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Matches 1,251 - 1,300 out of 19,437

Document Document Title
WO/2014/140187A1
Systems and methods for creating an inductive element are disclosed. Multiple partial windings may be created relative to a core, where each of the partial windings is initially discontinuous. Multiple printed conductors may be created o...  
WO/2014/141671A1
In an odd number of three or more layers (L1-L3) of a substrate (3), a coil pattern (4a-4c) is wound a plurality of times in the same direction around an opening section (3m) into which a core (2a) is inserted. In the first layer (L1) on...  
WO/2014/139169A1
Disclosed are exemplary embodiments of chip type high bias retention suppressors that have a laminated structure, which comprises a ferrite magnetic substrate, dielectric material layers, and interior electrically-conductive or conductor...  
WO/2014/141674A1
This printed circuit board (3) with an integrated coil is provided with the following: coil patterns (4a through 4e) formed on a plurality of layers (L1 through L3); through-hole groups (9a through 9d) that electrically connect coil patt...  
WO/2014/142068A1
A power feeding-side resonance coil (23) feeds power to a power receiving-side resonance coil (31) in a non-contact manner. The power feeding-side resonance coil (23) is provided with a first power feeding-side coil section (23A) and a s...  
WO/2014/145422A2
The present disclosure provides a vertical inductor structure in which the magnetic field is closed such that the magnetic field of the vertical inductor structure is cancelled in the design direction outside the vertical inductor struct...  
WO/2014/141672A1
A substrate (3) that has openings (3m, 3L, 3r) through which a core (2a) is inserted is provided with coil patterns (4a through 4e) on outer layers (L1, L3) and an inner layer (L2). Heat-dissipating patterns (5a7 through 5a9, 5b7 through...  
WO/2014/143385A1
A circuit for implementing a gain stage in an integrated circuit is described. The circuit comprises a first inductor (206) formed in a first plurality of metal layers (402-408); a second inductor (212) formed in a second plurality of me...  
WO/2014/141668A1
This magnetic device (1) is provided with the following: a magnetic core (2a); an insulating substrate (3) through which protrusions (2m, 2L, 2r) on the core (2a) pass; and a conductor provided on the substrate (3). Said conductor contai...  
WO/2014/141559A1
Provided are: an inductor element for high-frequency use, having increased inductance, reduced internal resistance, and being capable of obtaining a high Q value; and an LC filter comprising same. The LP filter (1) is formed by a first...  
WO/2014/141673A1
In this printed circuit board (3) with an integrated coil, conductive coil patterns (4a through 4e) are formed on a plurality of layers (L1 through L3) and conductive heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provi...  
WO/2014/141669A1
This magnetic device (1) is provided with the following: a magnetic core (2a, 2b); an insulating substrate (3) that has a plurality of layers (L1 through L3); conductive coil patterns (4a through 4e) provided on each layer (L1 through L3...  
WO/2014/141670A1
This magnetic device (1) is provided with the following: a core (2a); a multilayered substrate (3) that has openings (3m, 3L, 3r) through which the core is inserted (2a), one layer (L3) on the surface of the substrate (3), and a pluralit...  
WO/2014/136342A1
This layered inductor element (10) is provided with a magnetic laminate (100) in which magnetic body layers (110, 120, 130, 140) are laminated in the given order. Wound coil conductors (211, 212) are respectively provided to magnetic bod...  
WO/2014/136843A1
Provided is an electronic component in which the occurrence of chipping in a laminate can be suppressed. A laminate (12) is constituted by laminating a plurality of rectangular insulator layers, and comprises: a bottom surface (S2) that ...  
WO/2014/137902A1
Some implementations provide a coupled inductor structure that includes a first discrete inductor configured to generate a magnetic field, a second discrete inductor, and a first ferromagnetic layer coupled to the first discrete inductor...  
WO/2014/137646A1
This disclosure provides systems, methods and apparatus for three-dimensional (3-D) through-glass via inductors. In one aspect, the through-glass via inductor includes a glass substrate with a first cavity, a second cavity, and at least ...  
WO/2014/129279A1
An inductor bridge (101) is provided with an element (10) that is flexible and that has a flat plate shape, a first connector (51), and a second connector (52). An inductor section (30) is configured inside of the element (10). The induc...  
WO/2014/129278A1
An element for bridging the gap between and connecting a first circuit and a second circuit is provided with: an element (10) that is flexible and that has a flat plate shape; a first connector (51) that is provided to a first end sectio...  
WO/2014/125894A1
A laminated circuit substrate (101) in which a capacitor (C1) and a coil (L1) are provided, and which is manufactured by laminating sheets (11-15), and using an implement (90) to pressure bond the sheets from the vertical lamination dire...  
WO/2014/125895A1
The purpose of the present invention is to prevent the direct-current resistance of an electronic component after firing from being increased in comparison to the direct-current resistance of the electronic component before firing, in sa...  
WO/2014/123790A1
Some novel features pertain to an inductor structure that includes a first inductor winding, a second inductor winding and a filler. The first inductor winding includes an electrically conductive material. The second inductor winding inc...  
WO/2014/122813A1
Provided is a layered inductor element in which open defects and water ingress can be prevented. The end surface of a via-hole in the layered inductor element is exposed on the top surface of a layered body. Opening of the top surface du...  
WO/2014/119214A1
An objective of the present invention is to provide a surface mount coil component whereby it is possible, while achieving a lower height, to prevent ferrite core cracking. To this end, a surface mount coil component (1) is configured fr...  
