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JP2015021598A |
To provide a heat insulation unit having excellent durability, and a thermal treatment device including the same.A heat insulation unit 11 includes a heat insulation body 21 comprising silica and alumina, and a heat generation body 22 pr...
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JP5656400B2 |
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JP2015008202A |
To obtain a heat treatment furnace for forming an oxide film on a surface of a wafer and diffusing impurities, which allows a primary boat to travel straight without providing a complicated structure, such as a guide tube, in a furnace c...
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JP5647977B2 |
The processing device (10) comprises an evacuatable processing chamber (14) for receiving a process gas (44), a tempering device in sections in and/or in thermal operative connection with all walls of the processing chamber, a gas convey...
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JP2014224635A |
To enable keeping efficient operation even if heating/cooling treatments at different temperatures are necessary in a tempering, vacuum sintering/aging or the like.A vacuum treatment method in vacuum treatment facilities including: a plu...
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JP5613471B2 |
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JP2014527577A |
A method of preparing high-purity aluminum by directional solidification, in which a step of providing 4N to 5N aluminum as a raw material, a step of heating the aluminum raw material to a temperature of 670 ° C. to 730 ° C., and a ste...
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JP2014181882A |
To suppress the intrusion of an unnecessary component into a treatment space.In a heat treatment device 10, the circumference of a treatment tank 20 which performs heat treatment to an object 72 to be treated in an inert gas atmosphere, ...
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JP5596286B2 |
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JP5569999B2 |
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JP5567812B2 |
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JP5559105B2 |
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JP5559972B2 |
To provide a heating furnace capable of quickly switching from wet gas to dry gas, capable of suppressing a used gas amount, and capable of reducing heat loss following putting in and out of a treatment reception object. The heating furn...
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JP5553127B2 |
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JP5550924B2 |
To provide a continuous heating muffle furnace, capable of suitably suppressing deterioration of the durability of a muffle. The continuous heating muffle furnace includes: a plurality of gas burners 4a, 5a, 6a arranged outside the muffl...
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JP5538740B2 |
A heat treatment device (10) comprises: a furnace (12), a circulation fan (22), a heat resistant filter (14), and a hot air distributing plate (16). The hot air distributing plate (16) is arranged between the heat resistant filter (14) a...
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JP5536360B2 |
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JP2014115021A |
To provide a capacitor chip vacuum sintering furnace which can accurately grasp an internal temperature of a tray.The capacitor chip vacuum sintering furnace comprises: a sintering chamber 1 having a sintering gate 10 at its bottom and p...
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JP5533597B2 |
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JP5532016B2 |
The disclosed heat-treatment furnace, used in a semiconductor-substrate heat-treatment step, is characterized by the provision of a cylindrical core, both ends of which have openings sized so as to allow insertion and removal of semicond...
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JP5517382B1 |
There is provided a method for heat treatment, a heat treatment apparatus, and a heat treatment system capable of performing highly precise and efficient control of heat treatment such as a bright treatment of materials to be treated wit...
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JP5509591B2 |
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JP2014098497A |
To provide a technique capable of uniting the security of heat transfer to material to be heated upon heat treatment and the security of fluidity of the material to be heated in a furnace, in a heat treatment device which performs the he...
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JP2014098538A |
To provide apparatus and methods for melting materials while controlling uniformity and temperature of the melt, and for containing the molten materials within a melt zone during melting without using a gate for physical blocking.An appa...
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JP5506187B2 |
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JP5496963B2 |
To provide a vertical type vacuum furnace that increase the availability of a vacuum furnace in a heat treatment process by optimizing the trouble for construction, promoting energy saving of the heat treatment process by making the stru...
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JP5492540B2 |
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JP5491000B2 |
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JP2014081096A |
To provide a compact vacuum heating furnace capable of performing processing of vacuum drying of moisture content, a solvent and the like included in various samples (materials) by heating the various samples (materials) with low power c...
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JP2014074566A |
To provide a heat treat furnace of steel that utilizes metamorphic gas generated by combustion of a gas burner as in-furnace atmosphere gas without using inactive gas such as nitrogen gas or argon gas, and further does not adversely affe...
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JP5479951B2 |
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JP5477955B2 |
A heat treatment apparatus capable of achieving high-accuracy processing and high safety and a method of manufacturing a substrate are provided. The heat treatment apparatus 10 includes a reaction tube 42 for processing a substrate, a ma...
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JP3190016U |
To provide a drum can heating device having a small energy loss and being easily attached and detached. A tubular outer shell member 101, 111 having an opening / closing portion 18 for storing and detaching a standing drum can is in cont...
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JP5450331B2 |
Uniform short wave IR heating equipment for glasses and/or glass-ceramics, including an arrangement for indirect incidence of most of the IR radiation, is new. Equipment for uniformly heating (semi-)transparent glasses and/or glass-ceram...
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JP5452987B2 |
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JP2014048034A |
To effectively utilize a heating chamber by heating each processing object in a manner conforming to a processing temperature and procedure of the processing object, and shortening a waiting time period until heating to the processing ob...
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JP5436429B2 |
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JP5433664B2 |
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JP5429500B2 |
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JP5424896B2 |
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JP5412047B2 |
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JP5411268B2 |
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JP5411230B2 |
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JP2014024740A |
To provide: a ceramic sintered body that is excellent in corrosion resistance against an alkaline composition of compositions composing a positive electrode material of a lithium ion secondary battery and thermal shock resistance; a memb...
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JP5407153B2 |
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JP5393166B2 |
A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and ...
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JP5390094B2 |
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer...
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JP5374061B2 |
To provide a batch-type firing furnace for electronic components for firing the electronic components which emits binder gas during firing, and its furnace pressure control method. A ceiling part 2 of a firing furnace body 1 is provided ...
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JP5374897B2 |
To provide a thermal treatment system capable of preventing temperature change of treated objects during storage in a conveyance furnace and obtaining high-quality treated objects and successfully used for thermal treatment of multiple t...
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JP2013545067A |
The subject innovation relates to a multi-deck chamber furnace for heating up workpieces comprising a furnace housing having at least two horizontal furnace chambers that are arranged vertically one above the other, whereby each furnace ...
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