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WO/2015/086544A1 |
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...
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WO/2015/087771A1 |
Provided is an article with a metal oxide film, which has a novel configuration with color and metallic luster. Disclosed herein is an article with a metal oxide film, which is provided with a base that is formed of a metal material and ...
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WO/2015/080295A1 |
A carrier for polishing is formed from a composite material containing fibers oriented at least in one direction and resin material, and has a retaining hole for retaining a disc-shaped substrate when polishing a pair of main surfaces of...
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WO/2015/079440A1 |
A method of improving the reflectivity of a surface of an internal combustion engine, the internal combustion engine having a cylindrical or non-cylindrical internal wall of an internal combustion chamber in which one or more pistons mov...
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WO/2015/076227A1 |
A glass plate manufacturing method which manufactures a glass plate by holding the glass plate on a glass plate carrier that experiences planetary gear motion between a sun gear and a ring gear of a two-face polishing device, by insertin...
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WO/2015/076039A1 |
A method of polishing a face to be polished while supplying a polishing agent to the face to be polished comprises a rotating step of rotating a workpiece, and a polishing step of polishing the face to be polished with a polishing tool. ...
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WO/2015/072569A1 |
A method for manufacturing a glass substrate for a magnetic disk comprises polishing treatment for pressing main surfaces on both sides of a glass substrate by polishing pads, and relatively moving the main surfaces and the polishing pad...
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WO/2015/072050A1 |
This device for double-sided polishing of a workpiece is provided with: a turning lathe having an upper surface plate and a lower surface plate; a sun gear provided at the center of the turning lathe; an internal gear provided on the out...
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WO/2015/068672A1 |
Provided is a wetting agent for a semiconductor, the wetting agent comprising a water-soluble polymer that is substantially cationic group-free and that has 50 to 100 mol % of structural units derived from N-(meth)acryloyl morpholine.
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WO/2015/068707A1 |
The present invention addresses the problem of providing a polishing composition that makes it possible to polish in a uniform manner and at a high polishing speed while sufficiently suppressing dishing when polishing a printed wiring bo...
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WO/2015/063969A1 |
This carrier plate for a workpiece double-side polishing device is characterized by having one holding hole for holding a workpiece, and by being provided with a plurality of main grooves that, on at least the top surface of the carrier ...
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WO/2015/065793A1 |
A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successiv...
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WO/2015/060410A1 |
This method for producing a polishing liquid composition comprises a step for filtering a silica dispersion liquid to be processed, which contains colloidal silica, with use of a filter containing a filtration assistant. The colloidal si...
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WO/2015/059868A1 |
The present invention is a semiconductor wafer manufacturing method comprising a cutting step for cutting out a wafer by winding a wire to which abrasive grains are fixed around a plurality of grooved rollers, causing the wire to travel ...
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WO/2015/061741A1 |
In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a b...
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WO/2015/060293A1 |
This polishing liquid composition for silicon wafers contains 0.01-0.5% by mass of silica particles, a nitrogen-containing basic compound and a water-soluble polymer. The water-soluble polymer contains a constituent unit represented by g...
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WO/2015/059987A1 |
Provided is a polishing composition which processes an object to be polished that is composed of a SiC single crystal with higher efficiency than conventional ones while maintaining high processing accuracy. Polishing liquid contained in...
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WO/2015/056405A1 |
The present invention provides a dressing device for dressing a polishing-use foamed urethane pad by pressing diamond abrasive grains against the polishing-use foamed urethane pad and causing sliding contact therebetween, wherein the dre...
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WO/2015/056664A1 |
Provided is a polishing carrier, which comprises a laminated plate having substrate layers and resin layers, wherein the substrate layers comprise an assembly of organic fibers impregnated with resin, the resin layers comprise a resin no...
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WO/2015/057432A1 |
The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region...
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WO/2015/053207A1 |
A semiconductor wetting agent including an aqueous polymer having within a molecule 70-99 mol% of the structural unit represented by formula (1), and 1-30 mol% of the specific structural unit represented by formula (2). [-CH2CH(OH)-] (1)...
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WO/2015/052988A1 |
A polishing agent which contains water, abrasive grains containing a hydroxide of a tetravalent metal element, a polymerization product of α-glucose and a cationic polymer, and wherein the polymerization product of α-glucose has a weig...
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WO/2015/050260A2 |
Provided are: a polishing agent composition that contains silica particles, an alkali substance, a water-soluble synthetic polymer, and water, and that is characterized by the water-soluble synthetic polymer having structural unit (1), t...
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WO/2015/049942A1 |
An abrasive material comprising abrasive grains each of which contains a metal oxide as a core material, and in each of which a coating layer that comprises an oxide of a metal different from the metal contained in the core material or a...
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WO/2015/049829A1 |
A method which comprises supplying a cleaning fluid to the surface of an abrasive cloth for polishing a wafer and thereby cleaning the abrasive cloth, characterized by cleaning the abrasive cloth for eight or more hours while supplying a...
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WO/2015/051134A1 |
A retaining ring for a polishing system is disclosed. The retaining ring has a process-resistant coating over a portion thereof. The process-resistant coating is a thin, smooth, conformal layer that is resistant to wear and chemical atta...
