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JP7462408B2 |
Provided is an adhesive composition capable of limiting reduction in adhesiveness even after preservation in room temperature or refrigeration environment, the adhesive composition providing excellent adhesiveness under the same adhesion...
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JP7458419B2 |
An adhesive layer can include a polymer blend of a first polymer and a second polymer. In an embodiment, the first polymer can be a modified fluoropolymer. In another embodiment, the second can be a non-fluorinated polymer. In a particul...
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JP7450116B2 |
A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modul...
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JP2024033072A |
[Problem] An anisotropic conductive film that can suppress an increase in conduction resistance and maintain connection reliability for a long period of time without creating a gap between the anisotropic conductive film and a terminal w...
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JP2024035111A |
The present invention provides an adhesive composition that allows obtaining an adhesive tape with excellent performance. [Solution] An embodiment of the present invention provides an adhesive that includes an acrylic polymer that is a p...
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JP7446291B2 |
Described herein is a two-part condensation curable silyl-modified polymer based adhesive composition suitable for the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications. Also described herein...
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JP7444234B2 |
A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chai...
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JP7444989B2 |
Two-part condensation curable silyl-modified polymer (SMP) based sealant compositions, in particular two-part condensation curable SMP based translucent sealant compositions containing a catalyst comprising (i) a titanate and/or zirconat...
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JP7440518B2 |
Disclosed is a moisture curable adhesive composition comprising at least one silane-modified polymer, a filler comprising a surface modified fumed silica and one of a surface modified cristobalite and a silica; and optionally, at least o...
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JP2024025090A |
The present invention provides an adhesive film for circuit connection that can suppress localization of conductive particles and reduce connection resistance even when heat and external force are applied. [Solution] A circuit connection...
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JP2024025102A |
An object of the present invention is to provide an adhesive film that can suppress localization of inorganic particles even when an external force is applied. Another object of the present invention is to provide a resin and an adhesive...
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JP2024011810A |
The present invention provides a thermosetting resin composition that provides low dielectric properties, high heat resistance, and low moisture absorption. [Solution] (A) Compound represented by the following formula (1): (In formula (1...
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JP7421713B2 |
Provided are a bonding method and an adhesive that can provide portability in a short time, a low elastic modulus immediately after thermal curing, and the relaxation of thermal strain. The bonding method is a method for bonding a first ...
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JP7421132B2 |
A cationically polymerizable anisotropic conductive film using an alicyclic epoxy compound, which has more excellent storage life than ever before, while ensuring curing temperature and connection reliability that are the same as before....
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JP7421337B2 |
There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have ...
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JP7414160B2 |
A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin ...
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JP7404105B2 |
To provide a curable composition capable of giving a cured product which exhibits high thixotropy and suppresses the reduction of an elastic modulus under a high temperature.There is provided a multi-component curable composition which c...
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JP7403448B2 |
Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1)...
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JP7402234B2 |
The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ1, and a second p...
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JP2023179446A |
To provide a curable perfluoropolyether adhesive composition giving a rubbery or gelatinous cured product which adheres to a substrate.A curable perfluoropolyether adhesive composition includes: (A) 100 pts.mass of a linear perfluoropoly...
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JP7399264B2 |
A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/poly...
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JP2023173839A |
To provide an adhesive film having an adhesive layer formed from a composition that has superior coatability and curability.The present invention provides an adhesive film having an adhesive layer formed from a composition that contains:...
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JP7392907B2 |
To provide a curable resin composition which is excellent in toughness and weather resistance of a cured product while securing high flowability even at room temperature, and an adhesive composition containing the curable resin compositi...
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JP7384171B2 |
Provided is a film-like adhesive agent 1 for a semiconductor, the adhesive agent 1 having a first thermosetting adhesive agent layer 2 and a second thermosetting adhesive agent layer 3 laid on the first thermosetting adhesive agent layer...
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JP7380687B2 |
Disclosed is a method for selecting an adhesive composition containing a thermoplastic resin, a thermosetting resin, and a cationic polymerization initiator. This method for selecting an adhesive composition includes a step for determini...
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JP2023163203A |
To provide an adhesive composition for rolled paper that resists wrinkling upon drying and shows appropriate adhesion and peelability.An adhesive composition for rolled paper contains water and a water-soluble polymer. The water-soluble ...
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JP7375364B2 |
To provide an adhesive composition that shows excellent adhesiveness between a polyolefin resin base material and a metal base material, and electrolyte resistance, and exhibits excellent heat resistance; and also provide a laminate cont...
