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WO/2022/203781A1 |
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...
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WO/2022/198739A1 |
An arrayed grinding method based on active pressure modulation, the method comprising: preparing grinding tools; performing measurement to obtain error distribution of a mirror to be processed, and calculating a residence time of a singl...
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WO/2022/201660A1 |
This cutting device configured so as to form a half cut groove in a cutting object comprises a table, a spindle part to which a blade is attached, a detection part, and a control part. The table holds the cutting object. The blade moves ...
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WO/2022/196132A1 |
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor sub...
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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2022/196050A1 |
The digital projector according to an embodiment includes: a light source for irradiating a workpiece with light; a low-magnification camera mechanism for imaging a projected image of the workpiece produced by being irradiated by the lig...
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WO/2022/195907A1 |
[Problem] To provide an apparatus for machining a brittle plate and a method for machining a brittle plate, with which it is possible to reduce the effort and time required for manually aligning a machining wheel with a brittle plate aft...
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WO/2022/195931A1 |
The present invention automatically replaces a holding plate for holding a workpiece and is provided with: a processing mechanism 4 that performs processing on a sealed board W; a plate reception part 24 that receives a holding plate M1 ...
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WO/2022/187880A1 |
The invention relates to a device for machining panels, in particular a device for seaming glass panes, having a grinding head (4) which comprises a rotary drive and a grinding means (5) that can be rotatably driven thereby about a rotat...
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WO/2022/189169A1 |
The invention relates to a method and a device for grinding a stamping cover (906) of a sheet-processing machine (01), the sheet-processing machine (01) having at least one stamping unit (900) with at least one stamping cylinder (901) an...
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WO/2022/190771A1 |
The present invention pertains to managing a polishing device for polishing wafers, and in particular, pertains to a technique for measuring a physical quantity on the surface of a wafer being polished by the polishing device. The polish...
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WO/2022/187146A1 |
Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. Fo...
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WO/2022/187105A1 |
Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrat...
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WO/2022/186993A1 |
During polishing of a substrate a sequence of measured values is received from an in-situ motor torque monitoring system. Positions on the substrate of the region of lower coefficient of friction are calculated for at least two measured ...
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WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
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WO/2022/187249A1 |
A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to f...
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WO/2022/186992A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so ...
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WO/2022/187025A1 |
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first mod...
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WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
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WO/2022/187057A1 |
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camer...
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WO/2022/186988A1 |
Method of training a neural network for spectrographic monitoring includes polishing a test substrate, measuring by an in-situ spectrographic monitoring system a sequence of test spectra of light reflected from the substrate and measurin...
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WO/2022/181098A1 |
The present technology relates to an information processing device that makes it possible to more easily determine timing for maintenance, using event data. The information processing device comprises a state estimation unit that estimat...
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WO/2022/165739A1 |
A 2D/3D visual fusion-based robot intelligent polishing method and apparatus for hardware. The method comprises the following steps: S100, acquiring RGB images of a plurality of viewing angles of input hardware; S200, performing detectio...
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WO/2022/168944A1 |
A grinding device (1) comprises: a grinding material drive unit (6) that has a motor for causing a grinding material (5) to rotate; a table drive unit (8) that causes the grinding material (5) to come into contact with a workpiece (20) b...
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WO/2022/166777A1 |
A chemical mechanical planarization control method, comprising: planarizing a wafer (w) by using a carrier head (30) having a plurality of pressure chambers (C1, C2, C3, C4, C5), wherein the pressure chambers correspondingly divide the s...
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WO/2022/163348A1 |
An onboard measurement system (H) comprises an onboard measurement device (20) and an output device (30). The output device (30) acquires measurement data measured as a result of the onboard measurement device (20) causing a measurement ...
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WO/2022/158284A1 |
The present invention relates to a surface texture measurement device for a polishing pad that is used for polishing a substrate such as a semiconductor wafer, a surface texture measurement method for a polishing pad, and a surface textu...
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WO/2022/156058A1 |
A workpiece disk overturning device and a double-station overturning polishing machine. The workpiece disk overturning device comprises: an overturning frame (402), which is arranged on a lifting mechanism (3), can overturn under the dri...
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WO/2022/158060A1 |
A machining surface determination device (7) provided with: a classification result acquisition unit (70A) that, regarding multiple subimage regions (430) obtained by dividing a determination image region (420) contained in a determinati...
