| Document |
Document Title |
|
WO/2017/073265A1 |
A method for polishing both sides of a semiconductor wafer according to the present invention comprises: detecting a load current value of a sun gear or a load current value of an internal gear when both sides of the semiconductor wafer ...
|
|
WO/2017/072919A1 |
Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and reali...
|
|
WO/2017/073556A1 |
A wrapping material having a fabric configured from a warp or a weft, and a resin impregnated into the fabric.
|
|
WO/2017/074773A1 |
Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to com...
|
|
WO/2017/073318A1 |
[Problem] To provide a wafer polishing device with which it is possible to enhance the uniformity of the polishing amount in the wafer surface. [Solution] A wafer polishing device 1, provided with a rotating platen 21 to which a polishin...
|
|
WO/2017/069202A1 |
Provided is a polishing composition that can suppress surface defects and reduce haze. A polishing composition that includes: abrasive grains; at least one type of water-soluble polymer selected from among vinyl-alcohol-based resins that...
|
|
WO/2017/069253A1 |
Provided is a polishing composition that can suppress surface defects and reduce haze. A polishing composition that includes: abrasive grains; at least one type of water-soluble polymer selected from among vinyl-alcohol-based resins that...
|
|
WO/2017/066420A1 |
Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an ext...
|
|
WO/2017/065951A1 |
Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer...
|
|
WO/2017/066077A1 |
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has ...
|
|
WO/2017/062719A1 |
The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a ...
|
|
WO/2017/061077A1 |
The present invention pertains to a measurement method for a template characterized by comprising: a step for preparing a measurement wafer and measuring the thickness of the measurement wafer; a step for placing the template on a refere...
|
|
WO/2017/061109A1 |
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...
|
|
WO/2017/061229A1 |
[Problem] The present invention provides a means capable of achieving a further improvement in polishing speed, for use in a polishing composition. [Solution] The polishing composition according to the present invention contains abrasive...
|
|
WO/2017/056392A1 |
The present invention is a method for conditioning a polishing pad, which is affixed on a rotatable disc-shaped surface plate and is for polishing wafers, using a conditioning head. The polishing pad conditioning method is characterized ...
|
|
WO/2017/057155A1 |
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...
|
|
WO/2017/057156A1 |
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...
|
|
WO/2017/057478A1 |
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...
|
|
WO/2017/056636A1 |
The present invention relates to a method and a device for polishing the surface of a substrate having film thickness unevenness in the circumferential direction of the substrate. Disclosed is a polishing method whereby: film thickness d...
|
|
WO/2017/053685A1 |
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may b...
|
|
WO/2017/051629A1 |
Provided are: a cerium-based abrasive material which is inexpensive and has excellent production efficiency and which, when used in polishing the surface of, for example, a glass substrate, has a high polishing rate and is effective in i...
|
|
WO/2017/047604A1 |
A composite substrate manufacturing method of the present invention comprises: (a) a step of mirror-polishing a piezoelectric substrate side of a bonded substrate which comprises a piezoelectric substrate and a support substrate bonded t...
|
|
WO/2017/047307A1 |
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the ra...
|
|
WO/2017/043139A1 |
Provided is a polishing liquid comprising a liquid vehicle, abrasive grains, and a polymer. The polymer has a first molecular chain where functional groups are directly bonded and a second molecular chain branched from the first molecula...
|
|
WO/2017/038032A1 |
This polishing method performs a polishing process by causing a wafer held by a holding means to make a sliding contact with a polishing cloth attached to a surface plate while a refrigerant is supplied to a refrigerant flow path provide...
|
|
WO/2017/034157A1 |
The present invention relates to an organic film CMP slurry comprising an oxidant and a solvent. The organic film CMP slurry of the present invention has a ΔθW, of approximately 5-90°, which is the amount of change in water contact an...
|
|
WO/2017/033280A1 |
[Problem] To provide a grinding tool, which can be configured so that the overall metal fiber or metal powder volume fraction is uniform and of a high density while limiting production cost even when the tool has a large surface area, in...
