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WO/2018/164639A1 |
A district cooling system comprising: a chilled water supply pipe for conveying cooling energy from a water chilling station to plurality of end users; a chilled water return pipe for conveying the heat load from end users to the chillin...
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WO/2018/157621A1 |
Provided is an automatic secondary degassing fixed-length mechanism for an ultrathin heat pipe. The automatic secondary degassing fixed-length mechanism comprises an automatic lifting device A installed on a length adjustment sliding tab...
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WO/2018/159912A1 |
The objective of the present invention is to provide a body contact-type warmer using a heat pipe, the warmer comprising: a heating part, which includes a body having a heat preserving material-filled space, and heat transfer protrusions...
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WO/2018/155641A1 |
A liquid flow path part of a vapor chamber according to the present invention has a first main flow groove, a second main flow groove, and a third main flow groove. A first convex part row including a plurality of first convex parts arra...
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WO/2018/153709A1 |
The invention relates to a heat exchanger system (30) for transmitting the heat of an exhaust gas of an internal combustion engine (10) to at least one working medium of the internal combustion engine (10). The heat exchanger system (30)...
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WO/2018/153111A1 |
Disclosed are a connected body vapour chamber heat sink and an electronic device. The connected body vapour chamber heat sink is used for providing heat dissipation for at least two heat-emitting elements on a single board. The connected...
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WO/2018/155003A1 |
Provided is a heat exchanging laminated sheet that can be made more compact, improve productivity, and reduce costs. The present invention relates to a heat exchanging laminated sheet P1 configured so that heat exchange is performed by c...
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WO/2018/150634A1 |
A heat pipe (150) includes a hollow insulating body (151) located inside an external conductor (120). The hollow insulating body (151) provides insulation between a portion, on the external conductor (120) side, of the heat pipe (150) an...
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WO/2018/151488A1 |
The present embodiment comprises: a case having a suction body having an air intake opening formed therein and a discharge body having an air discharge opening formed therein; an evaporator which is arranged inside the case, and which ha...
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WO/2018/147283A1 |
Provided is a vapor chamber in which, regardless of the type of container material, container distortion is reduced and formation of pin holes in the weld portion of the containers is prevented. The vapor chamber comprises: a container t...
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WO/2018/139568A1 |
Provided is a paper chamber that allows the number of components to be reduced and productivity to be improved, the paper chamber being capable of reducing a space at the outer periphery of a cavity section in which a working fluid is se...
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WO/2018/137266A1 |
A capillary phase-change cooler (10) for dissipating heat from a power device (20) comprises a cooler main body (100) and a capillary liquid-absorbent layer (200). The cooler main body (100) has a cooling cavity (110) and a heat dissipat...
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WO/2018/138936A1 |
Provided is a heat sink, wherein: a first radiating fin (12) having a low fluid resistance and formed in a pin shape is disposed in a region requiring high cooling performance; and a second radiating fin (13) having a high fluid resistan...
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WO/2018/139656A1 |
Provided is a vapor chamber that reduces flow resistance of a gas-phase working fluid and a liquid-phase working fluid, prevents scattering of the liquid-phase working fluid due to the gas-phase working fluid, and demonstrates excellent ...
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WO/2018/137503A1 |
A heat transfer method and heat transfer system based on a heat-pressure conversion effect. The method comprises: selecting a heat conducting working medium that meets a requirement of 1.0 kPa/°C according to a determined working temper...
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WO/2018/135278A1 |
Provided is an electrical component cooling structure that is useful for preventing condensation on electrical component cooling pipes constituting a portion of refrigerant piping. This electrical component cooling structure includes a h...
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WO/2018/136648A1 |
A carbon dioxide capture system, fluid contactor and method are disclosed. In embodiments, a gas-liquid contactor unit is disposed along a process fluid flow axis and includes a contactor network of flow diversion barriers with flow void...
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WO/2018/133308A1 |
An air-cooled plate-fin type composite phase-change radiator having a capillary groove comprises a heat exchange cabinet and a substrate. An internal cavity (3) for accommodating a working substance is arranged inside the substrate. The ...
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WO/2018/129633A1 |
A preparation method for a loop heat pipe evaporator, relating to a hot pressing and sintering method: loading a shell (1) of an evaporator (14) into a mold, and uniformly and compactly filling the material powders of an evaporator core ...
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WO/2018/132519A1 |
Control systems are provided that provide thermodynamically decoupled control of temperature and relative humidity and/or reduce or prevent frost formation or remove previously -formed frost. The control systems herein may be included as...
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WO/2018/131555A1 |
Provided is a valve control device 1 that suppresses shortening of the lifespan of a valve without incurring a reduction in cooling efficiency, the valve control device comprising a receiving unit 2, an opening degree control unit 3, and...
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WO/2018/130367A1 |
The invention relates to a cooling device (14) having a thermal interface (23) for a heat source that is to be cooled, for example a power electronics component (13). The invention provides that the cooling device has both at least one h...
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WO/2018/127548A1 |
The invention relates to a device for heat diffusion by the heat pipe effect, comprising a heat transfer fluid (1) and a housing (2), the housing (2) having a lower wall (21) forming a bottom, an upper wall (22) opposite the lower wall (...
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WO/2018/125974A1 |
Provided herein are various split heat sinks. In one approach, a heat sink apparatus includes a first heat sink coupled to a second heat sink, and a membrane coupled to a first side of the first heat sink and disposed between the first h...
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WO/2018/118383A1 |
An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink s...
