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WO/2014/158872A1 |
A system and method are disclosed for polishing and lubricating an aluminum welding wire. The system and method draw stock aluminum wire from a spool, subject the stock wire to a plurality of drawing and thermal treatment steps to obtain...
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WO/2014/150884A1 |
Described herein are compositions, kits and methods for polishing sapphire surfaces using compositions having colloidal aluminosilicate particles in an aqueous acidic solution. In some aspects, the methods for polishing a sapphire surfac...
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WO/2014/148399A1 |
Provided is a polishing composition that contains a water-soluble polymer having a molecular structure that contains a plurality types of repeating units having different SP values, in which an etching rate and abrasive grain adsorption ...
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WO/2014/147969A1 |
The present invention is a template assembly for holding a workpiece when the workpiece is polished, the template assembly being characterized in having a PET substrate, an annular template part bonded to the outer periphery part of the ...
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WO/2014/149676A1 |
In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift...
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WO/2014/141889A1 |
The present invention provides a polishing pad provided with a polishing member having a polishing surface, the polishing member containing a material having dilatancy characteristics.
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WO/2014/139954A1 |
Methods of producing an elastomer are disclosed that include (I) applying an actinic radiation curable composition preferably selected from a urethane (meth)acrylate, an allophanate urethane (meth) acrylate or a lactone-containing (meth)...
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WO/2014/131937A1 |
The invention relates to obtaining an abrasive product comprising a backing layer and an abrasive layer, wherein the backing layer comprises propylene homopolymer or copolymer.
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WO/2014/131936A1 |
The invention relates to obtaining an abrasive product comprising a surface with multiple abrasive zones supported by a backing layer. The abrasive zone are surrounded by interconnected channel portions comprising first channel portions ...
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WO/2014/132641A1 |
The present invention provides a mechanical chemical polishing composition for cobalt, said composition combining low static etching properties for cobalt and a high polish rate therefor and exhibiting a high selectivity for cobalt, name...
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WO/2014/128754A1 |
A chemical mechanical polishing apparatus in which a rotating head having a polishing pad mounted thereon is caused to press against and contact the surface of an article to be polished mounted face-up on a table, caused to rotate and po...
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WO/2014/129328A1 |
Provided is a polishing composition which is capable of polishing a sapphire substrate having a non-polar or semi-polar surface with a high polishing rate. The present invention is a polishing composition which is used for the purpose of...
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WO/2014/129304A1 |
A method for processing a wafer in which: a wafer is obtained by slicing a semiconductor monocrystal ingot using a wire saw apparatus; one surface of the wafer is ground flat using, as a reference surface, a flat surface obtained by appl...
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WO/2014/129408A1 |
Provided is a polishing composition including abrasive grains, a water-soluble polymer, and water. The water-soluble polymer includes a polymer (A) in which the adsorption ratio based on a predetermined adsorption ratio measurement is le...
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WO/2014/129708A1 |
Disclosed is a wafer processing apparatus. The wafer processing apparatus includes a first surface plate on which a plurality of carriers is arranged, a first gear arranged at the central region of the first surface plate and engaged wit...
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WO/2014/126051A1 |
Provided is a polishing composition which includes abrasive grains, a water-soluble polymer, and water. Measured using dynamic light scattering, the volume average particle size (DA) of particles included in the polishing composition whe...
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WO/2014/125797A1 |
A rigid sheet which comprises both a nonwoven fabric made of ultrafine fibers and a polymeric elastomer applied to the nonwoven fabric, exhibiting a JIS-D hardness of 45 or more, an R% of 0 to 20%, and a total content of ions causing a c...
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WO/2014/125759A1 |
The present invention provides a manufacturing method for a double-sided polishing device carrier manufactured by fitting and gluing an insert material, which contacts the rim of a wafer that is held during polishing, in a holding hole, ...
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WO/2014/124554A1 |
A method to produce sol gel abrasive particle with controlled aspect ratio, drying the gel on a PTFE film belt with punched holes, the hole has a rectangular shape. This abrasive material has high abrasive performance and its manufacturi...
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WO/2014/122992A1 |
The present invention addresses the problem of providing core/shell-type inorganic particles contained in a polishing material allowing a high polishing speed on harder polishing objects and suppressing the amount of cerium used, and red...
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WO/2014/122976A1 |
The problem addressed by the present invention is to provide a polishing material slurry that can obtain a high polishing speed and superior durability, and that suppresses the amount of cerium oxide used. The polishing material slurry c...
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WO/2014/123236A1 |
In order to reduce a root-mean-square roughness Rq of minute undulations in wavelength of 50 to 200 μm on a principal surface of a glass substrate, this method for manufacturing a magnetic disk substrate includes a polishing process in ...
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WO/2014/122978A1 |
The object of the invention is to provide a method for producing an abrasive that minimizes the amount of cerium oxide used, makes it possible to obtain a high polishing rate for an object to be polished having greater hardness, and make...
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WO/2014/122982A1 |
The problem to be solved by the present invention is to provide a polishing slurry that makes it possible to reduce the amount of cerium oxide used, does not cause clumping of polishing particles during long-term storage, has outstanding...
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WO/2014/118860A1 |
The present invention pertains to a carrier for a double-side polishing apparatus, particularly, a carrier which is to be disposed between the upper and lower surface plates of a double-side polishing apparatus, both surface plates beari...