|
|
WO/2017/033409A1 |
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abr...
|
|
WO/2017/030873A1 |
Grinding, lapping and polishing basically work by making scratches in the body being ground, lapped or polished. The scratches typically are linear. The scratches gives rise to a directionality component of friction: the friction coeffic...
|
|
WO/2017/030874A1 |
A machine featuring a treatment tool that grinds a surface to a desired profile, imparts a desired roughness to that surface, and removes contamination from the surface, the machine configured to control multiple independent input variab...
|
|
WO/2017/030945A2 |
A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and ...
|
|
WO/2017/019134A1 |
Described embodiments can be used in semiconductor manufacturing and employ materials with high and low polish rates to help determine a precise polish end point that is consistent throughout a wafer and that can cease polishing prior to...
|
|
WO/2017/019906A1 |
A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to...
|
|
WO/2017/013935A1 |
Provided is a polishing pad capable, when polishing an object to be polished that has a protrusion and/or recess on the surface, of adequately polishing the parts near the protrusion or the inner surface of the recess on the surface of t...
|
|
WO/2017/011183A1 |
A device and method of breaking in a chemical mechanical planarization (CMP) polishing pad using multiple pad conditioners to break-in and maintain a condition of the polishing pad.
|
|
WO/2017/002433A1 |
Provided is a wetting agent for polishing, containing a water soluble polymer of which the main chain portion is formed of a repeating unit consisting of a carbon-carbon bond and of which the polydispersity index (PDI) represented by wei...
|
|
WO/2017/001511A1 |
The invention relates to a machine for producing balls (12), comprising (a) a rotary drive (14) and (b) at least one tool (16) which is connected to the rotary drive (14) by means of a mounting (28) in order to be rotated and which has a...
|
|
WO/2017/002705A1 |
Provided is a polishing composition for polishing a material having a Vickers hardness not lower than 1500 Hv. This polishing composition contains first alumina abrasive grains having an average secondary-particle diameter D2f and second...
|
|
WO/2016/208301A1 |
Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liqu...
|
|
WO/2016/208101A1 |
The present invention provides a sizing device which is disposed in a grinding device and which measures, by laser optical interference, the thickness of a wafer being ground. The sizing device is characterized in comprising: a light sou...
|
|
WO/2016/208445A1 |
Provided is a polishing method with which it is possible to sufficiently remove impurities present on an object to be polished. An object to be polished that has an organic film on the surface thereof is polished using a polishing compos...
|
|
WO/2016/203586A1 |
A polishing agent for mechanochemically polishing a substrate, which comprises a carbon-based material containing 60-95 atm% of carbon when measured by X-ray photoelectron spectroscopy and an insulating material, and removing at least a ...
|
|
WO/2016/204248A1 |
Provided are abrasive grains and an abrasive slurry that make it possible to achieve both higher polishing speed and surface smoothness on hard, brittle materials such as sapphires. Abrasive grains to be used to polish hard, brittle mate...
|
|
WO/2016/200833A1 |
Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the ad...
|
|
WO/2016/199340A1 |
The present invention is a polishing composition which contains zirconium oxide as abrasive grains, and which is characterized in that: the pH thereof is 11.0 or more but less than 12.5; and the element concentrations of sodium, magnesiu...
|
|
WO/2016/199333A1 |
Provided is a workpiece machining device that has: a center drum that can rotate around a rotation shaft and has at least one first groove formed in the shaft direction in the outer peripheral surface; a carrier that has a holding hole i...
|
|
WO/2016/199672A1 |
[Problem] To provide a composition for glass and ceramic polishing, which has excellent applicability to CMP polishing, while being composed of polishing material particles having a uniform particle size, thereby having no concerns about...
|
|
WO/2016/194614A1 |
This invention enables a high polishing speed in the polishing of ceramics that are used in electronic devices and include an oxide crystal, or the like, by suppressing the occurrence of defects such as scratches. A polishing composition...
|
|
WO/2016/196360A1 |
Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is slope...
|
|
WO/2016/190128A1 |
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...
|