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WO/2018/116951A1 |
This radiation module comprises: a container which has a working fluid sealed therein, and which has an evaporator for evaporating the sealed working fluid and a condenser for condensing the evaporated working fluid; and a wick which is ...
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WO/2018/106516A1 |
Thermal management devices and methods are making are described herein. In one example, the thermal management device includes a heat spreader having a first surface and a second surface, wherein the first surface of the heat spreader is...
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WO/2018/106554A2 |
A lost wax cast vapor chamber device is provided. Once a mesh is produced, a meltable core is formed from a meltable core material with the mesh positioned at least partially inside the core. Over the meltable core a metallic layer is fo...
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WO/2018/106501A1 |
A three-dimensional printed vapor chamber device is provided. A chamber from a first surface and a second surface at least partially enclosing a volume includes a spanning structure extending from the first surface to the second surface ...
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WO/2018/100120A1 |
The present invention relates to an electric machine with a cooling system, comprising a stator, a rotor rotatable relative to the stator an evaporator thermally coupled to a heat source of the electric machine, a two-phase coolant confi...
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WO/2018/101321A1 |
The purpose of the present invention is to provide a heat radiation member that exhibits excellent cooling capability and heat diffusing capability with respect to a heat generator that is mounted on a thin casing. This vapor chamber is ...
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WO/2018/097994A1 |
Thermal management devices and systems, and corresponding manufacturing methods are described herein. A phase change thermal management device is manufactured with a method that includes forming a volume of a first material. The volume o...
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WO/2018/097131A1 |
The purpose of the present invention is to improve thermal transport efficiency without increasing the surface area exclusive to a heat pipe. A heat pipe (1) is provided with a container (2) in which a working fluid is sealed, and a wick...
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WO/2018/089432A1 |
A thermal ground plane with hybrid structures that include nanowires is disclosed. The thermal ground plane includes a first casing having an exterior surface and an interior surface, the interior surface includes plurality of microstruc...
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WO/2018/079171A1 |
Provided is a thermoelectric generation system with which it is possible to inhibit variation in the amount of power generated by thermoelectric generators. This thermoelectric generation system comprises a plurality of thermoelectric ge...
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WO/2018/081119A1 |
A heat exchanger includes a porous material in a cold side flow passage. The porous material is configured to distribute a liquid phase throughout the cold side flow passage through capillary action.
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WO/2018/080851A1 |
Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal manag...
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WO/2018/073992A1 |
This loop heat pipe is equipped with an evaporator for evaporating working fluid from liquid phase to gas phase, and causes the gas-phase working fluid introduced from the evaporator to condense and return to the evaporator as the liquid...
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WO/2018/072951A1 |
Disclosed is a heat-dissipating arrangement having, wherein the heat-dissipating arrangement has at least one power module which has a printed circuit board (2) having components (3) to be cooled arranged thereon, and at least one heat s...
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WO/2018/070115A1 |
This evaporator configures part of a thermosiphon heat pipe (10) and evaporates a work fluid by allowing the work fluid to absorb heat from a battery (BP), and is provided with: a fluid evaporation unit (40) in which one or more evaporat...
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WO/2018/070182A1 |
This appliance temperature regulating apparatus capable of cooling an appliance (BP) of which temperature is to be regulated has an annular appliance fluid circuit (2) that is configured to include: an appliance heat exchanger (2a) that ...
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WO/2018/070116A1 |
This cooling device circulates a coolant and cools an object to be cooled (12) by changing the phase of the coolant between the liquid phase and the gas phase, and is provided with: an evaporation unit (14) which boils a liquid-phase coo...
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WO/2018/066206A1 |
This disclosure provides a machine temperature control device that uses a plurality of thermosiphon circuits with which the number of parts can be reduced and the efficiency of mounting on a vehicle and flexibility in mounting on the veh...
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WO/2018/066414A1 |
A copper alloy plate for a heat dissipation component, characterized in that: a phosphide including one or more of Fe, Ni, and Co is precipitated; the 0.2% proof stress is at least 100 MPa and the bend workability is excellent; the 0.2% ...
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WO/2018/061155A1 |
Provided is a heat pipe wherein heat can be efficiently transferred to a liquid working fluid. A heat pipe (1) is provided with: an inner cylinder (6); a cylindrical wick (2) formed of a porous ceramic, said wick covering the outer circu...
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WO/2018/064364A1 |
A refrigeration device includes a thermal transfer unit with an evaporative region, an adiabatic region, and a condensing region with a reversible valve attached to the adiabatic region. The device includes a container sealed around PCM,...
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WO/2018/061551A1 |
This equipment temperature adjusting apparatus comprises a working fluid circuit (10) and a fragmentation structure (20). The working fluid circuit constitutes a thermosiphon heat pipe. The working fluid circuit has an evaporator (12) th...
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WO/2018/061814A1 |
A power supply device comprises: a first power supply circuit; a first housing; a second power supply circuit; a second housing; a heat pipe; and a heatsink. The first housing contains the first power supply circuit, and the second housi...
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WO/2018/055926A1 |
A device temperature adjusting apparatus (1) is provided with: a heat absorption section (12) which absorbs heat from a device (BP) subject to temperature adjustment so as to vaporize a liquid phase working fluid; and a heat dissipation ...
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WO/2018/055944A1 |
An equipment temperature control device (1) comprises a heat absorber (12) that absorbs heat from equipment (BP) for temperature control and evaporates a liquid working fluid, and a condenser (14) that is disposed higher than the heat ab...
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