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WO/2024/122952A1 |
The present invention relates to a socket device for a semiconductor element test, used to test a semiconductor element, the device comprising: a contact module (100) having a semiconductor element seated thereon and comprising a plurali...
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WO/2024/123852A1 |
A multiple transport level tester system according to some embodiments includes an entry point, an exit point, a first transport level having a first level, and at least one additional transport levels, wherein the first level is differe...
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WO/2024/122784A1 |
The present invention provides a battery pack voltage measurement circuit comprising: a relay part for controlling battery pack voltage measurement; first and second branching parts which are provided between a battery pack voltage input...
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WO/2024/122229A1 |
This probe has a columnar shape including a structure in which a contact part, a bending part, and a linking part that links the contact part and the bending part are connected in an axial direction. A cross-section of the bending part a...
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WO/2024/123162A1 |
The present invention relates to a device test jig and a device test system, wherein the device test jig comprises: a fixture module that is attachable to and detachable from the body of the device test jig and includes a mask having a p...
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WO/2024/122086A1 |
According to the present invention, probes are inserted into guide holes in guide plates included in a probe head and are held by the probe head. The probes each comprise: a columnar base material; and a protective material which covers ...
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WO/2024/119607A1 |
A low-temperature nano manipulator, comprising a nano manipulator body (10), which comprises a manipulator control module and a probe module, wherein the manipulator control module is connected to the probe module, so as to realize motio...
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WO/2024/123117A1 |
Disclosed is a test probe. The test probe includes: a barrel including a tubular barrel main body, and a plurality of skirt portions formed in a first end portion of the barrel main body and spaced apart from each other by lengthwise sli...
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WO/2024/114699A1 |
A test fixture (100), comprising: an anode cover plate (1) and a cathode cover plate (2), wherein the anode cover plate (1) is detachably connected to the cathode cover plate (2), an anode flow channel (11) is provided on the end face of...
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WO/2024/117281A1 |
The present invention relates to a double pogo pin and a test socket using same. More specifically, the test socket using a double pogo pin comprises: a socket cover having a plurality of first insertion holes formed in the perimeter the...
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WO/2024/117545A1 |
Disclosed are: a multi-stage contact tip manufacturing method capable of improving design freedom for a contact tip, which is formed on a probe sheet of a probe card for inspecting a semiconductor device and contacts a pad of the semicon...
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WO/2024/115117A1 |
The present invention relates to an electrical connector (100) for engagement with a complementary connector (200). The electrical connector comprises a first terminal (102); an enclosure (104) surrounding the first terminal; a probe acc...
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WO/2024/113772A1 |
A rapid test device for retired batteries, comprising a workbench (1). A first mounting cylinder (9) is fixedly connected to the middle of the top end of the workbench (1). A first servo motor (3), a first lead screw (8) and a connection...
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WO/2024/111615A1 |
Provided is an inspection tool that does not readily break. An inspection tool 1 comprises: a substrate that can be electrically connected to a connector 100 being inspected; a movable member that can be moved; a stretchable member tha...
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WO/2024/109396A1 |
The present application relates to the technical field of batteries, and provides an adapter piece inspection method and apparatus, and a battery cell production method and device. The adapter piece inspection method comprises: acquiring...
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WO/2024/110046A1 |
The invention relates to a spring contact pin (1) for electrically conductively contacting a contact partner, having a sleeve-shaped housing (2) and a contact element (3) which is supported in a longitudinally displaceable manner in the ...
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WO/2024/110139A1 |
The invention relates to a measuring device (1) comprising a shunt (2) and a flexible printed circuit board (6). The flexible printed circuit board (6) is arranged on the shunt (2) on one side thereof. A temperature measuring element (7)...
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WO/2024/112370A1 |
A system includes a battery assembly. The system includes a circuit board comprising circuitry. The circuitry includes a first trace. The system includes an integrated circuit mounted on the circuit board. The integrated circuit includes...
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WO/2024/111711A1 |
The present invention relates to a microprobe, which has a layered structure, can be manufactured through an MEMS process, can implement a fine pitch, and eliminates the necessity for a separate process for assembling the microprobe.
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WO/2024/112050A1 |
The present invention provides an electro-conductive pin and a test device including same, which have improved test reliability with respect to a test object, the electro-conductive pin having an overall length dimension (L) in the longi...
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WO/2024/106101A1 |
This circuit board socket is characterized by comprising: a plurality of contacts; a contact fixing board for fixing and holding each of the plurality of contacts; an elastic contact pressing board that is connected to the contact fixing...
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WO/2024/108020A1 |
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a h...
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WO/2024/106128A1 |
The present invention provides a novel method for producing an electroformed spring and the electroformed spring. This method for producing an electroformed spring comprises a step in which an electroformed layer is formed on a core ha...
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WO/2024/106129A1 |
The present invention provides a novel method for producing an electroformed spring. A method for producing an electroformed spring according to the present invention comprises a step for forming an inorganic-material layer on an elect...
