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WO/2019/111686A1 |
A polishing composition containing a cellulose derivative and water is provided. Prior to being mixed with water, the cellulose derivative has the form of a hydrophobized cellulose derivative having an aldehyde added to the surface of sa...
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WO/2019/110385A1 |
The invention relates to a rotor disk for guiding semiconductor wafers during material-removing machining of the semiconductor wafers on both sides. The rotor disk is coated with a layer of diamond-like carbon. The layer contains hydroge...
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WO/2019/100461A1 |
A multi-chip thickness compensation device for single-sided polishing, a grinding device, and a grinding method. The device comprises a carrier (1). Multiple chip accommodation grooves (7) are formed in the carrier (1). Chip carrying cus...
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WO/2019/099541A1 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...
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WO/2019/097945A1 |
The present invention relates to a polishing agent for a synthetic quartz glass substrate, the polishing agent being characterized by comprising wet ceria particles and non-spherical silica particles, wherein the average primary particle...
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WO/2019/094227A1 |
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...
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WO/2019/087818A1 |
Provided is a polishing composition which contains a water-soluble polymer compound and which is suitable for reducing LPD. The polishing composition according to the present invention contains abrasive grains, a water-soluble polymer co...
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WO/2019/088600A1 |
The present invention relates to a polishing apparatus which is disposed below a polishing wheel so as to polish the surface of a workpiece, the polishing apparatus comprising: a frame which has a central shaft disposed collinearly to on...
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WO/2019/089467A1 |
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in...
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WO/2019/088209A1 |
According to the present invention, in a particle size distribution for a cerium oxide contained in a polishing liquid as obtained by a laser diffraction/scattering method, D5 is 1 μm or less, and the difference between D95 and D5 is 3 ...
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WO/2019/077687A1 |
This silicon wafer polishing method includes a final polishing step comprising a preliminary stage polishing step, and, thereafter, a finishing polishing step. The preliminary stage polishing step comprises first supplying, as the polish...
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WO/2019/078009A1 |
A device (2) for affixing a wafer (W) to a single-side polishing device (1), wherein the device (2) affixes the wafer to the single-side polishing device by means of surface tension of water, is provided with: a temporary cradle (21) whi...
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WO/2019/078202A1 |
This polishing jig for holding and polishing a plate-like body comprises a metal plate including a through-hole for holding the plate-like body, and a gear portion which engages with an outer circumference of the metal plate, wherein the...
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WO/2019/074098A1 |
The objective of the present invention is to provide a polishing pad with which it is possible to reduce the occurrence of scratches while maintaining a high polishing rate, and a method for manufacturing the same. This polishing pad is ...
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WO/2019/073956A1 |
A holding pad comprising a resin sheet which has a holding surface for holding an object to be polished, wherein the penetration speed, expressed in formula (1), of ethanol into the holding surface is 1.0 to 2.0 deg/s. (1): penetration s...
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WO/2019/070757A1 |
Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surfa...
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WO/2019/064121A1 |
Polymeric foam layer having a thickness up to 25,700 micrometers, having first and second opposed major surfaces, and comprising foam features extending from or into the first major surface by at least 100 micrometers, and having a Tg in...
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WO/2019/066014A1 |
Provided is a polishing composition which exhibits excellent polishing performance with respect to the surfaces of materials such as alloys, resins, metals, semimetals, and oxides of metals or semimetals, and which is reduced in scatteri...
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WO/2019/065994A1 |
Provided is a polishing composition which is capable of achieving a good balance between high polishing rate and good surface quality. The present invention provides a polishing composition for polishing a polishing object material. This...
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WO/2019/065357A1 |
Provided is a polishing composition having excellent capability for removing protrusions at the hard laser mark periphery. This polishing composition contains abrasive grains, a basic compound, and water. The basic compound includes a co...
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WO/2019/058871A1 |
The present invention provides a polishing head for performing polishing by holding a rear surface of a workpiece and bringing a top surface of the workpiece into sliding contact with a polishing cloth affixed to a platen, characterized ...
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WO/2019/057579A1 |
The invention relates to precision finishing machine, with a tool which has a rotating effective surface (36, 44) for machining a workpiece, wherein for rotationally driving the tool a drive which drives the tool about an axis of rotatio...
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WO/2019/055279A1 |
A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values th...
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WO/2019/052743A1 |
The invention relates to a method for zonal polishing of a workpiece 140, in which a polishing tool 100, 200 passes a structured polishing coating 322, 332, 412, 512, the structure of which is adapted to the polishing tool 100, 200, over...
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WO/2019/051998A1 |
Disclosed are a method, apparatus and system for detecting a spectrum end point in chemo-mechanical polishing. The method comprises: according to spectrum detection data of a polished thin film on a surface of a wafer, determining smooth...
