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WO/2019/124430A1 |
A Cu-Ga alloy sputtering target according to the present invention has a composition which contains Ga, as a metal component, in an amount of from 20% by atom to 45% by atom (inclusive), and which additionally contains K and Na in a tota...
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WO/2019/124351A1 |
This Cu-Ga alloy sputtering target has a composition containing Ga in an amount of 20-40 atomic% as a metal component, and further containing Na and K in a total amount of 0.05-1.0 atomic%, the balance comprising Cu and unavoidable impur...
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WO/2019/117041A1 |
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...
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WO/2019/116946A1 |
Provided are a cladding and a method for producing the same with which it is possible to prevent cracking and peeling from occurring even in the case of punching out (application of shear that is greater than thermal shock) due to press-...
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WO/2019/111898A1 |
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...
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WO/2019/107721A1 |
The present invention relates to a method for producing a copper-titanium (Cu-Ti)-based copper alloy material, and a copper alloy material produced thereby, wherein a copper alloy material for vehicles and electronic components requiring...
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WO/2019/102716A1 |
This mold material for casting is used in cases where a metal material is cast, and has a composition that contains Cr in an amount within the range of from 0.3 mass% to 0.7 mass% (inclusive), Zr in an amount within the range of from 0.0...
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WO/2019/098350A1 |
The present invention provides a heat dissipation plate that has a low thermal expansion coefficient and of high thermal conductivity, and that has a clad structure formed of a Cu-Mo composite material and a Cu material. This heat dissip...
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WO/2019/099830A1 |
Processes are disclosed for forming beryllium-copper metal rings having a fine and uniform grain structure. A raw BeCu casting is pre-forged and turned to form a BeCu billet. The BeCu billet is subjected to various heat treatment and coo...
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WO/2019/097846A1 |
Provided is a corrosion-resistant CuZn alloy comprising 15-55 mass% of Zn and the remainder including Cu and inevitable impurities, wherein the total amount of the Zn content and the Cu content is 99.995 mass% or more, and the number of ...
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WO/2019/088222A1 |
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...
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WO/2019/088080A1 |
Disclosed is a superconductivity stabilizing material which is used for a superconducting wire, which is formed of a copper material containing 3-100 ppm by mass, in total, of one or more types of additive elements selected from among Ca...
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WO/2019/088419A1 |
The present invention relates to a copper alloy having high strength and high electrical conductivity characteristics for an electrical and electronic component and a semiconductor and to a method for manufacturing the same. The copper a...
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WO/2019/082932A1 |
The present invention provides a method for manufacturing a thermoelectric conversion module having: a thermoelectric semiconductor portion in which a plurality of p-type semiconductors and n-type semiconductors are alternately arranged;...
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WO/2019/078474A1 |
The present invention provides a high-strength copper alloy sheet having high heat resistance and high heat dissipation characteristics, and a manufacturing method therefor, the sheet being suitable for: a material for a shield can for t...
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WO/2019/078975A1 |
Disclosed herein are composites comprising various fractions of ultra coarse (UC) tungsten carbide (WC) and cast carbide (CC). Further, disclosed herein are composites comprising fractions of UC-WC and CC having various particle size and...
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WO/2019/072581A1 |
The present invention relates to a bronze-polytetrafluoroethylene compound based on an oxidation-resistant bronze powder, and to a method for producing the bronze-polytetrafluoroethylene compound. In another aspect, the present invention...
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WO/2019/064745A1 |
This metal powder is characterized in that: a coating film, which is composed of at least one among Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, and Sm, is formed on the surface of coppe...
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WO/2019/044073A1 |
[Problem] To provide: a copper alloy shaped structure which has higher mechanical strength and/or higher electrical conductivity/thermal conductivity; and a copper alloy powder which enables the production of this copper alloy shaped str...
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WO/2019/045285A1 |
The present invention relates to a copper alloy for dental prosthesis and, specifically, to a copper alloy for dental prosthesis having such color and luster that the copper alloy can be used as a substitute for a gold alloy and having e...
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WO/2019/043499A1 |
A method for forming a multilayer composite structure comprises providing a first sheet comprising a copper-comprising layer sandwiched by first and second graphene layers, wrapping the first sheet to form a first rod, and compacting the...
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WO/2019/035224A1 |
This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the follo...
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WO/2019/035226A1 |
This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the fol...
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WO/2019/034506A1 |
The present invention relates to an alloy of the following composition: Cu47at%-(x+y+z)(TiaZrb)cNi7at%+xSn1at%+ySiz, wherein c - 43 - 47 at%, a = 0.65-0.85, b=0.15-0.35, wherein a+b=1.00; x = 0-7 at%; y = 0-3 at%, z = 0-3 at%, wherein y+...
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WO/2019/035225A1 |
This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities...
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WO/2019/029031A1 |
An additive manufacturing method for a lead-free environmentally-friendly high-strength brass alloy, the method mainly comprising the five steps of gas atomization milling, model construction, molding chamber preparation, pre-powdering, ...
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WO/2019/031191A1 |
The purpose of the present invention is to provide a copper pipe, which is capable of exhibiting higher corrosion resistance to ant nest corrosion over long periods, can be used suitably as heat transfer pipes, coolant piping, etc. in ai...
