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WO/2015/019849A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and cleaning performance. This slurry for CMP...
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WO/2015/020082A1 |
The present invention relates to a polishing method for an article to be polished that has a designated shape, and specifically relates to a polishing method using a polishing tool characterized by having a polishing pad with a polishing...
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WO/2015/019877A1 |
The present invention addresses the problem of providing: a polishing material containing polishing material particles having high productivity and suitable for accurate polishing; and a polishing material slurry. This polishing material...
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WO/2015/019911A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and dispersion stability. This slurry for CMP i...
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WO/2015/019820A1 |
[Problem] The purpose of the present invention is to provide a composition for polishing capable of improving the smoothness of an alloy material surface, obtaining surface having high luster, significantly reducing scratches and the lik...
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WO/2015/019706A1 |
[Problem] To provide a method for producing a polished object which is capable of reducing the haze level of the surface of an object to be polished, while effectively reducing defects. [Solution] A method for producing a polished object...
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WO/2015/017138A1 |
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body (222) having a density of less than 0.5 g/cc and composed ...
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WO/2015/015706A1 |
The present invention is a dressing method for dressing a polishing pad, which polishes a wafer that is affixed on a surface plate, by pressing and sliding brushes and plates on the polishing pad, the dressing method being characterized ...
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WO/2015/015705A1 |
This invention is a wafer polishing method, namely an indexed polishing method in which a plurality of polishing heads, a plurality of platens to which polishing cloths are bonded, and a loading/unloading stage for attaching and detachin...
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WO/2015/012118A1 |
The purpose of the present invention is to diminish scratches during polishing while ensuring a moderately high polishing rate. The invention provides: silica for CMP, the silica satisfying the following (A) to (C); an aqueous dispersion...
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WO/2015/008572A1 |
Provided is a metallic polishing pad allowing the area coming in contact or in extreme close proximity with a catalyst to be increased on a surface to be processed. A metallic polishing pad (2) for smoothing a surface (6a) to be processe...
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WO/2015/009605A1 |
A chemical mechanical polishing (CMP) system includes a substrate held in a substrate holder having a substrate retaining ring, the substrate having a peripheral edge supported by the substrate retaining ring, the retaining ring includin...
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WO/2015/008586A1 |
Disclosed is a substrate manufacturing method that includes: a step for polishing a surface of a material substrate; and a step for forming a planarization film on the surface of the material substrate after polishing the surface of the ...
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WO/2015/005433A1 |
Provided is a polishing composition which enables the improvement in a polishing rate while rarely affecting the quality of a surface. Provided is a polishing composition comprising abrasive grains, water and a quaternary ammonium cation...
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WO/2015/005200A1 |
[Problem] To provide a means which is capable of reducing level difference defects such as dishing, while maintaining a high polishing rate, and which is also capable of improving storage stability with respect to a polishing composition...
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WO/2015/006742A1 |
A retaining ring for a substrate polished in a chemical mechanical planarization process includes a backing ring having a tool mounting side and one or more removable segments mounted on a mounting side. The removable segments have a fro...
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WO/2015/006745A1 |
The invention provides a polishing pad conditioner that has removable and refurbishable and or replaceable conditioning segments. In various exemplary embodiments, the conditioning segments include a ceramic substrate that has a layer of...
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WO/2015/002152A1 |
The present invention provides a carrier which is used for processing of a substrate for magnetic disks having good durability, and which is capable of reducing the occurrence of scratches or the like during the processing. A carrier acc...
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WO/2015/002199A1 |
A polishing pad including a resin-containing polishing cloth obtained by impregnating a polishing cloth base with a polyurethane resin and silicon carbide, wherein the silicon carbide has a grain diameter within a range of 0.2 to 3.0 μm...
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WO/2015/001939A1 |
Disclosed is a precision polishing method for polishing a surface to be polished of a workpiece (14) by rotating a polishing surface plate (11) that has a polishing pad (10) attached to the upper surface thereof, and pressing said surfac...
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WO/2014/208762A1 |
The present invention provides a manufacturing method for a glass substrate used for a magnetic disk or the like, with which the surface roughness of the main surface of the glass substrate can be reduced from the current level. Accord...
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WO/2014/208379A1 |
The present invention addresses the problem of providing an abrasive containing abrasive particles which is highly producible, is appropriate for precision polishing, and is capable of maintaining the polishing speed of the initial polis...
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WO/2014/208400A1 |
This method for producing an SiC substrate comprises at least a CMP step wherein an Si surface (1a) and a C surface (1b) of an SiC substrate (1) are subjected to double side polishing by a Chemical Mechanical Polishing (CMP) method at a ...
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WO/2014/208414A1 |
The present invention addresses the problem of providing: a cerium oxide abrasive containing cerium oxide abrasive particles produced by a synthesis method using a rare-earth-salt aqueous solution and a precipitant, the cerium oxide abra...
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WO/2014/208270A1 |
Provided is a method for manufacturing glass substrates for information-recording media with which variation in the shape of the glass substrates within a single carrier can be limited by performing strict temperature control of the surf...
