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WO/2023/277450A1 |
A semiconductor manufacturing device according to the present embodiment comprises: an ultraviolet ray forming unit which is located in an ultraviolet ray forming chamber and forms ultraviolet rays of desired wavelengths by irradiating a...
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WO/2023/278388A1 |
A physical vapor deposition processing chamber is described. The processing chamber includes a target backing plate in a top portion of the processing chamber, a substrate support in a bottom portion of the processing chamber, a depositi...
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WO/2023/278075A1 |
Embodiments provided herein generally include apparatus, plasma processing systems and methods for boosting a voltage of an electrode in a processing chamber. An example plasma processing system includes a processing chamber, a plurality...
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WO/2023/279081A1 |
Multi-pixel sensors such as camera sensors may be configured to capture two- dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated e...
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WO/2023/278171A1 |
A method for performing an etch process on a substrate includes applying a bias signal and a source signal to an electrode of a plasma processing system. The bias signal and the source signal are pulsed RF signals that together define a ...
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WO/2023/277995A1 |
A method and apparatus for processing a substrate are described herein. The methods and apparatus described enable the raising and lowering of a shadow ring within a process chamber either simultaneously with or separately from a plurali...
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WO/2023/274680A1 |
The invention relates to a method for depositing at least one layer (2) of a coating, which is reflective or anti-reflective to radiation in the DUV wavelength range, onto a surface (3a) to be coated of a substrate (3) for an optical ele...
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WO/2023/279116A1 |
The current disclosure relates to highly homogeneous glass sputter targets with a large aspect ratio and a high relative density. The glass sputter targets have properties that are desirable for forming thin films by physical vapor depos...
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WO/2023/275084A1 |
The present invention provides a device (10) and a method for determining the penetration of a particle (42a) from a particle source (40) into a material (12), which enable simple and cost-effective, highly spatially resolved particle de...
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WO/2023/274562A1 |
The present invention relates to a device (100,300) for interfacing a sample transfer device (200) to an analytic or sample preparation device comprising a loading chamber (101), wherein the loading chamber comprises a first port (105) f...
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WO/2023/276127A1 |
The present disclosure provides a charged particle beam device capable of removal or control of an electric charge by plasma without affecting control of the charged particle beam. The charged particle beam device according to the presen...
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WO/2022/269757A1 |
In order to demagnetize a magnetic lens, as an excitation current, an AC decaying current, which vibrates such that the current value alternately becomes a first-polarity current I1(n) and a second-polarity current I2(n) where n is the n...
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WO/2022/271526A1 |
A substrate processing apparatus includes a vacuum chamber with upper and lower electrodes and a processing zone for processing a substrate using plasma. The upper electrode includes a surface that is substantially parallel to a surface ...
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WO/2022/270945A1 |
A semiconductor manufacturing apparatus according to an embodiment of the present invention comprises: an ultraviolet generating part which is disposed in an ultraviolet generation chamber and generates ultraviolet rays of a target wavel...
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WO/2022/269073A1 |
The present invention relates to a liquid phase transmission electron microscopy (LP-TEM) holder with integrated temperature regulation for operating with an associated transmission electron microscopy instrument providing an electron be...
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WO/2022/271383A1 |
Embodiments provided herein generally include apparatus, e.g., plasma processing systems, and methods for the plasma processing of a substrate in a processing chamber. Some embodiments are directed to a waveform generator. The waveform g...
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WO/2022/271347A1 |
A crucible that exploits the observation that molten metal tends to flow toward the hottest regions is disclosed. The crucible includes an interior in which dopant material may be disposed. The crucible has a pathway leading from the int...
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WO/2022/268311A1 |
A cathode assembly (10) is provided. The cathode assembly includes a rotatable tube (622) having a rotational axis, a first end and a second end, the first end being opposite the second end along a direction of the rotational axis; a coo...
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WO/2022/267371A1 |
The present application belongs to the technical field of semiconductor chip production apparatuses, in particular to an excitation radio-frequency system of a plasma etching machine. The plasma etching machine comprises a plasma reactio...
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WO/2022/271396A1 |
A method of evaluating a region of interest of a sample including: positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB) column; acq...
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WO/2022/272045A1 |
A sputtering target comprising a target insert comprising a target metal compound and a skirt structure including a primary skirt and a secondary skirt. The primary skirt is disposed adjacent least a portion of a secondary skirt and comp...
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WO/2022/269925A1 |
Provided is a charged particle beam device that makes it possible to perform a high-speed autofocus operation which reduces damage to a sample by eliminating the need for a focus sweep operation or reducing the number of focus sweep oper...
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WO/2022/267372A1 |
The present application relates to a method for reducing agglomeration of silver etching by-products, comprising the following steps: step 1, providing a plurality of groups of filter screen groups in a vacuum tube connecting a dry pump ...
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WO/2022/269951A1 |
[Problem] It has not conventionally been possible for an appropriate radiation amount when rendering a shape using an electron beam to be acquired rapidly. [Solution] An appropriate radiation amount when rendering a shape using an electr...
