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WO/2024/054765A1 |
This disclosure relates generally to a polyolefin vitrimer with reversible borate moiety, to a process for preparing the polyolefin vitrimer and to a polymer composition comprising polyolefin vitrimer with reversible borate moiety.
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WO/2024/050658A1 |
Two component (2K) composition comprises: (I) a first component comprising: a) at least one epoxy silane oligomer according to Formula (AI) wherein: R e is a C 1-C 6 alkyl group; R f is an epoxide substituted C 1-C 12 alkyl group, C 3-C ...
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WO/2024/054680A1 |
The present disclosure is directed to a method of repairing a coating including: detecting at least one hole in a coating applied over a metal component; applying a liquid epoxy coating over the at least one hole; placing a peel ply heat...
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WO/2024/052060A1 |
The present disclosure is directed to a curable and electrochemically disbondable one component (1K) adhesive composition comprising: a) at least one epoxide compound; b) a curing agent consisting of one or more compounds which have at l...
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WO/2024/053609A1 |
The purpose of the present invention is to provide: an alkali-soluble resin able to yield a cured product having a high refractive index; a photosensitive resin composition; and a cured product. The present invention is an alkali-soluble...
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WO/2024/053402A1 |
The purpose of the present invention is to provide: a compound which is a curable resin and enables a cured product thereof to easily achieve repairability, re-formability and easy dismantlability; a curable resin composition which uses ...
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WO/2024/053548A1 |
The purpose of the present invention is to provide a photocurable resin sheet that is excellent in scratch resistance at high temperature. The present invention provides a photocurable resin sheet that contains (A) a high molecular compo...
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WO/2024/053436A1 |
Provided is a cured product obtained by curing a composition containing: a monomer A having an ethylenically unsaturated group and a host group in a molecule thereof, wherein the host group is a monovalent group obtained by removing one ...
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WO/2024/053664A1 |
An electroconductive composition comprising: 100 parts by mass of a binder component comprising 40-70 parts by mass of a solid bisphenol type epoxy resin and 30-60 parts by mass of one or more liquid epoxy resins including at least one r...
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WO/2024/047421A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a curable resin and a curing accelerator, wherein the curing accelerator comprises calcium hydroxide nitrate particles. Th...
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WO/2024/046794A1 |
A phosphinate or a composition of phosphinates obtainable or obtained by reacting at least a phosphinic acid of formula (I) with an oxirane of formula (II) wherein R1 and R2 are the same or different and independently represent H or a hy...
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WO/2024/046698A1 |
The present invention relates to a multi-component resin system comprising (i) at least one resin component (A) comprising at least one curable expoxy resin, and (ii) at least one hardener component (B) comprising at least one primary al...
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WO/2024/048487A1 |
A composition for forming a gap-filling material, the composition comprising: a compound and/or a polymer each having a structure represented by formula (1) and a carbonyl bond; and a solvent. (In formula (1), R1 and R2 each independentl...
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WO/2024/048632A1 |
The present invention addresses the problem of providing a new compound having excellent film formability and curability that can yield a cured product that exhibits a high refractive index. The present invention relates to a compound ...
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WO/2024/048627A1 |
This conductive coating contains, with respect to 100 parts by mass of a binder component (A) containing an epoxy resin: 1200-3200 parts by mass of metal particles (B); 70-200 parts by mass of a block isocyanate curing agent (C); 5-50 pa...
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WO/2024/048612A1 |
This curable composition contains (A) an alicyclic epoxy resin and (B1) an active hydrogen compound which has a pKa of 10 or less.
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WO/2024/048431A1 |
Provided is a conductive polymer solution from which it is possible to provide an electrolytic capacitor that has a high capacity and that exhibits low ESR characteristics. The present invention uses a conductive polymer solution that co...
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WO/2024/048369A1 |
A resin composition for sealing a stator according to the present invention is used for forming a sealing member in a stator provided with a stator core which has a plurality of teeth sections and a plurality of slots which are formed al...
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WO/2024/048635A1 |
The present invention addresses the problem of providing a novel compound that is capable of providing a cured product exhibiting a high refractive index, and has excellent curability. The present invention relates to a compound that i...
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WO/2024/049140A1 |
The present invention relates to a reprocessable or recyclable cured liquid crystal epoxy resin that can be reprocessed or recycled, a re-cured product thereof, and a method for producing same. More specifically, provided are: a cured li...
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WO/2024/048481A1 |
Provided are a composition, and a resin composition and cured product using the composition. The composition includes an amino group and a cyclic ether structure, and contains a compound having a molecular weight of 1000 or less, and a l...
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WO/2024/048592A1 |
The purpose of the present invention is to provide a blocked urethane which can improve epoxy toughness, exhibits excellent storage stability, and serves as a raw material for a high-quality adhesive. This problem can be solved by a bl...
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WO/2024/043256A1 |
[Problem] To provide a method for growing a plant using a water absorbing resin that is not deactivated easily by calcium ions, magnesium ions, etc. in soil, water, or fertilizer. [Solution] This method serves to grow a plant such as gra...
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WO/2024/043038A1 |
The present invention is a cationically curable composition characterized by containing: (A) a cationically polymerizable compound which has a skeleton composed of an addition reaction product of (a) a Si-H group-containing compound repr...