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WO/2014/119367A1 |
The purpose of the present invention is to provide: a polishing pad which is not susceptible to deterioration due to moisture absorption in a moisture-absorbing environment, while having excellent polishing characteristics, service life ...
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WO/2014/119390A1 |
The purpose of the present invention is to provide a polishing pad which comprises a polishing layer having a triple phase separation structure and has a high polishing rate and excellent planarization characteristics, while being capabl...
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WO/2014/119598A1 |
The present invention facilitates replacement of polishing pads and inhibits the polishing table from suffering a thermal damage. This polishing device (100) is equipped with a polishing table (110) having a receiving surface (110a) to w...
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WO/2014/116491A1 |
A polishing pad (200, 800, 1000) for polishing a substrate, the polishing pad comprising: a polishing body (200A, 1112) having a polishing side (201A) opposite a back surface (201B, 1116) and a polishing surface (200B, 1002, 1114) compri...
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WO/2014/115495A1 |
One aspect of the present invention pertains to a method for manufacturing a glass substrate for a hard disk, the method being provided with a polishing step for polishing the glass substrate using a polishing slurry that contains abrasi...
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WO/2014/112845A1 |
An embodiment of the present invention provides a plate provided at a dual side wafer grinding device for grinding a wafer. The plate includes: a plurality of first plate grooves formed in a first direction; and a plurality of second pla...
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WO/2014/112418A1 |
Provided is a polishing solution for metal intended for polishing at least part of a metal, which includes: (A) an amino acid, (B) a 1-hydroxybenzotriazole, (C) a compound with a benzotriazole skeleton (except 1-hydroxybenzotriazole), (D...
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WO/2014/112218A1 |
Provided is an article provided with a novel surface having a texture different from the prior art. This article with a metal-oxide-containing film is provided with a substrate and a metal-oxide-containing film provided on the surface of...
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WO/2014/106944A1 |
This method for polishing an alloy material is for polishing an alloy material including a principal component and at least 0.5 mass% of an element constituting an accessory component having a Vickers hardness (HV) that differs from that...
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WO/2014/103985A1 |
A polishing process involves a process for arranging a glass substrate and a carrier between a sun gear (40) and an internal gear (50), and a process for polishing the surface of the glass substrate by rotating the carrier in a state in ...
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WO/2014/103725A1 |
This aqueous dispersion for chemical mechanical polishing is characterized by containing (A) colloidal silica, (B) an anionic water-soluble polymer, and (C) at least one alkanolamine salt that is selected from the group consisting of alk...
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WO/2014/103284A1 |
One aspect of the present invention is a method for producing a glass substrate for an information recording medium, which is characterized in being provided with a polishing step which, in a state in which polishing fluid is supplied up...
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WO/2014/103494A1 |
Provided is a polishing composition which can minimize the surface scratching of a metal substrate, namely an object to be polished, while suppressing the dishing of the metal substrate. The present invention is a polishing composition t...
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WO/2014/103483A1 |
This polishing pad production method includes steps for forming grooves on the surface of a polishing layer comprising a flexible polyurethane foam. The flexible polyurethane foam has an Asker D hardness of 30 or less at 25°C. The afore...
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WO/2014/103484A1 |
This method for producing layered circular polishing pads includes: a step for forming, on a circular polishing sheet, concentric grooves and a peripheral area that is at least 1/2 of the groove pitch of the concentric grooves; and a ste...
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WO/2014/103296A1 |
The present invention relates to a method for manufacturing a glass substrate for hard disks, said method being characterized by comprising at least a roughly grinding step, a finely grinding step of carrying out a grinding procedure usi...
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WO/2014/103984A1 |
A process (18) involves a process for arranging a carrier and a glass substrate on a surface plate, a first sliding process for polishing the surface of the glass substrate by rotating the carrier using a sun gear and an internal gear, a...
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WO/2014/103640A1 |
The purpose of the present invention is to provide a circular polishing pad with which polishing marks on the surface of a material to be polished can be effectively minimized. This circular polishing pad includes a circular polishing la...
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WO/2014/103986A1 |
This manufacturing method of a glass substrate for use in an information recording medium involves: a process for preparing a glass substrate containing a crystallized glass material and having a main surface and an end surface, an end s...
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WO/2014/099812A1 |
A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing plate is positioned coaxially with the re...
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WO/2014/097887A1 |
Provided is a high-quality substrate wettability-promoting composition that is free of or almost free of impurities. The present invention contains a hydrophilic component composed mainly of a cellulose derivative, and a solvent componen...
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WO/2014/087771A1 |
The purpose of the present invention is to provide a polishing pad that hardly generates scratches on a surface of a subject to be polished. This polishing pad is characterized in that: the polishing pad is provided with a polishing laye...
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WO/2014/084096A1 |
The purpose of the present invention is to provide a reinforced glass in which the strength of the glass is prevented in an effective manner from decreasing after reinforcement. The present invention pertains to a reinforced glass charac...
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WO/2014/084091A1 |
This polishing composition comprises: a polyvinyl alcohol resin which is a copolymer of a monomer represented by general formula (1) and a vinyl ester monomer and has a 1,2-diol structure in a side chain; an organic acid; and abrasive gr...
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WO/2014/080729A1 |
The purpose of the present invention is to provide a polishing pad, which hardly generates scratches on a surface of a subject to be polished, and which has a longer service-life. This polishing pad is characterized in that: the polishin...
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