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WO/2023/096925A1 |
The present disclosure is directed to a showerhead for distributing plasma. The showerhead includes a perforated tile coupled to a support structure. A dielectric window is disposed over the perforated tile. An electrode is coupled to th...
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WO/2023/094795A1 |
There is provided an electron beam deflector (32) for use in electron beam welding, the deflector (32) comprising a planar body (32) defining at least one channel (36) enabling passage of an electron beam (14) to a weld site, wherein at ...
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WO/2023/091268A1 |
A plasma treatment chamber comprises one or more sidewalls. A support surface within the one or more sidewalls holds a workpiece. A first gas injector along the one or more sidewalls injects a first gas flow in a first direction generall...
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WO/2023/089923A1 |
This blanking aperture array system includes a data output circuit for outputting first data and a first error detection code generated from the first data. A shift register transfers the first data and the first error detection code inp...
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WO/2023/090685A1 |
The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate may comprise: a process treatment part which provides a treatment space where a substrate is treated; and a plasma source which ...
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WO/2023/091196A1 |
Embodiments of substrate supports for use in substrate processing chambers are provided herein. In some embodiments, a substrate support includes: an upper assembly having a base plate assembly coupled to a lower surface of a cooling pla...
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WO/2023/091629A2 |
Chemical Vapor Deposition (CVD) systems with DC, RF, IF (intermediate frequency) and/or microwave plasma have processing chambers incorporate structure to provide improved temperature control, uniform distribution of the process gas, and...
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WO/2023/090082A1 |
[Problem] To provide a drawing device control method and a drawing device which enable suppression of the influence of scattered beams on a drawing process. [Solution] A drawing device according to an embodiment of the present invention ...
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WO/2023/090835A1 |
A plasma sputtering apparatus is disclosed. The plasma sputtering apparatus comprises: a target having a cylindrical shape and provided to be rotatable; a bar magnet arranged to correspond to the base of an imaginary isosceles triangle i...
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WO/2023/091192A1 |
Apparatus for processing a substrate are described herein, More specifically, embodiments described herein relate to separate pre-clean process modules and pre-clean control modules coupled to a cluster tool assembly. Each pre-clean proc...
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WO/2023/091031A1 |
Apparatus (1) for generating condensed plasmoids. The apparatus (1) includes a reactor (4) with a chamber (15) for containing a reactant gas. A cathode (17) and an anode (18) extend into the chamber (15) with an interelectrode gap formed...
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WO/2023/091330A1 |
A composite includes a substrate and a target material, wherein the target material includes indium oxide (In2O3), tin oxide (SnO2), and gallium oxide (Ga2O3), and a method for making the same. The method includes positioning the substra...
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WO/2023/088623A1 |
Apparatuses, systems, and methods for providing beams for defect detection and defect location identification associated with a sample of charged particle beam systems. In some embodiments, a method may include obtaining an image of a sa...
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WO/2023/088839A1 |
In the imaging by means of a scanning electronic microscope, first a sample to be imaged is positioned (27) in a vacuum chamber of the scanning electronic microscope such that an image field of the scanning electron microscope comes to l...
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WO/2023/092135A1 |
Improved edge rings with flow conductance features are disclosed. The flow conductance features of the edge ring are features added to the edge ring that adjust the flow conductance of gas flowing in the local area of the edge ring. The ...
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WO/2023/091267A1 |
A Bernas ion source having a shield is disclosed. The shield is disposed between the distal portion of the filament and the first end of the chamber and serves to confine the plasma to the region between the shield and the second end of ...
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WO/2023/084772A1 |
This charged particle beam device, which is for processing a sample, comprises: a charged particle beam–emitting optical system that emits a charged particle beam; a sample stage that holds a sample; a drive mechanism that drives the s...
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WO/2023/083619A1 |
E37842WO AS/EF/kr 28 ABSTRACT METHOD FOR MEASURING A SAMPLE AND MICROSCOPE IMPLEMENTING THE METHOD 5 The present invention relates to a method for measuring a sample with a microscope, the method comprising scanning the sample using a fo...
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WO/2023/083560A1 |
Disclosed herein is a non-transitory computer readable medium that has stored therein a computer program, wherein the computer program comprises code that, when executed by a computer system, instructs the computer system to perform a me...
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WO/2023/083574A1 |
Systems with valves that increase cycle life and reduce particle generation. Embodiments may include a first movable member (413), a second movable member (411), and a third movable member (415); a first link (412_1, 412_2) coupled to th...
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WO/2023/085662A1 |
The present invention comprises: a support plate having an upper space, on which a substrate is placed, and an inner space; a lift pin assembly which transfers the substrate between an external transport unit and the support plate; and a...
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WO/2023/086731A1 |
Systems and methods for material processing using wafer scale waves of precisely controlled electrons in a DC plasma is presented. The anode and cathode of a DC plasma chamber are respectively connected to an adjustable DC voltage source...
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WO/2023/083573A1 |
Systems, apparatuses, and methods for reducing vibration of a chamber may include obtaining predefined motion data associated with a transferring device stiffly coupled to a chamber; determining movement of the transferring device based ...
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WO/2023/083545A1 |
The present invention provides a charged particle assessment system for projecting a beam of charged particles towards a sample. The system comprises a sample holder configured to hold a sample; a charged particle optical system configur...