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WO/2022/262970A1 |
A multi-beam charged particle inspection system and a method of operating a multi-beam charged particle inspection system for wafer inspection with high throughput and with high resolution and high reliability is provided. The method and...
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WO/2022/265838A1 |
Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber. Embodiments of the disclosure include an apparatus ...
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WO/2022/265882A1 |
A pressure control system includes a first sensor, a second sensor, an evacuation valve and a controller. The first sensor is configured to detect a frontside pressure within a processing chamber. The frontside pressure is indicative of ...
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WO/2022/263378A1 |
Described are a method for processing a surface of an object, in particular of a lithographic mask, an apparatus for carrying out such a method and a computer program containing instructions for carrying out such a method. A method for p...
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WO/2022/265767A1 |
Examples disclosed herein are directed to a method and apparatus for determining a position of a ring within a process kit. In one example, a sensor assembly for a substrate processing chamber is provided. The sensor assembly includes a ...
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WO/2022/265726A1 |
A method of performing x-ray spectroscopy surface material analysis of a region of interest of a sample with an evaluation system that includes a scanning electron microscope (SEM) column, an x-ray detector and an x-ray polarizer, compri...
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WO/2022/266277A1 |
Methods for detecting arcs in power delivery systems for plasma process chambers leverage visible arc detection sensors to facilitate in locating the arc and shutting down a power source associated with arc location. In some embodiments,...
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WO/2022/261684A1 |
The invention relates to an apparatus for forming a coating on and/or modifying the properties of the inner surface of a hollow article (1 ), wherein the apparatus comprises a plasma source (2), the plasma source (2) having an elongate s...
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WO/2022/266159A1 |
A gas delivery system for substrate processing tool includes a first gas box configured to supply a first gas mixture including one or more gases selected from a first set of N gases to a first substrate processing chamber, where N is an...
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WO/2022/263209A1 |
The invention relates to a signal-processing system for determining and providing a data stream describing a plasma process, said signal-processing system comprising: a) a detection device (10) which is designed to detect a signal curve ...
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WO/2022/263153A1 |
Apparatuses, systems, and methods for adjusting beam current using a feedback loop are provided. In some embodiments, a system 104 may include a first anode aperture 120b configured to measure a current of an emitted beam 161 during insp...
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WO/2022/258279A1 |
Assessment systems and methods are disclosed. In one arrangement, an effect of electrode distortion in an objective lens array is compensated. An electrode distortion is adjusted by varying an electrostatic field in the objective lens ar...
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WO/2022/257323A1 |
The present invention relates to an ion implantation method. In the ion implantation method, during the process of forming an implantation mask, an ONO stack is first formed on a semiconductor substrate, and then a second oxide layer and...
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WO/2022/261085A1 |
A radiotherapy system is provided that can include a radiation generating system having a radiation source configured to emit a charged particle beam, and a radiation probe having a first end coupled to the radiotherapy system and a seco...
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WO/2022/258446A1 |
The invention relates to a gas-inlet element (2) for a CVD reactor (1) with a first gas distribution volume (6) arranged rearward of a gas outlet plate (3), from which volume first pipes (4) having end portions (4') protruding from the g...
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WO/2022/256853A1 |
The invention relates to a method for interference variable compensation during the positioning of a sample support (2), in particular during probe microscopy, said method comprising the following steps: measuring a distance (dx1) to a f...
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WO/2022/260834A1 |
Embodiments provided herein include an apparatus and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to reducing detectivity in features for...
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WO/2022/258271A1 |
The disclosure relates to a charged particle beam apparatus configured to project charged particle beams towards a sample. The charged particle beam apparatus comprises: a plurality of charged particle-optical columns configured to proje...
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WO/2022/260827A1 |
Embodiments provided herein generally include apparatus, e.g., plasma processing systems and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed...
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WO/2022/260835A1 |
Embodiments provided herein generally include apparatus, e.g., plasma processing systems, and methods for the plasma processing of a substrate in a processing chamber. Some embodiments are directed to a radio-frequency (RF) generation sy...
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WO/2022/260930A1 |
A segmented detector device with backside illumination. The detector is able to collect and differentiate between secondary electrons and backscatter electrons. The detector includes a through-hole for passage of a primary electron beam....
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WO/2022/260836A1 |
Embodiments provided herein generally include plasma processing systems configured to preferentially clean desired surfaces of a substrate support assembly by manipulating one or more characteristics of an in-situ plasma and related meth...
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WO/2022/256086A1 |
Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber. One embodiment includes a waveform generator having...
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WO/2022/253939A1 |
The invention relates to a device (1) for characterising a surface (SE) of a sample (E), comprising: − a chamber (C) comprising a medium (PE) for said sample, said chamber being connected to a pump, referred to as the primary pump (PP)...
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WO/2022/256161A1 |
Embodiments disclosed herein include a processing tool for measuring neutral radical concentrations. In an embodiment, the processing tool comprises a processing chamber, and a neutral radical mass spectrometry (NRMS) analyzer fluidicall...
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WO/2022/254620A1 |
In a particle analysis device of the present invention that analyzes one or more particles, the particle analysis device can operate in any of a plurality of operating patterns, the plurality of operating patterns including: a first oper...
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