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WO/2020/151527A1 |
The invention discloses a method for implementing mercapto-epoxy deep photocuring and an application thereof. A point light source with a wavelength in the range of 220-400nm is used for irradiating a photocuring composition to generate ...
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WO/2020/150798A1 |
A kit for solidifying breast milk and a process for solidifying breast milk using said kit are described, providing for the transformation of breast milk into a solid product by means of a chemical reaction, with the proportions of each ...
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WO/2020/153205A1 |
Provided is a composition that enables provision of a thermally-conductive material having excellent thermal conductivity. Also provided are a thermally-conductive sheet and a device equipped with a thermally-conductive layer. This compo...
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WO/2020/145083A1 |
The present invention is a resin composition and the like comprising an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler is dispersed in the epoxy resin. The inorganic filler contains two or more types o...
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WO/2020/144139A1 |
The present invention relates to a process for preparing polymer/opaque filler composite materials using a three-component copper complex/iodonium salt/amine as photoinitiating system, and uses of a copper complex and/or tri-association ...
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WO/2020/143336A1 |
Disclosed in the present invention are a high-frequency resin prepolymer, and a high-frequency resin composition, a prepreg, a laminated board, and an interlayer insulating film prepared by using same. The high-frequency resin prepolymer...
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WO/2020/141130A1 |
The present invention relates to heat-curing epoxy resin compositions containing a dihydracide as a hardener, which is selected from the group consisting of glutaric acid dihydracide, adipic acid dihydracide and pimelic acid dihydracide ...
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WO/2020/133335A1 |
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-contai...
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WO/2020/137339A1 |
A resin composition according to the present invention is used to form a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), a stress relation layer (102), and a copper f...
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WO/2020/133336A1 |
Provided are a halogen-free and phosphorus-free flame retardant resin composition, a binding material containing same and a metal foil-clad laminate. The resin composition comprises the following components in parts by weight: 50-70 part...
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WO/2020/133494A1 |
A resin composition, and a prepreg, a laminated board, a metal foil-clad laminated board and a printed circuit board made by the resin composition. The resin composition comprises an epoxy resin (A), a phenolic curing agent (B), and orga...
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WO/2020/139433A1 |
A method for generating a thermo set Fiber- Reinforced Polymer (FRP) composite preform includes: dispensing, from a print head of a 3D-printer, a dual-cure resin coated fiber including a dual-cure resin with a ultra-violet (UV)-curable c...
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WO/2020/138117A1 |
The purpose of the present invention is to provide a chlorinated polyolefin resin composition which not only can exhibit good adhesion to substrates such as polyolefin resin substrates, thereby forming good coating films, and can exhibit...
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WO/2020/133353A1 |
A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw...
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WO/2020/135779A1 |
The present invention provides a solid buoyancy material and a preparation method therefor and use thereof. The solid buoyancy material comprises a resin, a hollow glass microsphere A, and a hollow glass microsphere B. Hollow glass micro...
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WO/2020/138263A1 |
The present invention addresses the problem of providing a novel resin composition that has a low environmental burden and excellent ability to disperse polymer fine particles. A resin composition that contains specific amounts of water,...
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WO/2020/137989A1 |
According to the present invention, provided is a resin composition that is for sealing and that contains (A) an epoxy resin, (B) a curing agent, and (C) a filler, wherein the epoxy resin (A) contains an epoxy resin (A-1) having a naphth...
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WO/2020/133337A1 |
A thermosetting resin composition, and a prepreg, laminated board and high frequency circuit substrate which contain the thermosetting resin composition, the thermosetting resin composition comprising the following components by weight: ...
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WO/2020/133338A1 |
Provided are a thermosetting resin composition and a prepreg, laminate and high-frequency circuit substrate containing same, wherein the thermosetting composition comprises the following components in parts by weight: 0.5-15 parts by wei...
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WO/2020/137945A1 |
The present invention provides: an FRP molding material which is capable of suppressing the problem of changes in mechanical characteristics in a high temperature environment by means of a crosslinking reaction, while maintaining good mo...
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WO/2020/133472A1 |
An epoxy resin composition, and a prepreg, a laminate, and a metal foil-coated laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an op...
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WO/2020/128288A1 |
The invention concerns a resin composition based on a resin selected from the group consisting of vinyl ester resins and unsaturated polyester resins, a crosslinking initiator and a crosslinking agent of general formula (I) (I) in which ...
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WO/2020/130008A1 |
Provided is a method of manufacturing a composite material, the method comprising a step for heating a prepreg containing glass cloth and a thermosetting resin composition to 200°C or higher, wherein an average filament diameter ratio (...
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WO/2020/125715A1 |
Provided is a low-viscosity mono-component epoxy resin composition which comprises at least one epoxy resin, at least one liquid anhydride curing agent, at least one curing accelerator, and at least one thixotropic assistant. The low-vis...
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WO/2020/130012A1 |
This thermosetting resin composition for LDS, which is used for laser direct structuring, contains (A) a thermosetting resin, (B) an inorganic filler, (C) a non-conductive metal compound which forms a metal nucleus upon irradiation of an...
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WO/2020/128289A1 |
The invention relates to a resin composition based on a resin chosen from the group consisting of unsaturated polyester resins and vinyl ester resins, a crosslinking initiator and a crosslinking agent of general formula R1─X─R2, in w...