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WO/2023/084773A1 |
This charged particle beam device, which is for etching a sample, comprises: a charged particle beam–emitting optical system that emits a charged particle beam; a sample stage that holds a sample; a drive mechanism that drives the samp...
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WO/2023/085133A1 |
[Problem] To provide an electron gun capable of forming a larger number of electron beams than the number of lenses of a multi-lens array, an electron beam application device, and a method for forming a multi-electron beam. The problem...
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WO/2023/086165A1 |
An apparatus for processing a substrate is provided. A capacitively coupled plasma electrode is within a capacitively coupled plasma processing chamber. A plasma confinement component is within the capacitively coupled plasma processing ...
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WO/2023/086395A1 |
An apparatus for feedback control in plasma processing systems using radical sensing, and a method for feedback control in plasma processing systems using radical sensing, the apparatus comprising at least one process gas supply system c...
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WO/2023/081882A1 |
A method and apparatus to shield various components (e.g., a gasket, a sensor, a wire, a mechanical component made of metals and/or polymers) deployed in a vacuum environment using a shield assembly formed from multiple ceramic fibers. T...
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WO/2023/080368A1 |
The present invention relates to a showerhead and a substrate processing apparatus including same. A gas spray hole for spraying a reaction gas onto a substrate is formed at an angle in the showerhead so that the distance, that is, the p...
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WO/2023/080324A1 |
The present invention provides a substrate processing apparatus. The substrate processing apparatus comprises: a housing having an inner space; a lower electrode unit supporting a substrate in the inner space; an upper electrode unit fac...
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WO/2023/078620A2 |
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WO/2023/079018A1 |
The present invention pertains to a process for direct deposition of graphene or graphene oxide onto a substrate of interest from a gaseous source of at least one carbon precursor, using a plasma-enhanced chemical vapor deposition method...
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WO/2023/078628A1 |
An improved method of wafer inspection is disclosed. The improved method includes a non- transitory computer-readable medium storing a set of instructions that are executable by at least one processor of a device to cause the device to p...
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WO/2023/081584A1 |
One example provides a fabrication tool comprising a chamber, a pedestal electrode and a showerhead electrode arranged in the chamber, one or more gas inlets into the chamber, a vacuum pump system, a radiofrequency (RF) power source conf...
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WO/2023/080549A1 |
The present invention provides a substrate-processing apparatus. The substrate-processing apparatus comprises: a housing having a processing space for processing a substrate; a support unit for supporting the substrate in the processing ...
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WO/2023/081703A1 |
Methods and apparatus for etching high aspect ratio features in substrates having mixed material stacks are provided herein. Methods involve using low plasma power, high chamber pressure, and/or low temperature while exposing the substra...
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WO/2023/079548A1 |
A system and methods for electron beam imaging or electron beam spectroscopy. The system comprising: a transmission electron microscope (TEM) having a back focal plane; one or more laser-based devices, configured to shift a predetermined...
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WO/2023/081172A1 |
Various compositions of a material resistant to etching when exposed to halogen plasma are disclosed. The compositions include silicon and a dopant, with silicon having a purity of at least 6N (i.e., including impurities other than silic...
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WO/2023/080937A1 |
Methods and apparatus for generating a magnetic field external to a physical vapor deposition (PVD) chamber to improve etch or deposition uniformity on a substrate disposed inside of the PVD chamber are provided herein. In some embodimen...
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WO/2023/080325A1 |
The present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate may comprise: a chuck which supports a substrate; a gas supply unit which supplies process gas to the edge region of the sub...
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WO/2023/080969A1 |
Embodiments disclosed herein include a plasma treatment chamber, comprising one or more sidewalls. A support surface within the one or more side walls holds a workpiece. A first gas injector along the one or more sidewalls injects a firs...
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WO/2023/081110A1 |
A radiofrequency (RF) power supply system includes a plurality of RF inverters. Each of the RF inverters is configured to generate a sinusoidal RF signal from an input signal applied to one or more gates of one or more transistor devices...
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WO/2023/080548A1 |
The present invention provides a device for processing a substrate. The device for processing a substrate may comprise: a housing having an inner space; a chuck for supporting a substrate in the inner space; a gas supply unit for supplyi...
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WO/2023/081052A1 |
Methods and apparatus for plasma processing substrate are provided herein. The method comprises supplying from an RF power source RF power, measuring at the RF power source a reflected power at the first power level, comparing the measur...
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WO/2023/080970A1 |
In an additional embodiment, a semiconductor processing tool is provided. In an embodiment, the semiconductor processing tool, comprises a chamber, and a lid sealing the chamber. In an embodiment, with an elastomer seal is between the ch...
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WO/2023/072543A1 |
The invention relates to a device for producing a graphene layer (10), comprising a first electrode (12), which comprises carbon and is connected at least to a positive terminal (14) of a voltage source (16), a second electrode (20), whi...
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WO/2023/075629A1 |
The invention relates to the production of nitric oxide from air using electrical discharge and can be used in medicine, biology and scientific research. For this purpose, high-voltage pulses are fed to electrodes, of which a first elect...
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WO/2023/072456A1 |
A multi-beam charged particle microscope configured for an improved method of determining and compensating of wave front aberrations is provided. With a variation element, the wave-front aberration amplitudes are indirectly determined an...
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WO/2023/072733A1 |
A control circuit (1) for at least two drivers (10,11), the drivers are each configured to switch on and off electrically driven switching elements (12,13) which are electrically connected to each other, comprises:- a first parallel-to-s...
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