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WO/2024/103662A1 |
The present invention relates to an electronic device aging test apparatus, comprising a box body, a test chamber provided in the box body and provided with an air inlet and an air return port, a circulating air duct provided on the peri...
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WO/2024/106905A1 |
A prober card lifting/lowering device is disclosed. The prober card lifting/lowering device according to one aspect of the present invention may comprise: a fixed frame provided and fixed inside a stage chamber; a lifting/lowering means ...
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WO/2024/103455A1 |
Disclosed in the present invention is a thorn spring contact terminal, which comprises a thorn spring member and a contact body, the thorn spring member comprising a thorn spring body, a plurality of contact thorns arranged at the upper ...
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WO/2024/101224A1 |
This probe comprises: a columnar base material which has a first end portion and a second end portion, and which has a polygonal shaped cross section perpendicular to an axial direction thereof; and a contacting film covering remaining s...
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WO/2024/101475A1 |
Disclosed are a pogo pin that enables a pre-designed impedance value to be more easily matched, and a manufacturing method therefor. The pogo pin comprises: a plunger part; a barrel into which at least a portion of the plunger part is in...
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WO/2024/098371A1 |
A blade probe clamp for testing a mainboard. The blade probe clamp comprises a probe module body (1). The probe module body (1) comprises a first mold core (2), a second mold core (3), and a third mold core (4), wherein a groove (5) is p...
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WO/2024/098114A1 |
Disclosed herein is a kit or a device for one or more sensor components for sensing one or more electronic properties of fluid sample comprising: a securing portion adapted to secure a sensor component in position, the sensor component c...
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WO/2024/097130A1 |
An example apparatus includes: a differential amplifier (220) including: an inverting input (-) coupled to a first input (208) via a first resistor (216); a non-inverting input (+) coupled to a second input (204) via a second resistor (2...
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WO/2024/087978A1 |
The present application relates to a battery tray, a battery testing module, a battery testing system and a battery production system. During a testing process, a battery is placed on a tray body, and the battery is electrically connecte...
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WO/2024/087507A1 |
Disclosed in the present application is a battery charging and discharging test device, comprising a temperature-control box, a frame, at least one partition plate and a plurality of charging and discharging modules, wherein a plurality ...
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WO/2024/089148A1 |
The invention relates to a power-electronic circuit arrangement (10), having a flat circuit carrier (12), which has an electrically insulating substrate (14) and, on a flat side (15) of the substrate (14), a conductor track arrangement (...
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WO/2024/090788A1 |
The present invention relates to: a method for producing an electrically insulating composite material for a silicon rubber socket, the method comprising a step for producing a molded body from a mixture including a liquid silicone and a...
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WO/2024/090714A1 |
The present invention relates to a pogo pin probe and a pogo pin including same. More specifically, the present invention relates to: a pogo pin probe that can be securely fixed to a barrel of a pogo pin without rattling or rotating; and...
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WO/2024/090359A1 |
The contact pin (10) according to the present invention comprises: a tip portion (11) which has a first contact region (111) pointing in a first direction (D1), a base region (113) which is opposite the first contact region (111), and a ...
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WO/2024/085538A1 |
The present invention provides a method for producing probe cards, the method facilitating assembly of plates and a plurality of probes, and allowing efficient replacement of damaged probes with functional probes.
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WO/2024/085486A1 |
The present invention relates to a circuit board test terminal. Provided is a circuit board test terminal which comprises a board part and an extension part extending from the board part and connected to a test point of the circuit board...
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WO/2024/086546A1 |
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward ...
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WO/2024/085933A1 |
Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, and including planar springs (when unbiased), an engagement structure being provided to engage different compliant mo...
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WO/2024/085537A1 |
According to the present invention, the flexibility of a probe pin is adjusted by providing a vertical slit and/or a horizontal slit, thereby facilitating elastic deformation. In addition, according to the present invention, the sectiona...
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WO/2024/086505A1 |
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward ...
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WO/2024/085536A1 |
The present invention relates to a probe card for inspecting defects of an inspection target, a probe pin for a probe card configured to contact the inspection target, a guide plate for a probe card configured to guide a probe pin insert...
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WO/2024/086506A1 |
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward ...
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WO/2024/086507A1 |
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward ...
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WO/2024/085934A1 |
Probes for contacting electronic components include single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitud...
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WO/2024/081123A1 |
Nickel-ruthenium-based ternary or greater alloys, products, and methods of making and using the same include nickel at about 48 to about 71 weight % ("wt%") of the alloy, ruthenium at about 17 to about 45 wt% of the alloy, and at least o...
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WO/2024/080685A1 |
The present invention provides a micro metal molded article in which the magnetic areas and conductive areas are separated such that when the magnetic parts of adjacent micro metal molded articles are oriented by magnetic lines of force,...
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