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WO/2020/129776A1 |
The present invention provides a resin composition which contains an epoxy resin and a curing agent for the epoxy resin, and which is configured such that: epoxy compounds respectively represented by general formula (1) and general formu...
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WO/2020/131946A1 |
A low-density, halogen-free epoxy composition that is flame-resistant upon curing and is suitable for use as a potting compound. The epoxy composition includes: (a) an epoxy component; (b) at least one curative; (c) at least one latent c...
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WO/2020/130098A1 |
This sealing composition contains an epoxy resin, a curing agent, an inorganic filler including silica particles having a specific surface area of at least 100 m2/g, and a silane compound having a structure in which a C6 or higher chain ...
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WO/2020/130097A1 |
This sealing composition contains: a first epoxy resin having an epoxy group equivalent of 300 g/eq or greater and a glass transition temperature of 40°C or lower when cured using a polyfunctional phenol resin curing agent and a phospho...
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WO/2020/124673A1 |
The present invention provides a thermosetting resin composition and a prepreg using same, a laminate, and a metal foil-clad laminate. The thermosetting resin composition comprises epoxy resin, a styrene maleic anhydride oligomer, and an...
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WO/2020/121766A1 |
[Problem] To provide a resin composition capable of being easily inhibited from having a curing failure, a method for foreknowing a curing failure, a method for producing a bonded object, an adhesive kit, and a device for detecting a cur...
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WO/2020/123640A1 |
The present invention relates to a reaction mixture including one or more polyfunctional isocyanates such that the average isocyanate functionality of the mixture is greater than 2.1, and a catalyst composition including at least one tri...
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WO/2020/121734A1 |
A resin composition comprises an epoxy compound, a maleimide compound, a phenol compound, a core-shell rubber and an inorganic filler. The maleimide compound has an N-phenylmaleimide structure. The content of the maleimide compound is 10...
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WO/2020/119756A1 |
Disclosed in the present invention are a thermal interface material and a preparation method therefor. The preparation method for the thermal interface material comprises the steps: S1. stirring and uniformly mixing spherical boron nitri...
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WO/2020/117494A1 |
A composition and method for spray-applying a two-part, self-setting composition containing a structural reinforcement component that is particularly adapted for delivering the components of the composition at a temperature that promotes...
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WO/2020/116512A1 |
[Problem] To provide: a curable resin composition from which a cured product having high heat resistance, a low dielectric loss tangent and high adhesion to a conductor can be produced; and a dry film, a resin-clad copper foil, a cured p...
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WO/2020/116629A1 |
[Problem] To provide: a polybutylene terephthalate resin composition that can be used to form a molded product having excellent alkali resistance, and in addition, excellent bonding strength in a double-molded article with a polycarbonat...
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WO/2020/116467A1 |
The present invention addresses the problem of providing a resin composition that can be cured at a low temperature and that has both heat resistance and flexibility after being cured. In order to solve the problem, the present invention...
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WO/2020/113507A1 |
The present invention relates to a liquid casting resin composition for an ultra-high voltage device, which composition comprises a resin and a filler, wherein the filler is a spherical silicon micropowder; the filler accounts for 71%-80...
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WO/2020/110601A1 |
An aqueous epoxy resin composition which is obtained by blending (A) an aqueous epoxy resin and (B) a curing agent composition that contains (b1) a reaction product of epichlorohydrin and an amine compound represented by general formula ...
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WO/2020/108351A1 |
Disclosed are a flame-retardant resin composition, and a prepreg and a laminate which are prepared therefrom. The flame-retardant resin composition, based on the solid weight, comprises: 100 parts of a modified bismaleimide prepolymer, 5...
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WO/2020/110955A1 |
According to the present invention, a rubbery composition is prepared by combining (A) a rubber component, (B) a cellulose, and (C) a fluorene compound having a 9, 9-bis(aryl)fluorene skeleton. The fluorene compound (C1) may be a compoun...
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WO/2020/110939A1 |
Provided is a resin composition which can be efficiently produced at low cost in a short time period. The resin composition of the present invention comprises: a semi-cured object (1) obtained from a polyfunctional epoxy compound (A) w...
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WO/2020/110445A1 |
The present invention provides a resin composition for an acoustic matching layer, the resin composition capable of holding uniform dispersibility of a hollow filler and suppressing foaming, and having excellent moldability and handleabi...
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WO/2020/111244A1 |
This underfill material contains an epoxy resin and a rubber component; and the epoxy resin contains an epoxy compound that has two epoxy groups in each molecule, but does not contain a ring structure other than the epoxy groups, while h...
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WO/2020/110534A1 |
The present invention addresses the problem of providing: a sealing method which prevents a semiconductor element and a component that constitute a semiconductor device from corrosion caused by harmful substances; a sealing layer which i...
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WO/2020/104942A1 |
A composition includes a polythiol having more than one thiol group, a polyepoxide having more than one epoxide group, a polymer comprising a tertiary amine group and a hydroxyl group, and conductive filler. A polymer network, which can ...
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WO/2020/101054A1 |
The present invention relates to a coating composition for forming a beam projector screen and, more specifically, to a coating composition coated on concrete walls, interior paint, or wallpaper so as to form a beam projector screen.
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WO/2020/100345A1 |
This curable resin composition includes a first epoxy resin having a polyoxyalkylene chain, a second epoxy resin different from the first epoxy resin, a thermoplastic resin having a reactive functional group as well as a weight-average m...
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