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WO/2019/049659A1 |
A polishing end-point position is detected in order to end polishing at an appropriate position. According to one embodiment of the present invention, a method for chemically and mechanically polishing a substrate provided with a functio...
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WO/2019/049932A1 |
The present invention involves manufacturing a starting material for a cerium-based abrasive agent by means of a step for dry milling a mixed rare earth oxide having a rare earth element content of 80% by mass or more in terms of oxides,...
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WO/2019/049610A1 |
Provided is a polishing composition with which it is possible to simultaneously realize low LPD and low surface roughness. The polishing composition provided by the present invention includes abrasive grains, a water-soluble polymer, a s...
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WO/2019/044978A1 |
This slurry contains abrasive grains, a liquid medium, and a salt of a compound represented by expression (1). The abrasive grains include first particles and second particles contacting said first particles. The first particles contain ...
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WO/2019/041393A1 |
A lapping and polishing mechanism comprises an indexing plate (10), a bushing (20), an eccentric sleeve (330), an eccentric adjustment piece (320), a spring (340), a position-limiting column (310), and a connecting shaft (360). The eccen...
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WO/2019/042428A1 |
Disclosed are a polishing pad, a polyurethane polishing layer and a preparation method therefor, belonging to the technical field of polishing in chemical mechanical planarization. The polyurethane polishing layer, wherein same has a the...
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WO/2019/043819A1 |
This slurry contains abrasive grains, a liquid medium, and at least one type selected from the group consisting of compounds represented by expression (1) and salts thereof. The abrasive grains include first particles and second particle...
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WO/2019/044497A1 |
Proposed are: a method for producing a carrier which is capable of suppressing deterioration of the planarity of a polished semiconductor wafer surface even in cases where double side polishing of a semiconductor wafer is performed repea...
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WO/2019/041391A1 |
A lapping and polishing machine and an auxiliary mechanism thereof. The auxiliary mechanism comprises an indexing plate (10), a bushing (20), and an eccentric assembly (30). One end of the bushing (20) is provided with a rotating shaft (...
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WO/2019/041392A1 |
A polishing machine and a rotation positioning mechanism thereof. The rotation positioning mechanism comprises a positioning ball (410), a fixing base (420), an elastic member (430), and an adjustment pin (440). The fixing base (420) is ...
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WO/2019/039419A1 |
In a substrate polishing device in which a polishing fluid passes through the inside of a rotary joint, maintenance of the rotary joint is required. Disclosed is a substrate polishing device having: a polishing head for holding a substra...
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WO/2019/038675A1 |
An article includes a surface layer and a base layer coupled to at least a portion of the surface layer. The surface layer includes a top major surface defining a plane and a bottom major surface opposite the top major surface. A plurali...
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WO/2019/033524A1 |
An anti-bounce tooling for a laser printer rubber roller grinding machine comprises mounting blocks (1). The mounting blocks (1) are in two lines, and the two lines of mounting blocks (1) are symmetrically arranged left to right. There a...
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WO/2019/030827A1 |
A polishing solution-based polishing method to be used on an article having a Co-containing portion to be polished, wherein the polishing solution contains water, polishing particles, and a metal solubilizer, the polishing solution has a...
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WO/2019/031789A1 |
An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent w...
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WO/2019/030865A1 |
Provided is a polishing solution comprising abrasive grains, a phosphonic acid compound having a molecular weight of 210 or more, and at least one selected from the group consisting of an amino acid and an amino acid derivative, the abra...
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WO/2019/029605A1 |
An adaptive polishing head (100), comprising: a pivot component (10), a base body (30) and a clip component (20); the pivot component (10) is composed of a shaft body (11) and a disc body (12), the base body (30) is provided with a shaft...
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WO/2019/032234A1 |
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...
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WO/2019/031788A1 |
An embodiment relates to a polishing pad window which is surface-treated and thus can prevent an endpoint detection error that may be caused by wear of the window during a CMP process, and a polishing pad comprising the same.
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WO/2019/025142A1 |
A device manufacturing method comprising: forming a layer on a substrate by a layer-forming process; determining a value of a metric at a plurality of positions across the substrate, wherein variation of the values across the substrate i...
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WO/2019/026021A1 |
An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surf...
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WO/2019/028324A1 |
Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming...
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WO/2019/026478A1 |
Provided are: a composition for treating a semiconductor, the composition being capable of suppressing damage by corrosion on tungsten-containing wires or the like of an object to be treated and efficiently removing contamination from th...
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WO/2019/019941A1 |
The invention discloses a polishing head (100) capable of preventing water accumulation. The polishing head (100) comprises a base body (30), a clamping sheet assembly (10), and a cap body (20), and further comprising a gland (50), which...
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WO/2019/023221A1 |
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such ...
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