WO/2014/120111A1
This invention relates to an inductor, more particularly, to an inductor with variable inductances.  
WO/2014/119411A1
Provided are a high-frequency-signal transmission line and an electronic device, with which a reduction in thickness can be achieved, while inhibiting a reduction in coil-inductance value. A ground conductor (22) is provided to a dielect...  
WO/2014/115433A1
A coil component (1) is equipped with a layered body (2) and coil conductors (33A, 34A, 35A). The layered body (2) is configured by layering insulating layers (21-25) and wiring layers (31-35). The coil conductors (33A, 34A, 35A) have a ...  
WO/2014/101380A1
A power inductor and a manufacturing method thereof. The inductor comprises an inner core (2), a die-casting body (1) coating the inner core and metal layers (3) provided on the die-casting body. The inner core comprises a body (21) and ...  
WO/2014/095884A1
The invention relates to a method for producing a coil (90, 92) as a measurement transmitter for a sensor (4), comprising: providing electrical connections (74) and a magnetic core (76) for the coil (90, 92), forming a coil former (78, 8...  
WO/2014/095486A1
The inductor core (5) has a higher magnetic permeability than air, and comprises an endless channel adapted for containing an inductor winding (2), where the inductor core extends along a first axis A, and the inductor winding (2) extend...  
WO/2014/092169A1
An inductance component (1) provided with the following: a magnetic core (10) that comprises a main magnetic-core body (12), said main magnetic-core body (12) having a magnetic-saturation-preventing air gap (16) in at least one place alo...  
WO/2014/092114A1
Provided is a laminated coil component that exhibits excellent DC superimposition characteristics and can use copper, which is inexpensive, as an internal conductor. Said laminated coil component has the following: a magnetic body compri...  
WO/2014/091589A1
A magnetic device (1) provided with a magnetic core (10) that comprises the following: a main magnetic-core body (12) that has, in at least one place along the magnetic path thereof, an air gap (16) for preventing magnetic saturation; an...  
WO/2014/091812A1
A bus bar assembly comprising a magnetic body (30) having insertion holes (33) and a bus bar (20) arranged along these insertion holes (33), wherein: the bus bar (20) is shaped such that the direction of the current (E) flowing along a p...  
WO/2014/068612A1
Provided is a production method for a coil element, whereby a resin mold can be used and the thickness of the coil element can be reduced without peeling away or transfer. The production method for the coil element uses a resin mold capa...  
WO/2014/068611A1
In order to manufacture a coil component without using an insulated substrate, a method for producing a coil element by using a transfer mold is provided, said method having: a step in which a transfer mold having an inverse coil element...  
WO/2014/069056A1
In the present invention, the length of a first coil conductor and the length of a second coil conductor can be made almost the same, and shorting between the first coil conductor and the second coil conductor can be minimized. A coil co...  
WO/2014/069050A1
Provided is a laminated inductor with which the number of layers sandwiching a non-magnetic material layer can be reduced, and which can improve direct current superposition properties without the intentional provision of gaps. Among t...  
WO/2014/068613A1
Provided is a production method for a coil element, having no impediment to the use of a post-retrieval coil element pattern. A production method for a coil element, using a transfer mold and having: a step in which a transfer mold is pr...  
WO/2014/068614A1
In order to manufacture a coil component having a high-aspect conductive pattern, this method for producing a coil element being characterized by having: a step in which a groove section is formed in the substrate surface of a resin subs...  
WO/2014/065905A1
An inductor structure implemented within a semiconductor integrated circuit (IC) includes a coil (105) of conductive material including at least one turn and a current return (130, 500) encompassing the coil. The current return is formed...  
WO/2014/062311A2
This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate ...  
WO/2014/061082A1
The present invention improves power transmission efficiency. A power reception apparatus (20) is provided with: a power reception coil (21), which receives power via a magnetic field; and a magnetic sheet (22) that is disposed parallel ...  
WO/2014/061351A1
This common mode filter (101) comprises, between ports (P1, P2) and ports (P3, P4), a differential transmission line constituted by a first signal line (SL1) and a second signal line (SL2). A first inductor (L1) is inserted in series in ...  
WO/2014/062310A2
This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate ...  
WO/2014/061670A1
A laminated coil device includes a magnetic part (5) that includes a metallic magnetic material and a first glass component, and a non-magnetic part (6) that includes a ceramic material and a second glass component, and a coil conductor ...  
WO/2014/051701A1
A method of manufacturing a substrate includes providing a substrate with a cavity and a post in the cavity, dispensing an elastic filling material in the cavity, inserting a magnetic core including a core hole such the post extends thro...  
WO/2014/050867A1
The present invention provides a laminated coil component (11) which comprises a magnetic part (2) that contains at least Fe, Mn, Zn and Ni and a coil-shaped conductor part (3) that is mainly composed of copper, and which is characterize...  
WO/2014/050244A1
A linear conductive body (20) is provided on one main surface of a magnetic material layer (12b), and a linear conductive body (18) is provided on the other main surface of the magnetic material layer (12b). Furthermore, side surface con...  
WO/2014/049807A1
A semiconductor device characterized in having a direct-current power source, a reference potential, first and second arm circuits serially connected between the reference potential and the direct-current power source, and a load inducto...  

Matches 1,251 - 1,300 out of 19,437