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JP6948868B2 |
A polishing apparatus which can measure a film thickness with high accuracy without affecting a polishing rate of a wafer is disclosed. The polishing apparatus includes: a polishing head configured to press a wafer against a polishing pa...
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JP6949424B2 |
The present invention provides a polishing pad. The polishing pad is configured to properly supply polishing liquid between the polishing pad and a processed object. The polishing pad is a polishing pad in a circular plate shape installe...
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JP2021154477A |
To provide a polishing device which can adjust a surface temperature of a polishing pad without generating a defect such as a scratch and contamination on a substrate.A polishing device includes: a polishing table 2 which supports a poli...
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JP6946166B2 |
To provide a polishing device achieving reduction of a use amount of a CMP polishing slurry.A polishing device 100 for continuous polish of a metal on a surface of a sheet-like article to be polished 101 having a metal on a surface while...
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JP2021146498A |
To provide a polishing liquid supply device that stably supplies a slurry, can reduce the amount of polishing liquid used, and can suppress or prevent the influence of used polishing liquid and by-products on the quality and/or polishing...
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JP2021146496A |
To provide a grinding liquid supply device in which the clogging of a whetstone is improved in the processing of a metal product by whetstone grinding, the continuous processing continuation becomes possible even if a whetstone cut amoun...
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JP2021137927A |
To maintain a rate at which a substrate is polished and reduce amounts used of polishing liquid.A polishing device 1 includes a polishing table 20 for supporting a polishing pad 100, a polishing head 30 for holding a substrate WF, and a ...
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JP6934580B1 |
To provide a method for regenerating a water-soluble coolant which changes a used coolant into a state in which it can be easily separated into an oil phase, an aqueous phase and a solid substance. A coolant in which water particles have...
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JP2021133431A |
To provide a processing fluid transfer system capable of supplying a free amount of fluid, without restriction of a transfer amount of the processing fluid, having a less number of movable parts, having a simple structure and long servic...
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JP6931845B2 |
To provide a work polishing device that has excellent diffusibility of slurry over the whole polished surface of a surface plate, accordingly can polish a work with excellent uniformity even with a small amount of slurry, thereby reducin...
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JP2021115694A |
To provide a rotor disk and a double-sided processing machine such that it is possible to further optimize the edge geometry of workpieces and in particular to further reduce the wear of rotor disks.A rotor disk 24 for guiding workpieces...
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JP6901905B2 |
To reduce workload on an operator while securing safety in producing polishing liquid.A method for producing polishing liquid that is used for a polishing device 1 includes: a step of supplying a solvent with a predetermined weight to an...
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JP6881376B2 |
To provide a slurry nozzle for a wire saw capable of making slurry flow at a constant amount, without varying in a wire with a simple structure.A slurry nozzle 5B for a wire saw installed in a wire saw device and supplying slurry to a wi...
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JP6869516B1 |
To provide a fluid polishing apparatus capable of polishing in a short time with a simple structure and less uneven polishing. A fluid polishing apparatus 10 is for polishing an inner surface of a through hole by flowing a polishing flui...
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JP6858543B2 |
To provide a method of forming a holding surface of a holding table which can form a holding surface by grinding the holding surface without making grind chips enter an inside of a porous plate.In a method of forming a holding surface of...
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JP6837859B2 |
A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water includin...
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JP6836491B2 |
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods incl...
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JP2021028067A |
To provide a mirror surface steel plate grinding fluid manufacturing device.A mirror surface steel plate grinding fluid manufacturing device includes a body, an inlet, which opens upward, is provided in the body, a mixing space is so pro...
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JP2021012152A |
To provide a method of accurately evaluating hydrogen embrittlement resistance, etc. of metal materials while preventing cracking associated with intrusion of hydrogen during a polishing process.A metal material evaluation method is prov...
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JP2021009979A |
To prevent foreign matter from being accumulated on an inner wall surface of a gas-liquid separator.A gas-liquid separator 60 includes: a gas-liquid separation tank 61 that has an introduction port 61a for introducing a fluid, a liquid o...
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JP6822432B2 |
A single side polishing method for a wafer is provided, and the method is capable of obtaining a wafer having the desired ESFQD precisely. In the present invention, the polishing method for a wafer includes: a first step (step S10) of ca...
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JP6817947B2 |
A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the sol...
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JP2021003798A |
To provide processing equipment capable of reducing inner surface roughness of a workpiece.Processing equipment includes: a polishing liquid supply system 11 that supplies a surge-pressured polishing liquid; guide elements 12 and 12' tha...
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JP6806085B2 |
An object of the present invention is to provide an abrasive slurry regeneration method capable of efficiently regenerating an abrasive slurry having a high polishing rate. The abrasive slurry regeneration method is an abrasive slurry re...
