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WO/2021/204720A1 |
The invention relates to a process for preparing a polyurea or a polyurethane organopolysiloxane block copolymer having a silicone content of at least 90% in weight relative to the total weight of the organosiloxane block copolymer. The ...
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WO/2021/200643A1 |
[Problem] To provide a hot-melt curable silicone composition that is curable at a low temperature of 100 °C or lower and is excellent in storage stability and that forms, through curing, a relatively hard cured product having less surfa...
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WO/2021/199355A1 |
Disclosed are: a resin composition that comprises an alkenyl group-containing silicone raw rubber, an MQ resin, a crosslinking agent, a platinum catalyst and an organic peroxide, that has a gel fraction of 45-60% after crosslinking, and ...
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WO/2021/201197A1 |
[Problem] To provide a composition that yields a film capable of exhibiting excellent functionality as a resist underlayer film that exhibits resistance to a solvent in the composition for a resist film formed as an upper layer, that exh...
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WO/2021/201196A1 |
[Problem] To provide a composition which provides a film capable of satisfactorily functioning as a resist underlayer film having resistance to a solvent for a composition of a resist film formed as an upper layer, good etching character...
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WO/2021/200879A1 |
The present invention is: a silicone composition including (A) a liquid silicone compound, (B) a silicone rubber bulk material, and (C) a liquid compound for causing the silicone rubber bulk material (B) to swell; and a method for manufa...
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WO/2021/201167A1 |
[Problem] To provide a film-forming composition for forming a resist underlayer film for a solvent development type resist that is capable of forming a good resist pattern. [Solution] A film-forming composition which contains a hydrolysi...
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WO/2021/201861A1 |
An intermediate transfer member for digital offset printing, comprising a cured silicone release layer formed by curing a curable silicone release formulation comprising a polyalkylsiloxane containing at least two vinyl groups; an at lea...
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WO/2021/193942A1 |
A sheet for the production of a semiconductor device, said sheet being provided with a base material, an adhesive layer, an intermediate layer and a film-form adhesive, while having a configuration wherein the adhesive layer, the interme...
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WO/2021/193934A1 |
This method for producing a semiconductor chip with a film-form adhesive, which comprises a semiconductor chip and a film-form adhesive that is provided on the back surface of the semiconductor chip, uses a sheet for the production of a ...
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WO/2021/193221A1 |
The present invention provides a high refractive index resin composition that exhibits excellent heat resistance and dry etching properties by not containing a fused polycyclic aromatic compound and lowering the quantity of a metal compo...
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WO/2021/193452A1 |
The present invention pertains to: a curable composition containing the component (A) and component (B) below; a cured product obtained by curing the curable composition; and a method for using the curable composition as an adhesive agen...
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WO/2021/195038A1 |
The present disclosure relates to a silicone-based composition comprising one or more non-fluorinated polydiorganosiloxane polymers and silica filler which silica filler is at least partially treated with a fluorinated hydrophobing treat...
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WO/2021/193554A1 |
One embodiment of the present invention pertains to a thermoplastic elastomer composition or a molded body thereof, wherein said thermoplastic elastomer composition comprises: 100 parts by mass of an ethylene/α-olefin/nonconjugated poly...
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WO/2021/195037A1 |
The present disclosure relates to a silicone based composition comprising one or more fluorinated polydiorganosiloxane polymers and silica filler which silica filler is at least partially treated with a fluorinated hydrophobing treating ...
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WO/2021/193935A1 |
A sheet (101) for the production of a semiconductor device, said sheet being provided with a base material (11), an adhesive layer (12), an intermediate layer (13) and a film-form adhesive (14). This sheet for the production of a semicon...
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WO/2021/191868A1 |
A poly(arylene ether) copolymer wherein the poly(arylene ether) copolymer is a product of oxidative copolymerization of monomers comprising a first monohydric phenol; a second monohydric phenol different from the first monohydric phenol;...
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WO/2021/193936A1 |
A sheet for semiconductor device fabrication comprising: a base material, a pressure-sensitive adhesive layer, an intermediate layer, and a film-shaped adhesive, the sheet being configured by laminating the pressure-sensitive adhesive la...
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WO/2021/190737A1 |
The invention relates to compositions which have polyester-polysiloxane copolymers, containing (A) polyolefins which can optionally be substituted and (B) at least one organosilicon compound of the general formula R3-a-b(OR1)aR2 bSi[OSiR...
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WO/2021/193923A1 |
A sheet for manufacturing a semiconductor device, the sheet comprising: a label part that is to be pasted on a semiconductor wafer or a semiconductor chip; and an outer peripheral part provided to at least a portion outside the label par...
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WO/2021/193913A1 |
A semiconductor device manufacturing sheet comprising a substrate, a pressure sensitive adhesive layer, an intermediate layer and a film adhesive, wherein: the pressure sensitive adhesive layer, the intermediate layer and the film adhesi...
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WO/2021/193916A1 |
Provided is a manufacturing method for a semiconductor device manufacturing sheet. The semiconductor device manufacturing sheet comprises a base material, an adhesive layer, an intermediate layer, a film-like bonding agent, and a second ...
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WO/2021/193910A1 |
A semiconductor device manufacturing sheet comprising a substrate, a pressure sensitive adhesive layer, an intermediate layer and a film adhesive, wherein: the pressure sensitive adhesive layer, the intermediate layer and the film adhesi...
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WO/2021/187184A1 |
A mixed composition according to the present invention is a mixed composition of a compound (A1) represented by formula (a1), an organosilicon compound (B) represented by formula (b1), and an organosilicon compound (C) represented by for...
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WO/2021/185800A1 |
The present invention relates to a moisture-curable composition that is a compound containing a silane-terminated modified polymer as a main component, has both excellent workability due to low viscosity at a high shear rate and sufficie...
