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WO/2013/062992A1 |
A method of bonding together components (12,14), such as a tip (12) and a shaft (14) include mutually facing carbide end surfaces is described. The tip (12) includes circumferentially spaced flutes formed in its cylindrical outer periphe...
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WO/2013/062095A1 |
The present invention relates to a film which contains solder particles and a thermoplastic resin which can be dissolved by a solvent. In this reflow film, the solder particles are scattered throughout the film. Also provided is a solder...
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WO/2013/060635A1 |
Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed...
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WO/2013/057465A2 |
The present invention relates to a method of placing solder balls on a substrate, the method comprising: providing a substrate; providing a plurality of balls comprising solder; providing a ball placement stencil having an upper side and...
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WO/2013/038456A1 |
A reflow soldering device (10) is a device that carries out soldering by heating a printed circuit board (W) on which electronic components are mounted. The reflow soldering device (10) is provided with: a transport conveyor belt (14) th...
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WO/2013/033849A1 |
The invention relates to a feeding device (1) for a welding wire, with a drivable supply reel (2a, 2b) which is interchangeably seated on a drive shaft stub (5a, 5b) by means of a central through-bore (4) therein and is axially secured t...
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WO/2013/032030A1 |
An end processing method for processing an end of an electric cable (11) including a conductor (12) made from aluminum or an aluminum alloy and a sheath (13) covering the conductor (12) is provided. The end processing method includes ste...
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WO/2013/020290A1 |
A device (1) for wave soldering of workpieces (2), comprises a solder reservoir (3) for liquid solder (4) and at least one solder nozzle (5) with at least one solder outlet opening (5') above a solder level (4') of solder (4) in the sold...
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WO/2013/010748A1 |
The invention provides a carrier plate (11) with test surfaces (22, 33, 26) for assessing a selective soldering process. A method for the use of such a carrier plate is also protected. According to the invention, the carrier plate has va...
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WO/2013/008975A1 |
According to the present invention, a nitrogen gas purge kit for a brazing apparatus for a steam condensing heat transfer pipe for a generator comprises: a first plug inserted a certain depth into and coupled to a first opening of a clad...
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WO/2013/001659A1 |
A control device (20) for controlling a heating device having a plurality of heating zones is provided with a measurement temperature acquiring unit (23) which monitors the temperature of at least one reference zone from among the plural...
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WO/2012/173059A1 |
Provided is a solder paste capable of filling minute openings. The solder paste is printed on a substrate via a mask member in which open parts are formed. The viscosity of the solder paste is such that the paste can be fed to the open p...
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WO/2012/169275A1 |
A method for fixing an optical fiber according to the present invention includes a step (S103) for melting a solder preform (103) located on one side of an optical fiber (101) by means of heat transfer from a laser irradiated area (102b)...
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WO/2012/164776A1 |
In order to provide a soldering device which is capable, during soldering, of reducing defective solders in which air bubbles remain in the solder and which also has good cooling efficiency, this soldering device heats and melts solder b...
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WO/2012/161839A2 |
A solder tip having a bottom end. The bottom end includes a concave channel between a front side of the bottom end and. a back side of the bottom end. The concave channel has a substantially uniform cross- sectional shape.
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WO/2012/159241A1 |
A method for transporting solder spheres (110) comprises the following steps: providing a plurality of solder spheres (110) in a sphere chamber (102), blowing nitrogen gas into the sphere chamber (102) such that the solder spheres (110) ...
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WO/2012/157823A1 |
The present invention relates to an insulating body for a reflow device, and more specifically, to an insulating body for a reflow device comprising: an insulating material for blocking the entrance/exit of heat; an outer skin enshroudin...
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WO/2012/143777A1 |
The upgraded soldering unit comprises dosing and positioning means (5) for dosing and positioning a fusible metal material in correspondence to an area to be soldered and at least a heating and injection device (4) of a fluid in correspo...
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WO/2012/136478A1 |
In a device (1) for ejecting droplets of an electrically conductive fluid (5), vapor suppressing means (6) are provided to suppress vapor of the electrically conductive fluid. The vapor suppressing means comprise an electrode, adapted to...
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WO/2012/137049A1 |
The invention relates to a brazing system (200) has a first gas source (205), second gas source (210), a first enclosure (225), a second enclosure (230), a brazing torch (291), and a control system (296) configured to control a ratio the...
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WO/2012/132175A1 |
In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provid...
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WO/2012/118203A1 |
Disclosed is a method that is for joining an automobile window glass to an electricity supply terminal and that contains: a first step wherein, using a lead-free solder alloy, a solder layer is formed by heat welding to a predetermined l...
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WO/2012/116898A1 |
A solder wire applicator (1) serves to supply solder wire (3), composed in particular of soft solder, and flux (F) to a soldering point. The solder wire applicator (1) also has a device (6, 7), connected upstream of the wetting point (18...
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WO/2012/086533A1 |
In order to provide a reflow soldering apparatus wherein poor soldering, in which bubbles remain within soldering sections upon soldering, is reduced, a reflow soldering apparatus of the present invention, which solders electronic parts ...
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WO/2012/088057A1 |
An automated brazing system by which an apparatus (30) is conveyed along a path defined through a brazing zone (35) is provided and includes first (50) and second (52) sets of burners disposed within the brazing zone (35) at first and se...