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WO/2014/198712A2 |
The invention relates to a recess grinding device (1) having at least one holding device (10) for holding a specimen (20) and at east one abrasive ball (11, 11b, 11c) which can be set rotating by drive means (12) and can be guided by mea...
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WO/2014/199739A1 |
Provided is a polishing liquid for CMP, which contains abrasive grains that contain a cerium-based compound, a 4-pyrone-based compound, a polymeric molecule having an aromatic ring and a polyoxyalkylene chain, a cationic polymer, and water.
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WO/2014/200726A1 |
The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of 0.1 µm to 10 µm.
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WO/2014/196299A1 |
Provided is a composition for silicon wafer polishing, which is used in the presence of abrasive grains. This composition contains, a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-cont...
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WO/2014/196128A1 |
The present invention is a method for manufacturing a polishing head provided with: a backing pad for holding the reverse surface of a workpiece, the backing pad being affixed to the lower part of a rigid body; and a ring-shaped template...
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WO/2014/195167A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) elemental germanium or (ii) Si1-xGex with 0.1 ≤ x < 1, wherein the CMP composition (Q) consists essentiall...
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WO/2014/192224A1 |
This index-type polishing method uses multiple polishing heads (6, 7, 8, 9) and multiple surface plates to which a polishing cloth (17) is adhered, and simultaneously polishes multiple wafers (W), held by the polishing heads, by rotating...
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WO/2014/189039A1 |
This template (44) is made of carbon graphite or other carbon fibers and has through-holes (44a) that contain semiconductor wafers (W). Said template is laminated to a support plate (42) with a back pad (43) interposed therebetween. Said...
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WO/2014/189086A1 |
Provided are: a chemical mechanical polishing pad which is capable of achieving a good balance between improvement of flatness of a polished surface in CMP and reduction of polishing defects (scratches); and a chemical mechanical polishi...
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WO/2014/189038A1 |
This semiconductor-wafer-holding jig (44) is made of carbon graphite or other carbon fibers and has through-holes (44a) that contain semiconductor wafers (W). Said semiconductor-wafer-holding jig serves as a template and is laminated to ...
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WO/2014/185285A1 |
The purpose of the present invention is to provide a means which is capable of improving the polishing rate and the polishing selectivity of a phase change compound. The present invention is a polishing composition which contains: an org...
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WO/2014/185003A1 |
The present invention is a workpiece polishing device comprising a polishing cloth for polishing a workpiece, a polish supply mechanism for supplying polish, and a polishing head for holding the workpiece; the polishing head holding the ...
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WO/2014/185008A1 |
The present invention is: a method for double-sided polishing of a wafer using a plurality of double-sided-polishing devices for polishing both sides of a wafer simultaneously while holding a wafer retained in a carrier between upper and...
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WO/2014/178417A1 |
The present invention provides a method for manufacturing a glass substrate for a magnetic disc, the method enabling an improvement in shape accuracy for an end surface of the glass substrate and enabling high-quality finishing. In the p...
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WO/2014/175397A1 |
A CMP polishing solution for polishing ruthenium metals. Said CMP polishing solution contains abrasive particles, an acid component, an oxidant, and water. The acid component contains at least one species selected from the group consisti...
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WO/2014/175393A1 |
A CMP polishing solution for polishing ruthenium metals. Said CMP polishing solution contains abrasive particles, an acid component, an oxidant, a triazole compound, a quaternary phosphonium salt, and water. The acid component contains a...
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WO/2014/173934A1 |
A method of lapping a super-hard material product having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product with a surface of the super-hard material product in contact with a ...
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WO/2014/167900A1 |
This method for producing a polishing pad produces a polishing pad having a polishing layer comprising a flexible polyurethane resin foam sheet, and includes: a step (A) for cooling a block comprising the flexible polyurethane resin foam...
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WO/2014/165447A1 |
An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa•m0.5 may include a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body compr...
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WO/2014/163026A1 |
The present invention provides a manufacturing method for magnetic disc glass substrates such that micro-waviness in a range of 50 - 150 μm in a profile can be reduced. In the present invention, the amount of sinkage into a polishing pa...
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WO/2014/165394A1 |
A pad for supporting an abrasive disc by being fixed with the abrasive disc to a shaft of a grinder, the pad including a supporting surface opposing the abrasive disc. In a radial direction, an outer edge of the supporting surface is loc...
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WO/2014/156114A1 |
An aspect of the present invention provides a method for manufacturing a glass substrate for an information recording medium, including a polishing process for polishing the surface of the glass original plate by causing the glass origin...
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WO/2014/158892A1 |
Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also ...
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WO/2014/156840A1 |
Provided is a polishing pad, which is capable of limiting reductions in polishing pad polishing rate by limiting clogging of the polishing surface, and which is also long-lived. The donut-shaped polishing pad (7), which is equipped with ...
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WO/2014/156798A1 |
Provided is a method of manufacturing a glass substrate for an information recording medium, the method enabling fluctuations in the thickness of the glass substrate to be reduced. The method of manufacturing a glass substrate for an inf...
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