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WO/2015/159506A1 |
This invention provides a composition for polishing silicon wafers. Said composition, which excels at reducing haze on the surface of silicon wafers, contains abrasive grains, a silicon-wafer polishing accelerator, an amide-group-contain...
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WO/2015/159507A1 |
This invention provides a composition for polishing silicon wafers. Said composition, which excels at reducing haze on the surface of silicon wafers and exhibits superb filterability, contains a silicon-wafer polishing accelerant, an ami...
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WO/2015/152150A1 |
This polishing composition includes hydroxyethyl cellulose, water, and abrasive grains. The hydroxyethyl cellulose has a molecular weight of at least 500000, but not more than 1500000. The mass ratio of the hydroxyethyl cellulose to the ...
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WO/2015/153601A1 |
The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a pl...
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WO/2015/152149A1 |
The present invention includes hydroxyethyl cellulose, water, and abrasive grains. The hydroxyethyl cellulose has a molecular weight of at least 500000, but not more than 1500000. The proportion of the hydroxyethyl cellulose adsorbed on ...
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WO/2015/152151A1 |
The invention of the present application relates to: a polishing composition comprising water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and a NMR specific surface area of 10 m2/g or more; and a pol...
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WO/2015/152021A1 |
Provided is a method for polishing a single crystal substrate composed of gallium nitride GaN, which is a material that cannot be processed easily, by a CMP process with satisfactory polishing efficiency and satisfactory polishing perfor...
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WO/2015/151784A1 |
Provided are: a polishing pad with which an object to be polished can have high flatness imparted thereto and can be inhibited from having scratches; and a process for producing the polishing pad. The polishing pad includes, in a surface...
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WO/2015/152383A1 |
Provided are: a polishing composition which enables polishing at a high polishing rate in cases where the polishing composition is used for the purpose of polishing an object that is formed of a hard material; and a method for producing ...
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WO/2015/151673A1 |
The present invention provides a polishing composition suitable for the polishing of objects to be polished that have a layer containing a group IV material, the polishing composition making it possible to prevent the dissolution of the ...
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WO/2015/153597A1 |
The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of preci...
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WO/2015/152152A1 |
The present invention is provided with: an intermediate polishing step in which the surface of a semiconductor substrate is polished such that the number of surface defects having a height of less than 3 nm is at least 45% of the total n...
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WO/2015/151785A1 |
The purpose of the present invention is to provide a polishing pad, which reduces the problem of polishing scratches that occur due to foreign matter during polishing and which has excellent polishing rate and flattening properties, and ...
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WO/2015/144274A1 |
The invention relates to methods and to devices having brushing, grinding, and polishing tools (13) that rotate centrally or eccentrically and also simultaneously orbit in a planet-like and optionally oscillating manner. The continuously...
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WO/2015/146363A1 |
This polishing composition includes: abrasive grains of at least one type selected from calcium carbonate, barium carbonate, manganese dioxide, zirconia, and alumina; and a pH adjustment agent. The polishing composition has a pH of at le...
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WO/2015/146942A1 |
Provided is a polishing agent composition which enables both the achievement of high polishing rate and the achievement of good surface smoothness and good end face shape at the same time without using alumina particles. A polishing agen...
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WO/2015/146282A1 |
The purpose of the present invention is to provide a means with which impurities remaining on the surface of an object to be polished that has been subjected to chemical mechanical polishing (CMP) can be sufficiently removed. This polish...
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WO/2015/147011A1 |
A composition for silicon material polishing according to the present invention has a pH of 8-12, and contains abrasive grains, water, a compound expressed by formula (A), and a compound expressed by formula (B) (R1-R4 are selected from ...
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WO/2015/146941A1 |
Provided is a polishing agent composition which enables both the achievement of high polishing rate and the achievement of good surface smoothness at the same time without using alumina particles. A polishing agent composition which cont...
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WO/2015/146468A1 |
The present invention provides a polishing composition with which differences in the height of a SiN film can be sufficiently removed. This polishing composition is used for polishing an object to be polished having a surface which is po...
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WO/2015/141505A1 |
[Problem] To provide a polishing composition that can be used as an alternative to a polishing composition containing cerium oxide abrasive grains in STI and other such CMP applications, and to provide a polishing method and a method for...
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WO/2015/140850A1 |
Provided is a polishing composition which exerts high polishing speed and with which it is possible to stably polish a substrate having an organic layer in a short time. Also provided is a polishing method using said polishing compositio...
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WO/2015/141687A1 |
Provided are a slurry composition to be used in chemical mechanical polishing (CMP), and a method for polishing a substrate. This slurry composition contains water, abrasive grains, and an alkylene polyalkylene oxide amine polymer having...
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WO/2015/136832A1 |
The present invention is a polishing composition containing crystalline metal oxide particles as abrasive grains, said polishing composition being characterized in that the metal oxide particles are ones in which the half width value of ...
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WO/2015/137982A1 |
The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Za...