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WO/2012/070264A1 |
In the present invention, when a power module (12) is soldered to a heatsink (15), steam which is temperature-adjusted to at least the melting point of a solder (13) is introduced from a steam generating tank (2) into the flow path provi...
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WO/2012/067752A1 |
A method of brazing an assembly ( 202 ) having at least two aluminum workpieces coupled at a joint includes applying a flame to the joint of the aluminum workpieces; monitoring the flame color; and upon detecting a change in the flame co...
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WO/2012/063386A1 |
Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive lay...
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WO/2012/058810A1 |
A soldering iron device includes a soldering iron (4), power cords, a machine platform (2) and at least one angle-adjustable bracket (3). One end of one angle-adjustable bracket is connected with the machine platform while the other end ...
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WO/2012/059322A1 |
The invention relates to a device (1) for ejecting droplets of an electrically non- conductive medium at a temperature of 360°C or above. The device (1) comprises a fluid chamber body (3), the fluid chamber body having a fluid chamber f...
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WO/2012/056667A1 |
The purpose of the present invention is to improve connection reliability by reducing fusion failures between solder bumps and a solder paste, in a circuit board and a component having solder bumps for connection when using a lead-free s...
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WO/2012/044611A1 |
A torch assembly (20) having features enabling single handed operation. The torch assembly (20) includes a flame control device that can be operated with a user's fingers while the user is holding the torch (20) with the same hand. A con...
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WO/2012/039610A1 |
The invention relates to a method and an apparatus for soldering electrical contacts in a solar panel, comprising a back sheet foil with a number of first contacts, a number of solar cells each having a number of second contacts, to be c...
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WO/2012/035943A1 |
A soldering device that solders electronic components onto substrates. As shown in figure 1, said soldering device is provided with: a blower mechanism (99) that is provided at a prescribed location along a conveyance path, which conveys...
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WO/2012/028852A1 |
The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten so...
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WO/2012/021120A1 |
A method for removing components from a printed circuit board by securing the printed circuit board and directing air onto the surface of the printed circuit board using a parameter such that the directed air source removes the a first c...
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WO/2012/018110A1 |
Provided is a solar cell element connecting apparatus for connecting solar cell elements using a tab lead line (T). The solar cell element connecting apparatus (1) is characterized in that a heating means for bonding, with heat, the tab ...
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WO/2012/013437A1 |
The invention relates to a method for stabilizing a concentration (10) of a constituent, in particular a Cu concentration (10), in a solder bath (34). The removal of the constituent from the solder bath (34) by attachment to the componen...
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WO/2012/011699A2 |
The present invention relates to a pencil-type solder, and the pencil-type solder of the present invention comprises: a soldering unit (50), into which a lead wire (3) is inserted, for heating the inserted lead wire (3) and discharging s...
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WO/2012/011698A2 |
The present invention relates to an arm-type solder for a connector, and the arm-type solder for the connector, according to the present invention, comprises: a coil portion (10) which encircles the outer circumferential surface of a soc...
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WO/2011/135737A1 |
Disclosed are a heating apparatus and a cooling apparatus, whereby a whole printed substrate can be uniformly and stably heated or cooled without minutely increasing or reducing the temperature of the printed substrate while the printed ...
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WO/2011/128624A1 |
An apparatus (10) for the production of brazed aluminium products on a continuous flow basis comprises, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15, 16) and a transportation means (25) for conveyi...
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WO/2011/125324A1 |
Disclosed is an apparatus (1) for manufacturing a heat exchanger which is provided with: a core tube (2); a winding tube (3); a rotating mechanism (10), which rotates the core tube (2) in the circumferential direction, said core tube bei...
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WO/2011/116093A2 |
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e...
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WO/2011/113703A1 |
The invention relates to a method for monitoring a performance of a jetting device, the jetting device being configured to expel droplets of an electrically conductive fluid wherein at least a part of the conductive fluid is positioned i...
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WO/2011/104229A1 |
The invention relates to a method for applying soft solder (4) to a mounting surface (10) of a component (11), wherein a) a connecting means (1) comprising a carrier layer (2) and a soft solder layer (4) formed by physical vapor depositi...
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WO/2011/105034A1 |
Disclosed is a soldering apparatus wherein, on the outer side of a jetting nozzle (303), which jets a molten solder pressure-fed from a solder bath (102) storing the molten solder, a solder drawing member (402) is removably attached, sai...
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WO/2011/090031A1 |
Disclosed is a solder powder adhering apparatus, which finely adheres a solder powder to an electronic circuit board. Also disclosed is a method for adhering the solder powder to the electronic circuit board. The apparatus for adhering t...
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WO/2011/076402A1 |
The invention relates to a pipe having a relatively high wall thickness and relatively large diameter, comprising a wall composed of at least two layers made of at least one first and one second metal sheet (1, 2), which are adhesively b...
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WO/2011/071041A1 |
Disclosed is a reflow furnace wherein, in order to prevent a vaporized flux from being adhered and solidified on motor rotating shafts for rotating fans disposed in a preheating zone, a main heating zone, and a cooling zone, the vaporize...
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