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JP2024053358A |
An object of the present invention is to provide a wire saw that can uniformly supply machining fluid to a wire row. [Solution] A plurality of wire guides 2 that are rotationally driven, wires 3 that are wound around the wire guides to f...
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JP7466006B2 |
Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each c...
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JP7464416B2 |
A waste liquid treating device includes a holding section that holds an adhesion plate, a vertically moving mechanism that moves the holding section vertically, and a peeling mechanism that peels off water-containing swarf from the adhes...
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JP7464088B2 |
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JP2024043555A |
[Problem] To propose a new technique for polishing without using conventionally used polishing liquid. [Solution] A holding table that holds a workpiece, a polishing head that is disposed above the holding table and has an acrylic plate ...
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JP2024042397A |
An object of the present invention is to provide a method for regenerating a used abrasive slurry that improves the removal rate of constituent components of an object to be polished contained in the used abrasive slurry. [Solution] A me...
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JP7440183B2 |
This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least ...
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JP2024508561A |
Chemical mechanical planarization (CMP) systems, apparatus and methods comprising: providing a source of CMP slurry; and directing at least one source of mechanical or electromagnetic energy to the source of CMP slurry. modifying a sourc...
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JP2024023654A |
The present invention provides a system for supplying fluid for a grinder/polisher, a grinder/polisher, and a method for controlling the fluid supply device. A method and apparatus for controlling a fluid supply device in a metallurgical...
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JP2024016941A |
An object of the present invention is to provide a grinding device which is highly economical by reducing the displacement of an exhaust means. [Solution] A chuck table 6, a moving means 55 for moving the chuck table 6 between a loading/...
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JP2024017196A |
[Problem] To adjust extremely humid air to an appropriate humidity and then discharge it. [Solution] An electrical component, an air cooling unit that supplies a first gas to the electrical component to cool the electrical component, and...
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JP2024503978A |
Provided herein are advanced substrate polishing methods that use machine learning artificial intelligence (AI) algorithms or software applications generated using AI to control one or more aspects of a polishing process. . An AI algorit...
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JP2024012279A |
The present disclosure relates to the use of water vapor for cleaning or preheating during chemical mechanical polishing. A water vapor generation device (410) includes a barrier (426) within a canister (420) that divides the canister (4...
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JP7424768B2 |
Provided is a method for filtering an additive-containing liquid that can achieve a polishing composition exhibiting excellent defect reducing capability while maintaining a practical filter life. The method for filtering a polishing add...
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JP2024011635A |
An object of the present invention is to provide a gas-liquid separation device and a processing device that do not allow waste liquid sucked by a workpiece holding surface to flow into a suction source. [Solution] A control unit (150) o...
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JP2024009903A |
A method and system for making a chemical composition using a mixing tank is provided. The present invention includes mixing a plurality of continuous streams of material to form a chemical composition in a mixing tank 20, wherein each c...
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JP7418885B1 |
[Problem] It is possible to wrap a filter material around the rotating drum of a filtration unit and a backwash unit almost all the way around the circumference, and to obtain a filtration capacity twice that of the conventional wrapping...
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JP2023552256A |
The present invention is an embedding press for automatically embedding a sample in an embedding material, comprising: a pressurizing unit having a pressurizing cylinder; a charging device for charging the embedding material; a sample lo...
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JP2023173586A |
To remove a polishing liquid adhering to an upper surface of a chuck table base easily.A chuck table 31 is removed from a chuck table base 33 to expose a support surface 330 and the exposed support surface 330 is cleaned by a polishing p...
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JP7372882B2 |
A slurry supply device 1 comprises a tank 11. The tank 11 includes a space 11a around a rotation axis RA which crosses a vertical direction. Moreover, the supply device 1 comprises an inflow portion (inflow passage 71) which causes slurr...
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JP7372442B2 |
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended o...
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JP7367705B2 |
A polishing agent regenerating method in which a component of a polished material is removed from polishing agent slurry and a polishing agent is collected and regenerated is shown. The method includes at least, polishing, polishing agen...
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JP2023155151A |
To provide a substrate treatment system capable of supplying a treatment liquid including highly concentrated microbubbles to a substrate to be treated without generating large bubbles on the way to a supply line of the treatment liquid....
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JP2023132254A |
To provide a polishing device, a polishing pad and a polishing method which can easily supply a slurry to an interface between a polished surface of a polishing object and a polishing pad.A polishing device includes: a polishing pad whic...
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JP2023126746A |
To provide a technology related to temperature control during chemical mechanical polishing.A chemical mechanical polishing apparatus 20 includes: a platen 24 for holding a polishing pad 30; a carrier head 70 for holding a substrate agai...
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JP7341223B2 |
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.
