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WO/2024/021198A1 |
Embodiments of the present description provide a probe treatment method and a probe. The probe treatment method comprises: covering a photosensitive film, exposing a probe part to be treated, developing the exposed probe part, and electr...
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WO/2024/025237A1 |
Provided is a testing connector disposed between a testing apparatus and a device to be tested to use in testing the latter, the connector comprising: first and second metal housings; elastic shielding parts; conductive parts; and insula...
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WO/2024/024492A1 |
[Problem] In order to improve the electrical contact of a probe with an electrode terminal of a subject to be inspected, the present invention makes it possible to adjust the flatness of a board on which a plurality of probes are mounted...
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WO/2024/021200A1 |
A probe high-speed testing apparatus and a testing system. The probe high-speed testing apparatus comprises: successively disposed along a first direction, a second substrate (1), a probe head (2), a first substrate (3) and at least two ...
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WO/2024/022627A1 |
The invention relates to a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement comprises a carrier structure. The test arrangement comprises a device-under-test socket which is coupled to t...
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WO/2024/023612A1 |
Systems, circuit arrangements, and circuit operation that determine the state of charge of a battery used to provide power to an electrically powered device. The example circuit arrangement of this disclosure may include a selectable sen...
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WO/2024/018214A1 |
A casing for a split-core current measurement device comprising a first jaw configured to support a first arm of the measurement device including a first magnetic core portion, and a second jaw configured to support a second arm of the m...
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WO/2024/016713A1 |
Provided in the embodiments of the present application are a base, a voltage sampling assembly and a voltage measuring device, belonging to the technical field of battery production. The base comprises a body and a pair of clamping membe...
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WO/2024/016568A1 |
A probe and an integrated circuit test device. The probe comprises two first contact sections, a first connecting section, a second connecting section, and a second contact section, the two first contact sections being spaced apart. The ...
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WO/2024/019576A1 |
Disclosed are a battery cell gripper and a battery cell transfer apparatus comprising same. According to an aspect of the present embodiment, provided is a battery cell gripper which minimizes shaking due to lateral moment.
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WO/2024/019375A1 |
An inspection connector according to a disclosed embodiment is an inspection connector arranged between a device to be inspected and test equipment to electrically connect the device to be inspected to the test equipment in a vertical di...
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WO/2024/018047A1 |
The invention relates to a test probe device (1) for making electrical contact with an in particular multi-pole contact partner, having a carrier part (2) which has at least one guide opening (4), and having at least one test probe (5) w...
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WO/2024/016294A1 |
A system (1100) for testing multiple devices (250) includes a connector holder (208) having a plurality of holes (908), wherein each hole (908) included in the plurality of holes (908) is configured to hold a respective cable connector (...
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WO/2024/014667A1 |
The present invention relates to conductive particles, and to conductive particles which are used for a testing connector disposed between a test device and a testing device so as to electrically connect a terminal of the test device and...
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WO/2024/014668A1 |
The present invention relates to conductive particles and, more specifically, to conductive particles applied to a connector for inspection that is disposed between terminals of a device to be inspected and a pad of an inspection device ...
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WO/2024/014771A1 |
The present invention relates to an electrically conductive contact pin provided with an elastic portion, wherein the elastic portion includes: a plurality of straight portions; and a plurality of curved portions connecting the straight ...
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WO/2024/011801A1 |
A thyristor voltage monitoring board testing system and method. The system comprises: a signal generation device (10), which is configured to send to a monitoring board to be tested (20) a test signal for a function to be verified; an ac...
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WO/2024/011710A1 |
A special auxiliary tool for measuring the insulation resistance of a high-voltage device, comprising a lap joint rod (100), an electricity measurement rod (200) and a grip rod (300). The grip rod (300) is arranged at the bottom, the ele...
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WO/2024/014782A1 |
The present invention relates to an electroconductive contact pin, and the objective of the present invention is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized fi...
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WO/2024/014231A1 |
This probe device is equipped with: a housing which has a first surface and a second surface; a probe which has a first contact section exposed to the first surface and a second contact section exposed to the second surface, is supported...
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WO/2024/014890A1 |
A disc for inspecting a multilayer ceramic condenser according to an embodiment of the present invention may comprise: a metal plate including a unit plate and a plurality of blocks coupled to one surface of the unit plate and having an ...
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WO/2024/000417A1 |
A microfluidic chip, and a test system, a test method, and a preparation method thereof. A pressing device for a microfluidic chip comprises a cover plate, a base plate and a probe assembly. The base plate and the cover plate are arrange...
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WO/2024/000761A1 |
A manufacturing method for a hybrid probe card, and a probe card, which are applied to the technical field of semiconductor testing. The method comprises: optimizing the probe size of a probe card according to a signal of at least one si...
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WO/2024/004205A1 |
[Problem] To prevent a flexible wiring board from peeling off from a substrate. [Solution] This probe card comprises: a substrate 30 having a flat surface that faces an object 20 to be tested; a flexible wiring board 50 which is composed...
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WO/2024/006449A1 |
Probe structures including at least one flat tensional spring and movable frame structures or barrels and plungers and/or pairs of joined probe contact elements with independently compressible tips.
