| Document |
Document Title |
|
WO/2017/175894A1 |
According to the present invention, a method for manufacturing a polishing pad comprises the steps of: mixing a plurality of polymers so as to generate a urethane prepolymer having a viscosity of 20,000 cps (25°C) to 40,000 cps (25°C);...
|
|
WO/2017/177072A1 |
A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or "standing proud" of the rest of the surface, and uniformly distributed ...
|
|
WO/2017/169154A1 |
Provided is a set of compositions for polishing with which it is possible to achieve a high-quality polished surface by reducing haze. This set of compositions for polishing is provided with: a finish polishing composition to be used in ...
|
|
WO/2017/171262A1 |
The present invention relates to a carrier head for a chemical-mechanical polishing apparatus comprising a substrate receiving member. The carrier head according to the present invention comprises: a base; a substrate receiving member ha...
|
|
WO/2017/170179A1 |
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...
|
|
WO/2017/169055A1 |
Provided is a polishing pad with which it is possible, when polishing an object to be polished that has a convex part and/or a concave part on the surface thereof, to adequately polish the portion near the convex part and/or the inner su...
|
|
WO/2017/169995A1 |
The polishing composition for alloy materials according to the present invention is for polishing alloy materials and comprises aluminum oxide particles and water, the aluminum oxide particles having a volume-based cumulative particle di...
|
|
WO/2017/170135A1 |
Provided are: a composition for abrasive finishing use, which rarely undergoes the oxidation of magnetic particles contained therein; and a magnetic abrasive finishing method. The composition for abrasive finishing use (1) comprises: mag...
|
|
WO/2017/170062A1 |
Provided is a polishing composition for polishing materials to be polished having a Vickers hardness of at least 1500 Hv. This polishing composition contains alumina abrasive and water. The isoelectric point of the alumina abrasive is le...
|
|
WO/2017/169743A1 |
[Problem] To provide a polishing composition which is used for polishing of a polishing object having a layer that contains a metal, and which is capable of achieving sufficient planarization. [Solution] A polishing composition which is ...
|
|
WO/2017/171052A1 |
[Problem] To provide a carrier which makes it possible to obtain a high-quality substrate at a higher yield than conventional ones and a substrate manufacturing method using this carrier. [Solution] A carrier 104 according to the present...
|
|
WO/2017/169808A1 |
[Problem] The purpose of the present invention is to provide a technique which, when polishing an object to be polished that contains (a) a material having a silicon-nitrogen bond and (b) another material, can improve the ratio of the po...
|
|
WO/2017/170061A1 |
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...
|
|
WO/2017/169124A1 |
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...
|
|
WO/2017/163847A1 |
The present invention provides a polishing composition suitable for polishing a polishing subject having a layer that includes a group III-V compound, and with which it is possible to suppress etching of the group III-V compound and poli...
|
|
WO/2017/163910A1 |
[Problem] To provide a polishing composition that can adequately remove defects remaining on the surface of a polished object, and that can make the polishing speed of different materials approximately the same when polishing an object t...
|
|
WO/2017/163942A1 |
The present invention provides a polishing composition for objects to be polished that have a metal-containing layer, the composition being capable of achieving sufficient planarization. The present invention is a polishing composition u...
|
|
WO/2017/165216A1 |
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive ...
|
|
WO/2017/158955A1 |
According to the present invention, whether wafer polishing is completed is determined with high accuracy for each wafer. A wafer processing method according to the present invention comprises: a first step for acquiring the initial stat...
|
|
WO/2017/159213A1 |
The present invention provides a method for manufacturing a carrier for dual-surface polishing devices, the method characterized by comprising: a preparing step for preparing a carrier base material and an insertion material having a lar...
|
|
WO/2017/160344A1 |
Systems and methods of in-situ calibration of semiconductor material layer deposition and removal processes are disclosed. Sets of test structures including one or more calibration vias or posts are used to precisely monitor processes su...
|
|
WO/2017/155081A1 |
[Problem] To enable precise planarizing with a compact device without causing damage to a workpiece while also effectively suppressing the occurrence of vibrations during device activation. [Solution] This planarizing device is provided ...
|
|
WO/2017/150118A1 |
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...
|
|
WO/2017/150157A1 |
Provided are: a silicon substrate polishing method which is capable of reducing PID; and a polishing composition set which is used in this polishing method. A silicon substrate polishing method according to the present invention comprise...
|
|
WO/2017/150158A1 |
Provided are: a polishing method which is applicable in common to a plurality of silicon substrates that have resistivities different from each other; and a polishing composition set which is used in this polishing method. A silicon subs...
|
|
WO/2017/150114A1 |
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The presen...
