| Document |
Document Title |
|
WO/2020/246246A1 |
The compound includes a metal powder, an epoxy resin, and a wax. The content of metal powder is from 96 mass% to less than 100 mass%. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal s...
|
|
WO/2020/241623A1 |
The present invention addresses the problem of providing a towpreg in which slippage off a paper tube does not occur when a bobbin is raised, which exhibits little wrapping shrinkage when unraveled and has good bobbin shape stability, an...
|
|
WO/2020/237634A1 |
Provided is a resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least tw...
|
|
WO/2020/240343A1 |
The present invention provides a curable pressure-sensitive adhesive composition, including a reactive polyacrylate, a liquid epoxy resin, a solid epoxy resin, a hydroxyl-containing compound, and a photoinitiator of specific contents. Th...
|
|
WO/2020/239918A1 |
The invention relates to a composition comprising: – at least one silane group-containing polymer with a silicon content ranging from 0.6 to 2 wt.%, obtained by reacting at least one isocyanate group-containing polymer and at least one...
|
|
WO/2020/239355A1 |
An epoxide resin for the manufacture of a fibre-reinforced composite material having fire retardant properties and/or for use as an adhesive or hot-melt adhesive having fire retardant properties, the epoxide resin being halogen-free and ...
|
|
WO/2020/241180A1 |
The present invention provides a molding material which uses, as essential starting materials, (A) an aromatic epoxy resin, (B) a curing agent of epoxy resins, and (C) a curing accelerator, and which is characterized in that the ratio of...
|
|
WO/2020/241594A1 |
An encapsulating resin composition which comprises (A) an epoxy resin, (B) one or more hardeners, (C) a hardening accelerator, and (D) an inorganic filler, wherein the hardeners (B) include a hardener having a specific structure, the har...
|
|
WO/2020/235328A1 |
This resin composition contains an epoxy compound (A), a curing agent (B), and zirconium nitride (C), wherein the contained amount of the zirconium nitride (C) is 1-30 parts by mass with respect to the total 100 parts by mass of the epox...
|
|
WO/2020/235472A1 |
This thermoplastic resin composition for millimeter-wave radar members is characterized by containing, with respect to 100 parts by mass of a polybutylene terephthalate resin (A), 15-65 parts by mass of a rubber-reinforced polystyrene-ba...
|
|
WO/2020/233939A1 |
The invention relates to a special aqueous resin dispersion (wD) containing a resin component (H) which contains at least one difunctional and/or polyfunctional monomeric primary and/or secondary amine (M) and polyfunctional polymeric or...
|
|
WO/2020/235329A1 |
This resin composition contains an epoxy compound (A), a curing agent (B), black particles (C), and an inorganic filler (D), wherein the content of the black particles (C) is 1-25 parts by mass with respect to the total content 100 parts...
|
|
WO/2020/234066A1 |
The invention relates to a special aqueous resin dispersion (wD) containing a resin component (H) which contains at least one difunctional and/or polyfunctional monomeric primary and/or secondary amine (M) and polyfunctional polymeric or...
|
|
WO/2020/235246A1 |
This resin composition for magnetic member formation is a solid at 25°C and is used in compression molding, and contains a thermosetting resin, magnetic substance particles, and nonmagnetic substance particles which, when compared to th...
|
|
WO/2020/230034A1 |
The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohy...
|
|
WO/2020/229444A1 |
The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty epoxy co...
|
|
WO/2020/230330A1 |
A polyamide-imide resin composition that includes a polyamide-imide resin and a solvent that contains a compound that is represented by formula (1). (In the formula, R1 is a C1–8 alkyl group, R2 and R3 are each independently a hydrogen...
|
|
WO/2020/226077A1 |
The present invention addresses the problem of providing: a latent curing catalyst which has excellent storage stability and with which a curing reaction can be performed at a low temperature of lower than 100ºC; and a resin composition...
|
|
WO/2020/225249A1 |
The invention relates to a resin composition containing a mixture that comprises a cycloaliphatic epoxy resin, an adhesion promoter, and an epoxy-containing compound and/or a polycarbonate alcohol. The resin composition further contains ...
|
|
WO/2020/225885A1 |
The present disclosure provides a compound for a rare earth-bonded magnet, the compound comprising: a resin composition containing an epoxy resin (A), a phenolic resin curing agent (B), and a curing accelerator (C); and a rare earth-bond...
|
|
WO/2020/217894A1 |
The purpose of the present invention is to provide an epoxy resin composition which exhibits a high level of deforming capacity and fracture toughness and from which a resin cured product maintaining heat resistance can be obtained. Th...
|
|
WO/2020/215399A1 |
Disclosed are a resin composition for a metal substrate, a resin glue solution comprising same, and a metal-based copper foil-clad laminate. The resin composition comprises the following components based on 100% of the total weight of th...
|
|
WO/2020/217120A1 |
The present invention provides a modified phytic acid derivative resin, which comprises reaction products of the following components: 35-65 wt. % of phytic acid, 20-65 wt. % of an epoxy compound containing a double bond, and 0-35 wt. % ...
|
|
WO/2020/218114A1 |
A resin composition containing a polyester polyurethane resin (A), an epoxy resin (B), and a polyamide resin (C); a bonding film using said resin composition; a laminate having a resin composition layer; a laminate; and an electromagneti...