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WO/2024/006446A1 |
Embodiments are directed to probe structures and/or arrays wherein the probes include at least one spring segment and wherein ratcheting elements on probe arms and/or longitudinal elements allow permanent or semi-permanent transition fro...
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WO/2024/003871A1 |
Approaches and probes for excitation, detection, and sensing of samples. An example method includes positioning probes of a test tool relative to contact points that are associated with samples of a sample array such that the probes come...
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WO/2024/002566A1 |
The invention relates to an inverter (12) of a drive system or power-distribution system (10), the inverter comprising a web server (14) which is implemented as a functionality of the inverter (12), and a web client (30) which is also im...
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WO/2024/004988A1 |
Provided are an inspection jig and an inspection device with which inductance generated in a wiring path for carrying out an electrical inspection can easily be reduced. The inspection jig 3 comprises a first probe P1 for making contact ...
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WO/2023/248595A1 |
A method for manufacturing a probe unit according to an embodiment of the present invention is for manufacturing a probe unit that is to be installed on an electrical inspection device for inspecting electrical characteristics of an elec...
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WO/2023/247541A1 |
The invention relates to a current measuring resistor (1) for measuring an electric current (I), comprising two plate-shaped connection parts (2, 3), which are made of a conductor material, and a plate-shaped resistor element (4), which ...
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WO/2023/244066A1 |
A multi-wafer inspection system is provided. A multi-wafer inspection system according to an aspect of the present invention is capable of simultaneously inspecting multiple wafers supplied thereto, and may comprise: a first stage unit c...
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WO/2023/243250A1 |
This crosstalk measuring method includes a step of preparing a printed circuit board having: a first signal pattern and a second signal pattern which are provided spaced apart in a first direction and which extend along a second directio...
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WO/2023/240786A1 |
A stroke compensation system and method for a probe card (2), which can be applied to a wafer test system, and the probe card (2) in the wafer test system comprises a probe head. The stroke compensation system for the probe card (2) comp...
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WO/2023/238962A1 |
The present invention provides a probe unit and the like with which it is possible to more efficiently inspect multiple types of secondary batteries. A probe unit 1 for a charge/discharge inspection device includes: a first probe holding...
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WO/2023/238476A1 |
The present invention addresses the problem of providing an electrical-property-inspection conductor wire having high hardness and high conductivity. An electrical-property-inspection conductor wire for solving the aforementioned problem...
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WO/2023/236182A1 |
A temperature control system of an electronic component test device and a method thereof, the temperature control system mainly comprising a test socket (2), a temperature control fluid supply device (3), and a temperature control fluid ...
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WO/2023/238652A1 |
This information processing device configures polishing content of a probe that contacts a subject. The information processing device comprises: an area setting unit which sets a polishing area in a polishing member that polishes a probe...
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WO/2023/237546A1 |
A measurement system (20) for a testing apparatus of electronic devices is herein disclosed, the system having a flexible membrane (21) adapted to carry signals from/towards a device under test (DUT), a plurality of micro contact probes ...
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WO/2023/236282A1 |
The present application relates to a high-resolution variable-frequency damping oscillation signal generator, comprising an FPGA, a 14-bit D/A converter, and an MOSFET switch, wherein the FPGA receives externally transmitted damping osci...
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WO/2023/235623A1 |
Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the spac...
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WO/2023/231248A1 |
A modularized stack voltage monitoring and collection apparatus, and a fuel cell, comprising a slide rail (2) and several voltage monitoring and collection units (3) mounted on the slide rail (2); the several voltage monitoring and colle...
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WO/2023/232060A1 |
Provided is a wiring unit (20) having excellent electrical connection reliability between a terminal (30) and electrode leads (12, 12A). The wiring unit (20) is mounted on a battery stack (11L), and the battery stack (11L) is formed by l...
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WO/2023/228830A1 |
This inspecting device comprises a probe, and an insulated block provided with a first hole into which the probe is inserted, and a second hole which has a smaller diameter than that of the first hole, communicates with the first hole, a...
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WO/2023/228621A1 |
The present invention restricts movement of an object being held.　This device comprises a first member, a second member held by the first member, and a removable section disposed on the first member, wherein the second member holds an ...
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WO/2023/230148A2 |
An apparatus, system, or method for performing work on electrical power lines and/or splices on electrical power lines that may include an unmanned aerial vehicle (UAV), a power line measurement device, a support frame selectively releas...
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WO/2023/227575A1 |
A probe card (20) adapted to be mounted in a testing apparatus of electronic devices is described, said probe card (20) comprising at least one probe head (21) that houses a plurality of contact probes (22), each contact probe (22) havin...
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WO/2023/228487A1 |
This measurement unit 10 for measuring the electrical properties of an object to be measured upon being connected to a measurement cable comprises a printed substrate 1 provided with a cable connection unit 5 to which the measurement cab...
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WO/2023/230069A1 |
A system herein includes one or more processors to determine asymmetric compensation measurements from at least one receiver antenna pair and at least one transmitter antenna pair on a tool body in an underground formation. The asymmetri...
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WO/2023/229281A1 |
Provided is a test connector disposed between a test device and a test subject device and used to test the test subject device. The connector comprises a conductive portion, a frame, and a first elastic sheet. The conductive portion is p...
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