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Matches 501 - 550 out of 1,875

Document Document Title
JP5559972B2  
JP5553127B2  
JP5550924B2  
JP5538740B2
A heat treatment device (10) comprises: a furnace (12), a circulation fan (22), a heat resistant filter (14), and a hot air distributing plate (16). The hot air distributing plate (16) is arranged between the heat resistant filter (14) a...  
JP5536360B2  
JP2014115021A
To provide a capacitor chip vacuum sintering furnace which can accurately grasp an internal temperature of a tray.The capacitor chip vacuum sintering furnace comprises: a sintering chamber 1 having a sintering gate 10 at its bottom and p...  
JP5533597B2  
JP5532016B2
The disclosed heat-treatment furnace, used in a semiconductor-substrate heat-treatment step, is characterized by the provision of a cylindrical core, both ends of which have openings sized so as to allow insertion and removal of semicond...  
JP5517382B1
There is provided a method for heat treatment, a heat treatment apparatus, and a heat treatment system capable of performing highly precise and efficient control of heat treatment such as a bright treatment of materials to be treated wit...  
JP5509591B2  
JP2014098497A
To provide a technique capable of uniting the security of heat transfer to material to be heated upon heat treatment and the security of fluidity of the material to be heated in a furnace, in a heat treatment device which performs the he...  
JP2014098538A
To provide apparatus and methods for melting materials while controlling uniformity and temperature of the melt, and for containing the molten materials within a melt zone during melting without using a gate for physical blocking.An appa...  
JP5506187B2  
JP5496963B2  
JP5492540B2  
JP5491000B2  
JP2014081096A
To provide a compact vacuum heating furnace capable of performing processing of vacuum drying of moisture content, a solvent and the like included in various samples (materials) by heating the various samples (materials) with low power c...  
JP2014074566A
To provide a heat treat furnace of steel that utilizes metamorphic gas generated by combustion of a gas burner as in-furnace atmosphere gas without using inactive gas such as nitrogen gas or argon gas, and further does not adversely affe...  
JP5479951B2  
JP5477955B2
A heat treatment apparatus capable of achieving high-accuracy processing and high safety and a method of manufacturing a substrate are provided. The heat treatment apparatus 10 includes a reaction tube 42 for processing a substrate, a ma...  
JP3190016U
To provide a drum can heating device having a small energy loss and being easily attached and detached. A tubular outer shell member 101, 111 having an opening / closing portion 18 for storing and detaching a standing drum can is in cont...  
JP5450331B2
Uniform short wave IR heating equipment for glasses and/or glass-ceramics, including an arrangement for indirect incidence of most of the IR radiation, is new. Equipment for uniformly heating (semi-)transparent glasses and/or glass-ceram...  
JP5452987B2  
JP2014048034A
To effectively utilize a heating chamber by heating each processing object in a manner conforming to a processing temperature and procedure of the processing object, and shortening a waiting time period until heating to the processing ob...  
JP5436429B2  
JP5433664B2  
JP5429500B2  
JP5424896B2  
JP5412047B2  
JP5411268B2  
JP5411230B2  
JP2014024740A
To provide: a ceramic sintered body that is excellent in corrosion resistance against an alkaline composition of compositions composing a positive electrode material of a lithium ion secondary battery and thermal shock resistance; a memb...  
JP5407153B2  
JP5393166B2
A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and ...  
JP5390094B2
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer...  
JP5374061B2
To provide a batch-type firing furnace for electronic components for firing the electronic components which emits binder gas during firing, and its furnace pressure control method. A ceiling part 2 of a firing furnace body 1 is provided ...  
JP5374897B2
To provide a thermal treatment system capable of preventing temperature change of treated objects during storage in a conveyance furnace and obtaining high-quality treated objects and successfully used for thermal treatment of multiple t...  
JP2013545067A
The subject innovation relates to a multi-deck chamber furnace for heating up workpieces comprising a furnace housing having at least two horizontal furnace chambers that are arranged vertically one above the other, whereby each furnace ...  
JP2013248597A
To provide an excellent low-oxygen atmosphere apparatus in which an atmosphere of low oxygen concentration can be achieved even without raising the temperature in the apparatus to the predetermined temperature by a heating means.The low-...  
JP2013204917A
To provide a heat treatment device capable of suitably preventing ignition of a flammable material extracted from a workpiece W even while adopting a compact and inexpensive configuration.A heat treatment device includes a treatment cham...  
JP2013201032A
To provide a heating device which can perform heating by multiple heating means and which can achieve a compact structure.A heating device 10 comprises: an induction heating coil 16 provided opposite to a heating object loading region 28...  
JP5291354B2
To provide a novel gas nitriding furnace and gas soft nitriding furnace capable of preventing generation of solid matter caused by outflowing of treatment gas. The gas nitriding furnace 100 includes a standby chamber 30 for passage and s...  
JP5265475B2
To provide a one chamber type vacuum furnace securing cleanliness of the atmosphere in a heating chamber even in a sintering process after a degreasing process, improving durability of the heating chamber itself, and uniformly cooling a ...  
JP2013137131A
To compactly design a height dimension of an in-field heat treatment device using a non-coolant-type superconductive magnet.A height dimension of an in-field heat treatment device using a non-coolant-type superconductive magnet is compac...  
JP2013138058A
To provide an in-magnetic field heat treatment apparatus which inhibits quench from occurring immediately after a refrigeration machine stops and makes contamination of a clean room caused by a refrigerant gas unlikely to occur.A superco...  
JP5226206B2  
JP5220135B2
A microwave heating apparatus (101) includes a burning chamber (103) in which an object (102) to be burned is placed, a magnetron (116) for applying microwaves into the heating apparatus, a cooling gas introducing mechanism (112b) for in...  
JP5216763B2
A fired heater unit is disclosed having at least one radiant heating section with each of the at least one radiant heating section having a heating element located therein. The unit includes a convection section operatively connected to ...  
JP2013519863A
The invention relates to a heat treatment inner chamber (3) for thermally processing a substrate (20), having walls (10) which enclose an inner space (24) of the heat treatment inner chamber (3), having a mounting apparatus (8) for mount...  
JP2013093600A
To provide a method for managing temperature distribution varying dependently on the patterning of wafer in rapid thermal processing, to greatly enhance the uniformity of rapid thermal processing (RTP).Provided are an apparatus 60 and a ...  

Matches 501 - 550 out of 1,875