitable amount of liquid solder to stick to the electrodes. A chip coil (1) is supported above the liquid solder su...
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WO/2010/102182A1 |
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relat...
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WO/2010/099851A1 |
The invention relates to a soldering head having two soldering electrodes made of an electrically conductive material for soldering solder contacts having low mass to the silver imprint of auto glass panes, wherein the two soldering elec...
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WO/2010/098921A2 |
High speed autofocus intereferometric inspection systems and methods are discussed in this Application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a syste...
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WO/2010/093031A1 |
A method of using a solder transfer sheet, which does not require position alignment, to form solder bumps on electrodes of a printed circuit board without forming a bridge. The solder transfer sheet comprises a support base on at least...
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WO/2010/087341A1 |
The height of molten solder which is jetted from the tip of a nozzle is made uniform. A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the m...
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WO/2010/088499A2 |
A method for attaching a fusible member (6) to a flexible circuit board (1) includes providing the flexible circuit board (1) including an electrode (3) and a hole (4) near each other, placing the fusible member (6) in the hole (4), and ...
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WO/2010/084946A1 |
Disclosed is a soldering device provided with a soldering tip having a front end and rear end. A blind bore is formed at the rear end of the soldering tip. An accommodating recess is formed at the bottom of this bore. A heater is arrange...
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WO/2010/082599A1 |
Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than th...
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WO/2010/069066A1 |
There is provided a method for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening defined in the circuit board. The method comprises ...
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WO/2010/066243A1 |
The invention relates to a process for producing a metal-ceramic compound which is repeatedly thermally cycled during use, in which metal and ceramic are soldered together over an area. Here, the metal and ceramic are arranged against on...
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WO/2010/063576A1 |
In a jetting device for ejecting droplets of a relatively hot fluid, a fluid chamber body is made of a heat resistant material and an inner surface of the fluid chamber body, the inner surface defining a fluid chamber of the jetting devi...
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WO/2010/064144A1 |
This invention provides methods and systems for brazing. One aspect of the invention provides a method of brazing cutter teeth. The method includes providing a bit body (402), pressing at least one cutter (404) against the bit body (402)...
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WO/2010/057953A1 |
A portable heating device comprising an elongated handle extending between a proximal end and a distal end, and adapted to be gripped by hand between a thumb and at least one finger thereof with the distal end extending in a direction ou...
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WO/2010/052871A1 |
Provided is an electronic device manufacturing method wherein a first terminal of a first electronic component and a second terminal of a second electronic component are bonded by using a solder and the first electronic component and the...
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WO/2010/051928A1 |
Shell-and-tube exhaust-gas heat exchangers comprise a cluster of parallel heat exchanger tubes in a cylindrical shell, which is closed off by end plates. The heat exchanger tubes must be brazed at both ends into corresponding openings i...
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WO/2010/046763A1 |
A semi-automatic brazing apparatus (100) has a brazing wire feeding apparatus (101 ) containing a brazing wire feed mechanism (107), a controller (105), and a user input device (109). The brazing wire (111 ) from a brazing wire source (1...
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WO/2010/040295A1 |
An online dross processor used for online processing dross produced in wave crest welding machine, has agitating unit (5) which is provided on wave crest welding machine. The agitating unit (5) is provided with agitating shafts (52, 53) ...
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WO/2010/035926A1 |
The present invention discloses a solder bath using a liquid induction pump so as to prevent the pulsation of molten solder and supply molten solder in the form of a stable wave. The solder bath comprises a storage tank around which heat...
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WO/2010/018680A1 |
Disclosed is a surface-mounting machine (10) that is suitable for electronic components having terminals to which the solder is already attached, and particularly for rear surface contact type electronic components. The machine is equipp...
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WO/2010/018674A1 |
Provided is a molten metal supply pipe with which the admixing of oxides produced on the surface of a solid-phase, low melting point metal material can be limited with a construction that is simpler than prior constructions. The molten m...
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WO/2010/015760A1 |
The invention relates to a control device and method for backside induction brazing. The control device for a brazing set comprises: a) means for keeping two workpieces (1; 3, 3') at least partly face to face, which two workpieces (1; 3,...
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WO/2010/015252A1 |
The invention relates to a soldering tip and to a method for producing a soldering tip for a soldering device comprising a heat-producing or heat-conducting base (1) which is coated with a wear coat (3). In order to increase the life tim...
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WO/2009/157876A1 |
A solder ball mounting module comprising a solder ball template (22) having an array of recesses (20), each recess being in communication with a vacuum source (35), and each arranged to receive a solder ball (15); wherein each recess fur...
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WO/2009/151123A1 |
Disclosed is a method for joining a substrate and an object to be mounted using a solder paste. In the method, the solder paste is mounted or applied between a metalized layer formed on the substrate and a metalized layer formed on the ...
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