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WO/2019/030416A1 |
The invention relates to a copper alloy, the elements of which have the following mass fractions: - 46 % to 53.5 % of copper (Cu); - 0 % to 1.0 % of aluminum (Al); - 0 % to 1.40 % of lead (Pb); - 0 % to 0.2 % of iron (Fe); - 0 % to 0.4 %...
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WO/2019/031612A1 |
Provided is a high strength/highly conductive copper alloy plate material which is practically applicable to conductive members that are required to have high strength and conductivity. A high strength/highly conductive copper alloy plat...
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WO/2019/029023A1 |
A copper-based composite material for a conductive part of a locomotive. The copper-based composite material comprises Sn, Al2O3 and Cu. The preparation of the copper-based composite material is controlled by the smelting temperature, sm...
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WO/2019/029024A1 |
A continuously cast alloy material for a bearing bush and a preparation method thereof. The alloy material is prepared from the following components: 1.5-3.5 wt% of zinc, 3.5-7.5 wt% of tin, 0.3-1.0 wt% of bismuth, 0.15-0.5 w% of silicon...
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WO/2019/029018A1 |
A copper-based alloy material for an electronic hardware of a locomotive and a preparation method thereof. The copper-based alloy material comprises, in percentage by weight, the following components: 0.3-0.7% of zinc, 0.3-0.7% of tin, 0...
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WO/2019/022039A1 |
Provided are a method for synthesizing a copper-silver alloy, whereby a copper-silver alloy can easily be synthesized at low temperature and in a short time, a method for forming a conduction part, and a copper-silver alloy and a conduct...
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WO/2019/020557A1 |
The invention relates to an apparatus for handling bulk goods containing fines that can result in the formation of explosive dust-air mixtures, said apparatus comprising movable built-in parts inside a housing, the interior of which hous...
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WO/2019/020208A1 |
The invention relates to a wire material consisting of metallic material having an oxide surface, wherein the oxide surface of the wire material has a first oxide layer, which covers the metallic material at least in part and has a thick...
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WO/2019/022527A1 |
The present invention relates to a high-strength copper alloy comprising 13.0-35.0 wt% of nickel (Ni), 5.0-10.0 wt% of manganese (Mn), 4.0-10.0 wt% of tin (Sn), chromium (Cr) in an amount greater than 0.0 and less than or equal to 6.8 wt...
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WO/2019/017467A1 |
[Problem] To provide a copper powder which has a composition equivalent to that of pure copper and with which a dense stereolithographic model using copper can be obtained. [Solution] The present invention provides a copper powder having...
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WO/2019/018620A1 |
Connectors (206, 208) including one or more electrical contacts (207, 209) and a magnetic portion are disclosed. The magnetic portion is made from a copper alloy comprising nickel, tin, manganese, and balance copper. In some embodiments,...
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WO/2019/017349A1 |
Provided is a negative electrode active material having a greater capacity retention rate and capacity per volume. The negative electrode active material according to this embodiment of the present invention contains alloy particles. The...
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WO/2019/013074A1 |
A covered electrical wire comprising a conductor and an insulation covering layer that covers the periphery of the conductor, wherein the conductor is a stranded wire that is obtained by twisting together a plurality of strands formed fr...
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WO/2019/013073A1 |
A covered electrical wire comprising a conductor and an insulation covering layer that covers the periphery of the conductor, wherein the conductor is a stranded wire in which a plurality of strands that are formed from a copper alloy ar...
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WO/2019/013163A1 |
[Problem] To manufacture a conductive member using a material and a working method that are different from conventional ones, paying attention to a material constituting a contact pin and to a working method therefor. [Solution] Although...
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WO/2019/008003A1 |
The invention relates to a soldering material (1) for active soldering, in particular for active soldering a support layer (2) comprising a metallization (3) on a ceramic, the soldering material comprises copper and essentially does not ...
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WO/2019/007301A1 |
A Cu-based microcrystalline alloy and a method for manufacturing same. The alloy contains 20-30% of manganese, 0.01-10% of aluminum, 5-10% of nickel, 0.3-1.5% of titanium, 0-1.5% of zirconium, 0.05-2% of silicon, and 45-74.64% of copper,...
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WO/2019/007309A1 |
Disclosed are an environmentally friendly brass alloy for casting and a manufacturing method therefor. The brass alloy is free of the elements selenium, tellurium, antimony, phosphorus, magnesium and manganese, and the components thereof...
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WO/2019/004384A1 |
The present invention provides a bearing for a motor-type fuel injection pump, the bearing being formed of a Cu-Ni-based sintered alloy that is inexpensive and exhibits excellent corrosion resistance and abrasion resistance. The present ...
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WO/2019/002122A1 |
The present invention discloses a method for producing a component containing copper by means of selective laser sintering, which method comprises the following method steps: - providing (S1) a metal power containing a copper-chrome allo...
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WO/2019/004331A1 |
Provided is a conductive paste capable of forming a highly conductive conduction layer even when spherical copper powder having a small particle size is used, wherein, when a first paste containing 100 parts by weight of a binder resin a...
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WO/2018/235529A1 |
[Problem] To provide a technology with which good wear resistance can be achieved using a simple structure. [Solution] A sliding member and a slide bearing in which a coating layer with a surface for sliding with respect to a mating mate...
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WO/2018/235458A1 |
Provided are: an ultrafine copper alloy wire for a spring, which exhibits excellent strength and high electrical conductivity; and a method for producing same. This ultrafine copper alloy wire for a spring has a wire diameter of 100 µm ...
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