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WO/2022/157920A1 |
This workpiece diameter measurement method includes: a step for measuring coordinates of point P at which, on the outer circumference of a cylindrical workpiece supported such that the turning axis and the center axis of the main shaft o...
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WO/2022/132019A1 |
A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base ...
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WO/2022/129499A1 |
Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a stationary component (2). The monitoring system (12) comprises: an acoustic sensor (10) which is positioned in the movable component (3) ...
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WO/2022/129500A1 |
Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a fixed component (2). The monitoring system (12) components: two acoustic sensors (10) which are separate and independent from each other ...
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WO/2022/129233A2 |
The present invention relates to a scarfing machine, including a base a pair of platens adjustably positioned on the base. The pair of platens are configured as an upper platen and a lower platen such that the upper platen is fixed to th...
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WO/2022/130129A1 |
A sanding system is presented that includes a tool with a motor which, when actuated, drives movement of a drive shaft. The system also includes a backup pad coupled to the drive shaft. The backup pad is configured to receive an abrasive...
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WO/2022/132020A1 |
A floor grinder (100), comprising at least one motor (110, 120) arranged to rotatably drive one or more abrasive grinding tool holders (130), and a control unit (140) arranged to monitor an operating characteristic of the floor grinder, ...
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WO/2022/133273A1 |
Provided herein are advanced substrate polishing methods that use a machine learning artificial intelligence (Al) algorithm, or a software application generated using the Al, to control one or more aspects of the polishing process, The A...
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WO/2022/129502A2 |
Monitoring system (12) for a mobile component (3), for example a rotating component, supported by a stationary component (2). The monitoring system (12) comprises: an acoustic sensor (10) which is positioned in the mobile component (3); ...
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WO/2022/123915A1 |
A processing method of a spectacle lens (11, 40) which has an electronic element (22, 42) that overlaps with an optical element (21, 41), and obtains a dimming effect, by supplying electrical energy to the electronic element through a te...
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WO/2022/116553A1 |
A pressure measurement system and a pressure measurement method. The pressure measurement system comprises: a grinding arm (21) and a stress device (23), wherein the stress device (23) is unilaterally fixed, and the stress device (23) is...
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WO/2022/118871A1 |
The present invention enables setting of a machining origin that does not cause variation in finished dimensions depending on the skill level of workers, further reduces the difference in production efficiency depending on the workers, a...
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WO/2022/116529A1 |
Provided in the embodiments of the present application is a pressure measuring system, comprising: a grinding arm and a stress layer, wherein the stress layer is used for bearing pressure of the grinding arm; a substrate and a plurality ...
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WO/2022/113795A1 |
This substrate processing system for processing a bonded substrate obtained by bonding a first substrate and a second substrate is provided with: a processing device that grinds the first substrate; a first thickness measurement device t...
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WO/2022/105275A1 |
Disclosed are a fixing device and a detection system. The fixing device comprises a carrier tray (10) for carrying grinding heads (20, 30), wherein the carrier tray is provided with a positioning hole (101) and a first positioning ring (...
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WO/2022/107553A1 |
The present invention pertains to a substrate holding device which holds a substrate such as a wafer, and particularly, to a substrate holding device used for a polishing device. This substrate holding device (1) comprises: a polishing h...
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WO/2022/098469A1 |
The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of ene...
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WO/2022/093576A1 |
An example grinder/polisher system includes: a specimen holder configured to secure a specimen; a platen; an actuator configured to move at least one of the specimen holder and the platen; a sensor configured to detect objects within a f...
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WO/2022/091532A1 |
The present invention provides technology that enables accurate measuring of the polishing state of a substrate. A polishing device 100 comprises: a sensor head 40 having a light projector for projecting incident light, a light collect...
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WO/2022/090304A1 |
The invention relates to a method for controlling and/or monitoring a workpiece machining process. In the workpiece machining process, a tool having a working surface is brought into contact with a surface of a workpiece to be machined. ...
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WO/2022/083141A1 |
A processing device for raised burr defects of a flat wire in a conveying state, comprising: grinding mechanisms (28-31), arranged near a front surface to be ground, a rear surface to be ground, an upper surface to be ground, and a lower...
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