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WO/2024/042952A1 |
The present invention provides: an acid generator which exhibits excellent solubility in a cationically curable compound; and a curable composition which is rapidly cured when subjected to a heat treatment, and which forms a cured produc...
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WO/2024/042413A1 |
The present disclosure provides a printable structural adhesive composition. The present disclosure further provides methods for applying a structural adhesive onto a substrate, the method comprising printing the structural adhesive onto...
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WO/2024/041581A1 |
The present application relates to a Michael Addition curable composition, and its application as well as a process for preparing modified epoxy resin suitable for the above composition. In particular, the Michael Addition curable compos...
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WO/2024/042951A1 |
Provided is an acid generator that has superior solubility in cation-curable compounds. This acid generator includes: a salt (1) of a cation represented by formula (c-1) and a monovalent counter anion; and a salt (2) of a cation repres...
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WO/2024/038761A1 |
The purpose of the present invention is to provide a cured product having excellent impact resistance. A cured product according to one mode of the present invention is obtained by curing a curable composition containing a (meth)acrylic ...
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WO/2024/040260A1 |
Disclosed are compositions comprising: a first component comprising an epoxy-containing compound; a second component comprising an aliphatic amine, an amidoamine, and a flexibilizing amine; an accelerator; and elastomeric particles. Also...
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WO/2024/038795A1 |
The present invention is a photo-cationically curable silicone composition comprising (A) an epoxy silicone represented by general formula (1) (where Me is a methyl group, Ph is a phenyl group, RE is a monovalent substituent containing a...
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WO/2024/039927A1 |
Disclosed herein are compositions comprising a first component comprising an epoxy-containing compound (E1), a second component comprising an amine-functional aliphatic etheramine-epoxy adduct (A1), elastomeric particles, and an auxiliar...
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WO/2024/038048A1 |
The invention relates to a curable one-component adhesive composition comprising (a) liquid epoxy resin; (b) latent epoxy curing agent; (c) silica; and (d) metal oxide; wherein the weight content of the liquid epoxy resin is at least 20 ...
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WO/2024/033032A1 |
The invention relates to a curable compound which is used to produce a part with a thermomechanically releasable joint connection, a coating, or a potting material. The compound has the following components: (a) at least one epoxy compou...
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WO/2024/035866A1 |
A two-part thermally conductive curable composition exhibits high dispensing rates and cures to a thermally conductive interface material with high thermal reliability, including high fracture toughness and elongation properties. The cur...
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WO/2024/034885A1 |
The present invention relates to an epoxy paint composition having excellent properties under various curing conditions.
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WO/2024/028750A1 |
Described is an epoxy-based protective coating product comprising a mixture of an acrylic resin, an epoxy resin and at least one complex amine wherein the ratio by weight of said acrylic and epoxy resins with said at least one complex am...
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WO/2024/028206A2 |
Described is a method of detecting a leak in a water impermeable liquid applied membrane comprising the following steps: a) applying a water impermeable membrane M onto an electrically conductive layer ECL located on a support substrate ...
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WO/2024/029602A1 |
The present invention provides: a cured molded product having excellent moldability and reliability, and having high thermal conductivity, low water absorption, low thermal expansion, high heat resistance, and flame retardancy; in additi...
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WO/2024/029233A1 |
The present invention addresses the problem of providing: a prepreg which comprises a resin composition and has excellent elastic modulus and heat resistance and also has excellent appearance including weather resistance and transparency...
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WO/2024/030184A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/030183A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/029315A1 |
A method for producing a (meth)acrylic resin having an ethylenically unsaturated group comprising a step (i) that reversible addition-fragmentation chain transfer (RAFT) polymerizes a raw material monomer group (M) containing a hydroxy g...
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WO/2024/029496A1 |
This curable resin composition contains a polyorganosiloxane compound that has an alicyclic epoxy group and an epoxy compound that has a plurality of glycidyl epoxy groups. The polyorganosiloxane compound is a condensate of a silane comp...
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WO/2024/027960A1 |
The present invention relates to epoxy resin compositions comprising a resin component containing at least one epoxy liquid resin, a hardener component containing at least one amine hardener, and at least one bio-based granular material ...
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WO/2024/024918A1 |
A polymerizable composition containing: an episulfide compound represented by formula (1); a polyiso(thio)cyanate compound; a polythiol compound; an epoxy compound (X) containing one or more epoxy groups and no episulfide groups per mole...
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WO/2024/024525A1 |
Provided are an epoxy resin composition exhibiting excellent low-dielectric properties, an epoxy resin giving the epoxy resin composition, and a method for producing the epoxy resin. The epoxy resin is characterized by comprising an epox...
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WO/2024/024881A1 |
In cases where a component having a low molecular weight is added to conventional epoxy resin compositions for the purpose of improving the workability thereof, the component having a low molecular weight is likely to volatilize and it i...
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WO/2024/024442A1 |
The present invention provides a resin composition which contains an alicyclic epoxy resin, a basic catalyst, a phenolic hydroxyl group-containing compound and a dye.
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WO/2024/022901A1 |
The invention relates to a process for producing an epoxy resin composition for preimpregnating materials, wherein an epoxy resin that has been provided is heated to a temperature in the range of 60°C to 100°C and is mixed with a harde...
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