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WO/2021/184816A1 |
An oriented high-thermal-conductivity interface material and a preparation method therefor. The material is composed of 10-90 parts of a binder resin and 10-90 parts of a long-fiber thermal-conducting material. The preparation method the...
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WO/2021/187256A1 |
A coloring composition comprising a coloring agent, a first resin including a repeating unit represented by formula (b-10), and a second resin different from the first resin, wherein the second resin is at least one selected from polyimi...
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WO/2021/187609A1 |
Provided is a heat dissipation sheet comprising a silicone resin and a heat-conducting filler, in which, in a thickness-direction cross-sectional view of the heat dissipation sheet which extends from one surface of the heat dissipation s...
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WO/2021/185715A1 |
[Problem] To provide a stabilizer for suppressing generation of silane from a polysilane composition and a method for suppressing generation of silane. To provide a method for inactivating a polysilane, and a polysilane inactivated treat...
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WO/2021/187831A1 |
The present invention relates to: an adhesive silicone pattern material for clothing, wherein the adhesive silicone pattern can achieve the function of assisting the musculoskeletal system and ligaments of each part of the human body, th...
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WO/2021/187401A1 |
This organopolysiloxane composition for use in release paper or release film, said organopolysiloxane composition containing (A) an organopolysiloxane having two or more silicon atom-bonded alkenyl groups in each molecule, (B) an organoh...
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WO/2021/186939A1 |
This release film for use in a ceramic green sheet production process comprises a base material and a releasing agent layer formed on one of the surfaces of the base material, wherein the releasing agent layer is formed from a releasing ...
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WO/2021/184149A1 |
This invention relates to a thermal conductive silicone composition comprising: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at ...
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WO/2021/186252A1 |
A poly(phenylene ether) composition includes specific amounts of a poly(phenylene ether)-poly(siloxane) block copolymer reaction product including a poly(phenylene ether)-poly(siloxane) block copolymer and a poly(phenylene ether), an org...
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WO/2021/181307A1 |
The invention provides a class of photochromic polydiorganosiloxane vinylic crosslinkers. Each of the photochromic polydiorganosiloxane vinylic crosslinkers of the invention comprise (1) a polydiorganosiloxane polymer chain comprising di...
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WO/2021/180497A1 |
1) Moisture curable silylated composition comprising : - from 35 to 65 % by weight of a polymer (A) comprising at least 2 alkoxysilyl terminal groups of formula (I) : (Formula I) wherein R1 represents a hydrocarbon-based divalent radical...
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WO/2021/179298A1 |
Disclosed in the present invention are a method for preparing a premix by means of in-situ graft modification of a mesoporous silica vesicle continuous aggregate, and a method for preparing an addition-type silicone rubber sponge thermal...
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WO/2021/181341A1 |
The invention provides a class of photochromic polydiorganosiloxane vinylic crosslinkers. Each of the photochromic polydiorganosiloxane vinylic crosslinkers of the invention comprise (1) a polydiorganosiloxane polymer chain comprising di...
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WO/2021/179069A1 |
There is provided an erosion protective polyurethane elastomer produced from a polyurethane composition with a polyisocyanate component and an isocyanate-reactive component. The polyisocyanate component has a first isocyanate-terminated ...
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WO/2021/178119A1 |
A composition contains the following components: (a) 15 to 49.8 volume-percent of a first polysiloxane that is has a viscosity in a range of 50 centiStokes to 550 Stokes as determined according to ASTM D4283-98; (b) 0.2 to 5 volume-perce...
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WO/2021/175844A1 |
The invention relates to a composition and a process for preparing moisture cross-linking silicones while catalyzing at least two different catalysts A and B, to an associated process and to the use of the composition in particular in se...
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WO/2021/172468A1 |
The purpose of the present disclosure is to provide a resin material which includes a polymer having a host group and/or a guest group and has excellent solubility. The resin material includes a host comprising a polymer having a host ...
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WO/2021/171735A1 |
The present invention relates to a cosmetic obtained by formulating a silicone resin having a weight-average molecular weight of more than 20,000 and no more than 100,000, the constituent units of which comprise general formula (A) (R1 3...
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WO/2021/171970A1 |
Disclosed is a thermally conductive silicone composition capable of enhancing the thermal conductivity of a thermally conductive silicone material. The thermally conductive silicone composition contains a silicone component (A), and a po...
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WO/2021/168056A1 |
A photocurable silicone composition, a method of forming a coating from such compositions, and an article comprising a coating formed from such compositions and/or methods are shown and described herein. The photocurable silicone composi...
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WO/2021/163826A1 |
Disclosed is an article adapted to receive multiple battery cells, such as a battery module, which provides thermal insulation between adjacent battery cells using thermally insulating layers comprising a ceramifiable elastomeric silicon...
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WO/2021/167051A1 |
[Problem] To provide: a photocurable liquid silicone composition which has low viscosity so as to be easily injectable into small gaps, cures quickly upon being irradiated with high energy rays such as ultraviolet rays, has a high refrac...
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WO/2021/167728A1 |
Foam control compositions along with formulations thereof and their use in various applications, including a method for making a foam control composition comprising a cross-linked polyorganosiloxane material including a dispersed silica ...
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WO/2021/167052A1 |
[Problem] To provide: a photocurable liquid silicone composition that has a low viscosity that allows for easy injection, even into small gaps, has a high refractive index in both the visible and infrared ranges after being cured, and is...
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WO/2021/168067A1 |
A process for modifying a surface geometry of a thermoplastic part using a tunnel apparatus operated by a controller is provided. The process includes the steps of: programming the controller with a surface modification profile; moving a...
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