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JP7374218B2 |
A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating ...
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JP2023160377A |
To provide an adhesive composition which gives a cured product excellent in low dielectric characteristics and heat resistance and also excellent in adhesiveness to a resin and a metal.As a result of intensive studies, the inventors have...
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JP2023160378A |
To provide an adhesive composition which gives a cured product excellent in low dielectric characteristics and also excellent in adhesiveness to a resin and a metal.As a result of intensive studies, the inventors have found that the prob...
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JP2023157335A |
To provide a sealing resin composition less likely to create cavities in a sealing material when manufacturing the sealing material for sealing the gap between the base material and the semiconductor chip by using a sheet material manufa...
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JP7363631B2 |
To provide: an active energy ray-curable adhesive composition which has excellent adhesivity, is suitable for bonding various protective films for polarizing plates and a polarizer, and has excellent durability such as thermal shock resi...
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JP2023152394A |
To provide a zwitterionic polymer with new characteristics, and applications based on the characteristics.The polymer comprises a polymer unit represented by general formula (1) in the figure.SELECTED DRAWING: None
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JP2023146870A |
To provide a curable resin composition that excels in thermal conductivity and elongation after curing, and can be used as a low-viscosity, room-temperature-curable, two-component or multi-component adhesive.A curable resin composition i...
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JP2023143317A |
To provide a resin composition which can be formed into a sheet-like form, and can suppress warpage when base materials are bonded and an insulation layer is formed, especially, dissimilar base materials are bonded and an insulation laye...
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JP7351912B2 |
An adhesive composition having a low dielectric constant, low dielectric loss tangent, excellent folding endurance, and excellent heat resistance. The adhesive composition includes: with respect to the total of 100 parts by mass of the a...
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JP7342412B2 |
To provide a curable composition good in workability during processing and good in physical property of a cured article, and the cured article thereof.There is provided a curable composition containing an oxyalkylene polymer having a rea...
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JP7341780B2 |
To provide a curable composition in which reduction of stretching of a cured product that could be progressed by a curing and aging process is suppressed, and a cured product obtained by curing the composition.A multi-liquid type curable...
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JP7331101B2 |
A multi-component crosslinkable composition includes at least one component (K1) and one component (K2). Component (K1) contains organosilicon compounds (A1) selected from compounds (A1a) of formula (Ia), the formula (Ia) being Y1—[B1â...
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JP2023535923A |
The present invention relates to an adhesive composition comprising at least one silyl polymer containing at least one hydrolyzable alkoxysilane group, at least one polyvinyl ether compound and at least one curing catalyst. It also relat...
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JP7326626B2 |
A curable composition comprising: a perfluoro(poly)ether group–containing silane compound represented by general formula (I) (the radicals in the formula are defined in the description); (b) an organosilicon compound having at least tw...
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JP2023112261A |
To provide a thermosetting resin composition that can achieve both of low transmission loss and heat-dissipating performance under similar curing conditions to those of conventional high-frequency substrate materials, an adhesive sheet, ...
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JP7324770B2 |
A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is di...
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JP7310896B2 |
This curable fluoropolyether adhesive composition contains specific amounts of(A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule, and having a perfluoropolyether structure in the main chain thereof,(B...
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JP7306120B2 |
To provide a curable composition which is excellent in strength and elongation of a cured product and exhibits a small volume change rate before and after curing, and to provide a cured product of the curable composition.The curable comp...
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JP2023097163A |
To provide a method for manufacturing a bumper fascia which has short joint process time and long open time, on the condition that desired rigidity is achieved even when the weight is reduced, and good appearance can be achieved.A method...
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JP2023097068A |
To shorten joint process time and extend open time, in manufacture of a top cover of a battery case which has a metal member and a resin member and has high joint strength between both of the members.A method for manufacturing a top cove...
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JP2023096565A |
To provide a lightweight and compact lamp unit particularly by shortening the time of a bonding process and extending the open time.A method for producing a lamp unit includes a pre-bonding step for preparing a laminate in which a metal ...
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JP2023096624A |
To provide an on-vehicle ECU that can reduce the weight and the size, which shortens joint process time and extends open time.A method for manufacturing an on-vehicle ECU includes a pre-joint step of preparing a laminate where a metal me...
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JP2023097088A |
To provide a method for manufacturing a steering hanger for a vehicle which has a metal member and a resin member, and has short joint process time and long open time, on the condition that joint strength between both of the members is h...
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