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JP2023537561A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP2023115061A |
To provide a rotor disc, and a double-sided processing machine capable of: further optimizing the edge geometry of workpieces; and further reducing the wear of the rotor discs in particular.A rotor disc 24 for guiding workpieces 28 in a ...
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JP2023534608A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP2023534119A |
A method for cutting a plurality of slices from a work piece by a wire saw during a series of cutting operations divided into an initial cut and subsequent cuts, the wire saw having a wire array and a drive of a movable wire section of t...
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JP2023107049A |
To reduce consumption of a polishing liquid.A substrate processing device includes: a table 100 for supporting a substrate WF; a pad holder 226 for holding a polishing pad 222 for polishing a polished surface of the substrate WF supporte...
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JP2023532464A |
The polishing assembly includes a rotatable platen for supporting the polishing pad, an open bottom enclosure, and one or more plates for supplying polishing and cleaning fluids downwardly onto the polishing pad through an interior space...
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JP2023531344A |
In a substrate processing system, such as a chemical mechanical system, updated controller setting data is obtained for multiple liquid flow controllers of the substrate processing system. Each of the multiple Liquid Flow Controllers (LF...
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JP2023530636A |
A method of cutting a plurality of slices from a workpiece with a wire saw during a series of cutting operations, the cutting operations being divided into an initial cut and a subsequent cut, the wire saw cutting a movable wire section ...
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JP2023097907A |
To provide a filter member comprising a filter which can maintain a particle concentration in a filtered particle-containing liquid and has a long filter life.In a filter member comprising a filter of which an opening diameter is smaller...
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JP7295412B2 |
To provide a method of accurately evaluating hydrogen embrittlement resistance, etc. of metal materials while minimizing intrusion of hydrogen during a polishing process.A metal material evaluation method is provided, comprising a polish...
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JP2023084882A |
To provide a polishing tool which inhibits uneven distribution of an abrasive powder in a pipe.A polishing tool 10 polishes an inner wall surface W1a of a pipe W1. The polishing tool 10 includes: multiple polishing bodies 3; and a water-...
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JP2023084880A |
To provide a polishing tool which inhibits uneven distribution of an abrasive powder in a pipe.A polishing tool 10 polishes an inner wall surface W1a of a pipe W1. The polishing tool 10 includes: a first sandwiching part 1; a second sand...
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JP7281226B2 |
A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive s...
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JP2023521611A |
A grinder/polish machine comprises a sample holder, a platen, an actuator configured to move at least one of the sample holder and the platen, an input device, a machine readable memory, and a controller. The input device includes a plur...
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JP2023071329A |
To provide a cutting device which can excellently process a hard-to-cut material by using a cutting blade.A cutting device comprises: holding means 3 which holds a workpiece W; cutting means 4 which includes a rotatable cutting blade 45 ...
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JP2023063897A |
To provide a double-sided polishing device which can reduce recessed defects generated on a main surface of a glass substrate in polishing.A double-sided polishing device includes a double-sided polishing machine which sandwiches a glass...
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JP7267847B2 |
To supply a sufficient amount of liquid to a substrate without use of a rotary joint in a face-up-type polishing device.　The present application discloses, as one embodiment, a polishing head 200 for a polishing device 1000 that holds ...
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JP2023061348A |
To provide a regeneration method for an abrasive slurry and a regeneration system for an abrasive slurry which are excellent in separability between an abrasive grain component containing cerium oxide and a component (glass component) of...
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JP2023517453A |
A method and apparatus are disclosed herein for dispensing a polishing fluid onto a polishing pad in a chemical mechanical polishing (CMP) system. In particular, embodiments herein relate to a CMP system having a first fluid delivery arm...
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JP2023057047A |
To surely suck a substrate regardless of flatness of a sucked surface of a substrate.A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for sucking a substrate WF and a decompression part...
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JP2023515141A |
Low viscosity polish kit for robotic repair units. The kit includes a sealed container containing a low viscosity polish. The sealed container has a coupling mechanism. The kit also includes a connector configured to couple to the coupli...
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JP2023050606A |
To provide a wire saw which can improve work-piece cutting accuracy and cutting speed, and has high productivity.A wire saw has a wire row 2A which is formed by winding a wire 2 between a plurality of groove rollers 40, and cuts a work-p...
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JP7245493B2 |
To provide a polishing pad capable of efficiently performing a polishing work and a polishing device having the polishing pad.A polishing pad 10 is used for polishing an object W to be polished. The polishing pad includes: a base materia...
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JP7244896B2 |
To provide a CMP slurry regeneration method that can efficiently perform CMP slurry regeneration while reducing the amount of work in a CMP process facility.A CMP slurry regeneration method includes a storage step 3 of storing a used CMP...
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