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JP6538953B1 |
To provide a technical means capable of efficiently adjusting the concentration of a slurry in a polishing step of a semiconductor manufacturing process. A signal SF1 indicating a flow rate of a liquid in the mixing flow path 40 per unit...
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JP6538954B1 |
To provide a technical means capable of accurately adjusting a slurry concentration of a polishing liquid and a supply amount of a polishing liquid per unit time in a polishing liquid supply device of a CMP apparatus. A blended liquid ob...
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JP6538952B1 |
To provide a technical means capable of supplying a polishing liquid having a uniform flow rate of a slurry to a CMP polishing apparatus. There is a mixing flow path 40 communicating with a flow path to which a slurry, ultrapure water, c...
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JP2019102687A |
To polish a wafer at the optimum polishing rate.A polishing device (1) for polishing a wafer (W) while supplying polishing liquid includes a chuck table (21) for holding the wafer on the top face, polishing means (51) for polishing the w...
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JP6529844B2 |
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JP6530881B2 |
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JP2019069499A |
To provide a polishing device which prevents a polishing agent from remaining in a component member of the polishing device to reduce occurrence of scratches which may be surface defects in a polishing step of a photo mask substrate with...
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JP6505495B2 |
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JP6498947B2 |
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JP6491419B2 |
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JP2019042887A |
To prevent waste of polishing liquid by adjusting the polishing liquid to an appropriate concentration.A polishing liquid concentration adjustment method comprises: a supply step S1 in which pure water and concentrated polishing liquid a...
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JP6484275B2 |
The wafer polishing system is disclosed. The wafer polishing system may comprise a polishing unit; a slurry distribution unit mounted on the polishing unit and distributing a slurry flowing into the polishing unit for wafer polishing; a ...
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JP2019029562A |
To provide a substrate processing apparatus capable of reducing consumption of slurry while preventing deterioration in abrasive quality.A substrate processing apparatus comprises: a polishing table 23 having a polishing surface 23a; a p...
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JP6463716B2 |
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JP6453199B2 |
A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grind...
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JP6454599B2 |
An objective of the present invention is to reduce an amount of slurry used and efficiently circulate and use the slurry. A polishing apparatus (1) comprises a slurry circulation means (50) to store slurry (45) on a lower side of a chuck...
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JP6440309B2 |
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JP2018187759A |
To provide a polishing device and a polishing method which can achieve both further improvement of a surface quality of a polished object such as a glass substrate and improvement of a polishing rate using cerium oxide abrasive grains.A ...
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JP2018190941A |
To ensure safety while manufacturing a polishing liquid and to reduce work burden of an operator.The method of manufacturing a polishing liquid for use in a polishing apparatus (1), includes steps of: supplying a predetermined weight of ...
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JP6431979B2 |
The present invention relates to a method for manufacturing a briquette and a briquette manufactured using the same. The method for manufacturing a briquette can comprise: a step of preparing waste slurry containing silicon; a first oil ...
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JP2018171321A |
To provide a circulation liquid control device and a method of controlling a circulation liquid capable of efficiently irradiating microbes contaminating a liquid phase with ultraviolet and improving the deactivation rate of the microbe ...
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JP6406010B2 |
Method to obtain a highly pure reclaimed polishing material from a polishing-material slurry including already used polishing material. A polishing is reclaimed from a polishing-material slurry by undergoing: recovering in step (A) a pol...
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JP6408316B2 |
To provide a processing device that allows waste fluid to be reused while suppressing expansion of size of the device to a minimum.A device main body (10) of a processing device (1) is provided with processing means (21) that processes a...
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JP2018160557A |
To reduce the burden of transportation and management and reduce manufacturing cost of a device.In a polishing method for polishing a plate-like object (W), a solid abrasive (39) obtained by compressing and molding an alkaline powder sol...
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JP6397392B2 |
To provide a machine work fluid performance recovery system which maintains and recovers property modification effect of a machine work fluid.In a machine work fluid performance recovery system 100, a machine work fluid after use is take...
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JP6389449B2 |
A polishing apparatus including: a turntable with an attached polishing pad; a polishing head that holds a wafer; a tank that stores a polishing agent; a polishing agent supply mechanism which supplies the stored polishing agent to the p...
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JP6385539B1 |
To secure a large inner diameter of a container in order to secure a swirling flow speed in a liquid cyclone filtration device combining a cyclone type centrifugation and a filter filtration separation, and it is difficult to secure a fi...
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JP6385639B2 |
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JP6384001B1 |
To provide an abrasive grain recovery system in an ultrasonic processing system capable of recovering abrasive grains from a discarded suspension and reusing the abrasive grains themselves. An ultrasonic processing apparatus 50 that slig...
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JP2018130770A |
To provide a classification/recovery system capable of classifying and recovering particles contained in liquid by a comparatively simple constitution; and to provide a working liquid cleaning system.A system for classifying and recoveri...
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JP6372059B2 |
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JP6367419B2 |
A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a pol...
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JP2018117058A |
To provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of realizing a polishing shape of good repeatability at a low cost.In a formulation tank BR, first formulation slurry produ...
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JP6345489B2 |
A method for judging polishing performance of a polishing liquid, which can judge freshness of a slurry by measuring a component concentration or a physical quantity corresponding to the component concentration of the slurry after polish...
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JP6328978B2 |
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JP2018075662A |
To remove a matter adhered to a cutting blade, thereby preventing cutting capacity degradation of the cutting blade.A cutting method for cutting a work-piece by an annular cutting blade along a cutting scheduled line which is set for the...
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JP2018065203A |
To provide a pump unit capable of suppressing deterioration or breakage of a component caused by liquid.A pump unit includes: a pump chamber 113 having an introduction part 113a capable of storing liquid E, into which the liquid E is sup...
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JP2018066280A |
To provide a pump device capable of suppressing the deterioration or breakage of components due to liquid.The pump device includes a pump chamber 113 capable of storing liquid E and having an introduction part 113a into which the liquid ...
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JP6317984B2 |
[Problem] To provide a method for regenerating used cerium oxide-based abrasive particles in which treatment can be performed using a small amount of chemicals without the use of fluorides, the method for regenerating used cerium oxide-b...
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JP6299539B2 |
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JP6295107B2 |
The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus (1) configured...
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JP6292119B2 |
Method to obtain a highly pure reclaimed polishing material from a polishing-material slurry including already used polishing material. A polishing material is reclaimed from a polishing-material slurry including already used polishing m...
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JP6281988B2 |
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JP6273526B1 |
[Subject] The fluid purifying facility which can use a commercial container is provided. [Means for Solution] It is made almost the same as an outside of a cartridge filter of marketing of shape of inner side pipe 1 and outside pipe 3, B...
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JP6268345B2 |
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JP6265974B2 |
A slurry regeneration apparatus for regenerating to reusable condition used slurry containing swarf generated when cutting an ingot using a wire saw, the apparatus being provided with: an air supply unit capable of supplying air to the u...
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JP6260617B2 |
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JP6253089B2 |
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JP6245002B2 |
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JP6243255B2 |
[Solution Means] In grinding a workpiece W by a cup grinding wheel 3 while supplying a slurry 5 containing abrasive grains, the grinding wheel 3 is rotated at low peripheral speed. No more than 500 m/min., preferably 30 to 430 m/min., is...
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