|
|
WO/2020/217676A1 |
Provided are a curable resin composition, the cured product of which is endowed with excellent heat resistance and dielectric properties, a cured product of the curable resin composition, and a prepreg, a circuit board, a build-up film s...
|
|
WO/2020/218457A1 |
[Problem] To provide: a curable-resin composition that has excellent room-temperature stability and is for producing a cured product that is highly heat-resistant, etc.; a cured product of the curable-resin composition; a production meth...
|
|
WO/2020/217918A1 |
The present invention provides: a curable composition characterized by containing an epoxy resin (A), an amine compound (B), and core-shell particles (C) wherein the amine compound (B) contains an N-(aminoalkyl)piperazine compound (B1) a...
|
|
WO/2020/218552A1 |
The objective of the invention is to provide a production method for a structure having excellent workability. The structure production method comprises: an adhesion step of coating a curable resin composition onto a first adherend and a...
|
|
WO/2020/213500A1 |
A resin composition for forming a magnetic member according to the present invention is one which is intended to be used in transfer molding, and comprises a heat-curable resin and iron-based particles, wherein the iron-based particles c...
|
|
WO/2020/213606A1 |
Provided is a stereolithographic resin composition that suppresses filler sedimentation during printing, has good handling properties, and yields a cured product of high thermal conductivity. The stereolithographic resin composition cont...
|
|
WO/2020/213642A1 |
The purpose of the present invention is to provide: an epoxy resin composition and a curable resin composition that provide a cured product in which a rubber-containing polymer is well dispersed in epoxy resin and which has an excellent ...
|
|
WO/2020/208136A1 |
The disclosure relates to a curable two-component resin-based system, comprising (a) a resin component, comprising (i) at least one epoxy resin, (ii) a block-copolymer comprising silicone and organic blocks, (iii) a silane, and (iv) a fi...
|
|
WO/2020/208175A1 |
Dental root canal filling composition comprising (a) one or more diepoxides; (b) one or more primary monoamines and/or disecondary diamines; (c) a particulate filler, wherein the one or more diepoxides are selected from compounds of the ...
|
|
WO/2020/204342A1 |
The present invention relates to an adhesive composition which realizes high adhesive strength and at the same time has properties of impact resistance and heat resistance and, more specifically, to a structural epoxy adhesive compositio...
|
|
WO/2020/206346A1 |
The present teachings provide for a two-part system and a method of using the two-part system, the two-part system comprising: a first component including one or more epoxy resins; a second component including one or more phosphate ester...
|
|
WO/2020/205212A1 |
Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable comp...
|
|
WO/2020/202690A1 |
Provided is a curable resin composition which improves the compatibility of a curable resin having a repeating unit derived from a maleimide-based monomer and a repeating unit derived from an unsaturated carboxylic acid monomer, and from...
|
|
WO/2020/204175A1 |
This invention pertains to a resin composition containing: a phosphate ester flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures; and a polyphenylene ether derivative (B) having an eth...
|
|
WO/2020/203924A1 |
The present invention provides a resin composition that makes it possible to improve the insulation of magnetic cured products. The present invention is a resin composition that includes (A) a magnetic powder, (B) an epoxy resin, and (C)...
|
|
WO/2020/199156A1 |
Disclosed is two component (2K) composition which comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardn...
|
|
WO/2020/203750A1 |
The present invention provides a curable resin composition which has excellent heat resistance and oxygen barrier properties, and which is capable of forming a cured body that is suitable for a resin member of an electronic device such a...
|
|
WO/2020/195236A1 |
The present invention provides a resin composition which is capable of considerably improving the withstand voltage properties, while ensuring high capacitance and excellent circuit adhesion if used as a dielectric layer of a capacitor. ...
|
|
WO/2020/196664A1 |
This resin composition contains insulating filler with a 6.0 or higher specific gravity, and a resin that has a polar group, wherein the content ratio of the insulating filler with a 6.0 or higher specific gravity is greater than or equa...
|
|
WO/2020/193209A1 |
The invention relates to a novel formulation, more particularly one that can be used to produce an insulation system by means of anhydride-free curing. The invention also relates to the production of an insulation system by means of the ...
|
|
WO/2020/196617A1 |
This resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular w...
|
|
WO/2020/194601A1 |
This epoxy resin contains the reaction product of an epoxy compound having a mesogenic structure, and of at least one item selected from the group consisting of aromatic hydroxycarboxylic acid formed by a carboxyl group and a hydroxyl gr...
|
|
WO/2020/195298A1 |
According to the present invention, when boron nitride is mixed with a resin material and a molded body is produced by using the resultant mixture, the thermal conductivity is further increased. In addition, when using a rare earth compo...
|
|
WO/2020/195843A1 |
A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; ...
|
|
WO/2020/194867A1 |
The present invention provides: a heat dissipation sheet precursor containing a resin binder and inorganic nitride particles, the inorganic nitride particle content being 50-80 mass% relative to the total mass of the heat dissipation she...
|
|
WO/2020/197561A1 |
An epoxy resin is modified by the addition of fire retardants ("FR") in its backbone to impart resistance to the fire and provide a reduction of flammability of the epoxy resin. The formulated epoxy resin is used in composite application...
|