|
|
WO/2017/146006A1 |
In this polishing method, a disc-shaped polishing pad (1) is used. In the axial direction of the polishing pad (1) disc, a peripheral surface (111) on a polishing surface (10) side is a tapered surface whose diameter decreases towards th...
|
|
WO/2017/141812A1 |
This surface plate for finish polishing, on which a polishing film is to be mounted, is provided with: a plate body having a planar surface; and a plurality of island-like projections formed on the surface of the plate body, wherein a co...
|
|
WO/2017/138308A1 |
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...
|
|
WO/2017/138564A1 |
The present invention is a polymer body or the like containing a polyurethane resin that is provided with first constituent units derived from a compound containing a hydroxyl group, and with second constituent units derived from a compo...
|
|
WO/2017/139079A1 |
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...
|
|
WO/2017/134914A1 |
This method for polishing both surfaces of a wafer includes: clamping a wafer (16) with a donut-shaped upper platen (12) and a lower platen (13) each having a center hole in a central portion thereof and each having a polishing cloth (11...
|
|
WO/2017/134919A1 |
The purpose of the present invention is to provide a single-side polishing method for a silicon wafer capable of significantly improving the generation rate of minute step defects. The single-side polishing method for a silicon wafer acc...
|
|
WO/2017/133124A1 |
A substrate polishing apparatus, comprising an object platform (10), a lifting platform (20), and a polishing head (30). The lifting platform (20) is located above the object platform (10) and can move upward or downward with respect to ...
|
|
WO/2017/130749A1 |
A polishing composition including abrasive grains, an additive, and a water-soluble polymer, wherein the polishing composition has a ratio of D50 (after) to D50 (before) of less than 2.0; here, D50 (before) is the D50 value of particles ...
|
|
WO/2017/127221A1 |
Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads pro...
|
|
WO/2017/126268A1 |
Provided is a polishing composition which enables the formation of a surface having smoothness and reduced defects. The polishing composition contains a water-soluble polymer that meets the following requirements (A) and (B): (A) the ads...
|
|
WO/2017/125987A1 |
The present invention is a wafer polishing method wherein the rear surface of a wafer is held by a polishing head via a back pad adhered to the polishing head, and the front surface of the wafer is polished by having the front surface in...
|
|
WO/2017/118361A1 |
A chemical-mechanical polishing machine (100) is provided, including: a plurality of polishers (10) spaced apart from one another, each polisher (10) including: a bracket (11), a polishing head (12) and a platen (13), the polishing head ...
|
|
WO/2017/117404A1 |
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.
|
|
WO/2017/110315A1 |
Provided is a polishing composition and a method for polishing a silicon substrate capable of realizing a polished surface having high flatness. The polishing composition contains abrasive grains, including silica. The silica includes bo...
|
|
WO/2017/110262A1 |
[Problem] To provide a carrier for double side polishing that allows a desired edge roll-off to be formed intentionally during double side polishing of a wafer and a wafer polishing method using same, and a manufacturing method for epita...
|
|
WO/2017/104285A1 |
[Problem] To suppress variations in the shape of the portion of the wafer outer periphery remaining after polishing, regardless of how much a polishing pad has been used. [Solution] A wafer polishing method for polishing one surface of a...
|
|
WO/2017/098691A1 |
The present invention is a method for double-sided polishing of wafers in which a double-sided polisher is used, wherein: a carrier that has not yet been set in the double-sided polisher is subjected, in advance, to two-stage double-side...
|
|
WO/2017/098535A1 |
A device for polishing or abrading products (M), comprising: a polishing element (1) provided with an operating surface (4) designed to perform a polishing or sanding movement, preferably a circular or orbital movement; and motor means (...
|
|
WO/2017/098696A1 |
The present invention is a polishing method with a polishing step for polishing the surface of a wafer, which is held by a polishing head, by rubbing the wafer on the surface of a polishing fabric that is bonded to a surface plate while ...
|
|
WO/2017/085904A1 |
The present invention provides a polishing composition containing abrasive grains, characterized in that: the surfaces of the abrasive grains have been modified by two or more organic compounds; the two or more organic compounds each hav...
|
|
WO/2017/081835A1 |
The present invention is a polishing agent for synthetic quarts glass substrates which comprises abrasive grains and water, characterized in that the abrasive grains comprise a mixture of wet-process ceria grains and dry-process ceria gr...
|
|
WO/2017/077691A1 |
A wafer polishing method of the present invention is characterized by having: a measuring step for measuring the depth PDt of a recessed section of a template after taking out a polishing-completed wafer, said measuring step being to be ...
|
|
WO/2017/079196A1 |
Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer h...
|