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JP2020199600A |
To provide a polishing liquid from which abrasive grains having high adhesiveness and a very small size and abrasive grains having a size that may cause scratches are removed.According to one embodiment, a supply device is provided that ...
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JP6791553B2 |
To stop supply of grinding water before the grinding water overflows to prevent damage of a spindle unit.A spindle unit (42) includes: a spindle (55) formed with a through passage passing through its center; a mount (43) in which a grind...
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JP2020188103A |
To provide a wafer manufacturing method, which can solve the problems of the strictness of management of a polishing liquid and the troublesomeness of a process for polishing liquid discard, and which can reduce the causes of generation ...
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JP2020530946A |
Examples include a process chamber; a polishing stage located in the lower region of the process chamber and where the wafer is placed; a polishing unit placed on the edge of the polishing stage and polishing the wafer; placed in the upp...
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JP6717691B2 |
Disclosed is a substrate processing apparatus that includes: a polishing table; an atomizer configured to spray a fluid to a polishing surface; a polishing liquid supply nozzle configured to drop a slurry at a position that corresponds t...
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JP6706644B2 |
According to the present invention, there is provided a slurry supply system including: a slurry mixing unit configured to mix slurry; a slurry supply unit in which the slurry mixed in the slurry mixing unit is stored and configured to s...
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JP6708305B2 |
In a method of polishing a silicon wafer, a final polishing step includes an upstream polishing step and a subsequent finish polishing step. In the upstream polishing step, as a polishing agent, a first alkaline aqueous solution containi...
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JP6698921B1 |
To provide a technical means capable of stably supplying a polishing liquid having a desired concentration to a CMP polishing apparatus. A blending flow path 40 is arranged immediately before a liquid delivery port 79 leading to a CMP po...
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JP2020066072A |
To provide a fluid polishing device simple in structure, hardly generating polishing unevenness and capable of polishing in a short time.A fluid polishing device 10 has a function polishing the inner face of a through-hole Mh formed insi...
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JP2020066096A |
To keep a state of a polishing pad surface uniform.A polishing head 302 for holding a substrate WF to be polished is provided. The polishing head 302 comprises a rotary head 304 that is rotatably constituted, and a stationary head 306. T...
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JP6685707B2 |
The invention discloses a grinding device. The grinding device comprises a chuck work bench, which is used to maintain a wafer; a grinding unit, which is provided with a grinding pad disposed opposite to the wafer and used to grind the w...
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JP6667032B1 |
To provide a technical means for obtaining a higher quality polishing liquid. A blending flow path 40 is arranged immediately before a liquid delivery port 79 leading to a CMP polishing apparatus 8. The compounding flow path 40 is the fl...
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JP6652202B2 |
A carrier for a double-side polishing apparatus configured to double-side polish providing a semiconductor silicon wafer. The carrier being disposed between upper and lower turn tables have a polishing pad attached, and includes a holdin...
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JP6639283B2 |
The present invention is to provide a defect detection method capable of properly judging injection failure of an additive. A defect detection method for detecting defective injection of an additive in a processing liquid supply device (...
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JP6639971B2 |
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JP6635453B1 |
To efficiently remove solids such as sludge and oils such as impure oil contained in a coolant liquid after being used in a machine tool to regenerate a clear coolant liquid, and to use a filter paper for removing solids. To provide a sl...
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JP6632417B2 |
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JP2020003083A |
To provide a system capable of supplying heating fluid and cooling fluid with a desired temperature adjusted to a heat exchanger at a desired flow rate, while suppressing increase in cost and installation space.A system 30 comprises: a h...
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JP2019217568A |
To be able to suppress time required for cleaning a work-piece already processed.The processing method for processing a work-piece comprises: a holding step ST1 of holding a work-piece with holding means; a processing step ST3 of process...
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JP6622578B2 |
The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemi...
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JP6619777B2 |
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JP2019181577A |
To realize a rotary joint of a grinding device which can inhibit deterioration of a seal member and a packing.A rotary joint 1 of a grinding device according to one embodiment of the invention includes: a pipe 2 for grinding fluid that i...
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JP2019528187A |
The polishing system consists of a platen with an upper surface, an annular polishing pad supported on the platen, a carrier head for holding the substrate in contact with the annular polishing pad, and a support structure from which the...
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JP6588337B2 |
A slurry and/or chemical blend supply apparatus (20) comprising a blend module (200) that combines two or more flowing component streams (A, B, C) to form a blended slurry and/or chemical blend in a pipe (217), wherein said blend module ...
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JP2019166588A |
To provide a high-quality polishing device configured to avoid influences of use frequencies at which slurry is reused and change in polishing rate depending on an environment, in performing polishing at low costs while reusing polishing...
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JP2019126746A |
To provide a processing device that can reduce a risk of draining processing waste liquid that does not meet a drainage standard.There is provided a processing device including: holding means for holding a workpiece; and processing means...
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