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WO/2015/136994A1 |
The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad which has a polishing layer comprising a...
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WO/2015/138552A1 |
Polyurea-based materials suitable for grinding media and polishing media, media including the polyurea-based material, and methods of forming and using the polyurea-based material and media are disclosed. The polyurea-based material is f...
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WO/2015/136840A1 |
The present invention is a method for manufacturing a double-sided polishing device carrier by lapping a double-sided polishing device carrier that is geared and has a holding hole for holding a semiconductor wafer, characterized in that...
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WO/2015/137233A1 |
The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad having, formed therein, a polishing laye...
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WO/2015/133516A1 |
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...
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WO/2015/134960A1 |
The invention pertains in general to a latching mechanism for maintaining desired friction levels on an optical disc in an optical disc restoration device. In particular the invention pertains to devices, systems and methods for easily m...
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WO/2015/129342A1 |
The present invention relates to a polishing composition used in applications in which a polishing object having a cobalt element-containing layer is polished, wherein the polishing composition contains a cobalt dissolution inhibitor and...
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WO/2015/129776A1 |
Provided are a polishing material having an excellent polishing speed for a cerium-free polishing material, and a method for easily producing this polishing material. A method for producing a composite metal oxide polishing material, cha...
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WO/2015/122072A1 |
Using a polishing solution without abrasive grains, a mirror finish chamfer polishing step is performed on a chamfered portion (11) of a semiconductor wafer (10) in which an oxide film (12A) is present on a front surface (12) or both fro...
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WO/2015/118927A1 |
[Problem] To polish the surface of an object material at a high removal rate and into a high-quality surface. [Solution] The object material is polished by wet polishing. A slurry comprises polishing abrasive particles dispersed in pure ...
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WO/2015/120194A1 |
A pressure-adjusting lapping element (132, 232, 332, 432, 532) is included as a structural component of a carrier assembly (130, 230, 330) in a lapping head (116). The lapping element includes actuator nodes (274, 474, 574) that permit f...
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WO/2015/115652A1 |
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...
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WO/2015/115653A1 |
The present invention provides a manufacturing method for a magnetic disk-use glass substrate which can sufficiently reduce substrate surface defects by suppressing the remains of washing off abrasive grains. In the present invention, a ...
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WO/2015/115043A1 |
The present invention provides a workpiece machining device wherein a workpiece is inserted into and held in a holding hole of a carrier, an upper surface plate is moved downward to a predetermined position so that the carrier holding th...
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WO/2015/107992A1 |
The purpose of the present invention is to provide a kit for producing a polishing composition, the kit enabling the production of a polishing composition that exhibits high pH maintainability, and the kit exhibiting excellent storage st...
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WO/2015/108113A1 |
The present invention relates to a polishing liquid production method in which the pH of the polishing liquid is 4 or less, said method comprising: a step for obtaining a solution by dissolving a polymerization initiator in an aqueous so...
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WO/2015/105055A1 |
A workpiece thickness measurement device is provided with: a liquid immersion device that immerses at least one part of a workpiece in a liquid after polishing; and two or more measurement devices that are arranged to face each other and...
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WO/2015/101316A1 |
A polishing pad and preparation method thereof, the polishing pad comprising more than two grooves (5), a polyurethane base material (1), a polyurethane fiber substrate (2), a polyurethane-ethylene adhesive PSA-A layer (3) and PSA-B laye...
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WO/2015/102552A1 |
The invention is on the method of processing multidimensional objects such as medical implants, heater surfaces or parts of vehicles and equipment operating in extreme environmental conditions with large and curved surfaces using chemica...
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WO/2015/102101A1 |
The present invention addresses the problem of providing a stable polishing composition with which a sufficient polishing rate can be achieved, and which exhibits little change in performance even if used repeatedly. This polishing compo...
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WO/2015/098197A1 |
An abrasive which comprises a liquid medium, abrasive grains including a hydroxide of a tetravalent metallic element, a first additive, a second additive, and a third additive, wherein the first additive is at least one type selected fro...
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WO/2015/098777A1 |
Provided is a wetting agent for a semiconductor substrate, said wetting agent including hydroxyethyl cellulose and water, wherein the hydroxyethyl cellulose has a radius of gyration of 56-255 nm inclusive and a contact angle of 10-32° i...
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WO/2015/097947A1 |
This double-sided workpiece polishing apparatus is provided with a rotating surface plate having an upper surface plate and a lower surface plate, a sun gear, an internal gear, and a carrier plate provided with at least one holder openin...
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WO/2015/098271A1 |
The problem to be addressed by the present invention is to provide a porous body with which cells are less readily closed up during dress processing or polishing. The present invention pertains to: a porous body characterized by being ob...
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WO/2015/095489A1 |
A polishing cushion for realizing a plurality of types of polishing with a single polishing apparatus. A polishing cushion according to one embodiment includes a first outer layer facing one out of a polishing member and a support member...
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