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WO/2015/046203A1 |
A holding pad which is provided with a polyurethane resin sheet having a holding surface for holding an object to be polished. The storage modulus (E') of the polyurethane resin sheet at 40°C is 0.3-2.0 MPa, and the water absorption of ...
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WO/2015/046164A1 |
Provided is a polishing composition capable of efficiently reducing haze and surface defects. A polishing composition including a water-soluble polymer (ML-end) having a hydrophobic region in at least one end of the main chain is provide...
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WO/2015/046525A1 |
Provided is a method for producing non-magnetic substrate and containing an end-surface polishing process for polishing the end surface of a plate-shaped non-magnetic substrate having a chamfered surface formed between a lateral wall sur...
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WO/2015/046163A1 |
Provided is a polishing composition capable of efficiently reducing surface defects. A polishing composition including a water-soluble polymer (MC-end) is provided as a result of the present invention. The main chain of the water-soluble...
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WO/2015/048011A1 |
A multi-layered polishing pad arrangement includes a first polishing pad layer having a first top and a first bottom major surface, a second polishing pad layer having a second top and a second bottom major surface, and a coupling arrang...
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WO/2015/046015A1 |
A polishing composition according to the present invention can be used for polishing an object of interest having a polysilicon-containing layer, comprises abrasives grain and an oxidizing agent, and has a pH value of 6 or more. It is pr...
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WO/2015/046603A1 |
Provided is a silica abrasive with which there is no danger of scratching the object to be polished, and which does not cause a reduction in polishing speed. This silica abrasive has a ratio [(Si-OH)/Si] of silanol groups (Si-OH) within ...
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WO/2015/045757A1 |
The present invention provides a polishing composition having excellent storage stability. The present invention is a polishing composition comprising abrasive grains and an oxidizing agent containing a halogen atom, wherein a value (A/B...
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WO/2015/046090A1 |
Provided is a polishing composition with which an improvement in polishing rate can be achieved while suppressing the impact on surface quality, in relation to the polishing of silicon wafers. According to the present invention, a polish...
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WO/2015/040795A1 |
This invention provides a polishing-pad evaluation method for evaluating the length of the usable life of a polishing pad for polishing wafers, said polishing-pad evaluation method being characterized in that the amount of polishing resi...
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WO/2015/040979A1 |
The present invention is a polishing composition containing: silica having functional groups that satisfy at least one of the following conditions (1) and (2), the functional groups immobilized on the surface of the silica; and a pH adju...
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WO/2015/037606A1 |
A polishing pad provided with a plastic sheet, wherein after a prescribed polishing test, the polishing surface of the sheet has a roughness curve skewness (Rsk) of -2.00 to -0.20, and a height distribution variation coefficient of 0.5-2...
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WO/2015/037301A1 |
[Problem] The present invention addresses the problem of providing a polishing composition whereby it becomes possible to reduce the amount of a residual organic material to improve yield in the production of a semiconductor device. [Sol...
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WO/2015/032039A1 |
An optical fiber end face polisher comprises a polishing plate (1), a polishing plate rotation shaft (2), a connecting base (13), a gear plate (4) and a polishing plate revolution shaft (5). The connecting base comprises a tray (131) and...
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WO/2015/034006A1 |
The present invention provides a release sheet which is capable of imparting stiffness to a backing sheet laminate and improving the handling characteristics of the backing sheet laminate, and which prevents the formation of a depression...
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WO/2015/030050A1 |
Provided is a polishing method that is for polishing a wafer (W) held by a top ring and that comprises the following: (A) a polishing agent pre-supply step (S1) for supplying a polishing agent to a polishing pad (10) by using a polishing...
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WO/2015/030009A1 |
This polishing solution contains an abrasive, an additive, and water, wherein the abrasive includes a hydroxide of a tetravalent metal element, imparts a light absorbance of 1.00 or more with respect to light having a wavelength of 400 n...
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WO/2015/029294A1 |
Provided is a wafer polishing method that is practical and can reduce wafer loss due to dummy polishing and stabilize to a low level the number of light point defects (LPD) of a wafer for a product. This wafer polishing method has a poli...
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WO/2015/030032A1 |
Provided are: a temporary bonding layer laminate for semiconductor device production, which can easily provide a reliable temporary support for a device wafer when the device wafer is subjected to mechanical or chemical processing and is...
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WO/2015/029524A1 |
The present invention is provided with a polishing step for polishing a semiconductor wafer (W) using a polishing means (1), a measurement step for measuring the shape of the semiconductor wafer (W) using a measurement means (3) before t...
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WO/2015/026477A1 |
A lapping slurry and method of making the lapping slurry are provided. The lapping slurry comprises abrasive grains dispersed in a carrier. The carrier comprises water, ethylene glycol and between about 0.5 wt% to about 60 wt% surfactant...
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WO/2015/025469A1 |
The present invention is a two-side polishing method for a wafer, comprising a step of using a dressing plate to dress polishing cloth adhered onto top and bottom surface plates, and a step of polishing both sides of a wafer simultaneous...
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WO/2015/025852A1 |
A pressing mechanism of a polishing head (13), including: a first pressing body configured so as to include a first airbag (132) and a first pressure disc (134) formed so that a portion near the center of a contact surface which comes in...
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WO/2015/019848A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and dispersion stability. This slurry for CMP...
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