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WO/2024/090788A1 |
The present invention relates to: a method for producing an electrically insulating composite material for a silicon rubber socket, the method comprising a step for producing a molded body from a mixture including a liquid silicone and a...
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WO/2024/085538A1 |
The present invention provides a method for producing probe cards, the method facilitating assembly of plates and a plurality of probes, and allowing efficient replacement of damaged probes with functional probes.
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WO/2024/085537A1 |
According to the present invention, the flexibility of a probe pin is adjusted by providing a vertical slit and/or a horizontal slit, thereby facilitating elastic deformation. In addition, according to the present invention, the sectiona...
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WO/2024/085536A1 |
The present invention relates to a probe card for inspecting defects of an inspection target, a probe pin for a probe card configured to contact the inspection target, a guide plate for a probe card configured to guide a probe pin insert...
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WO/2024/080685A1 |
The present invention provides a micro metal molded article in which the magnetic areas and conductive areas are separated such that when the magnetic parts of adjacent micro metal molded articles are oriented by magnetic lines of force,...
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WO/2024/029790A1 |
The present invention provides an electrically conductive contact pin and a method for manufacturing same, the electrically conductive contact pin comprising: a body portion composed of a plurality of metal layers stacked in a thickness ...
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WO/2024/014667A1 |
The present invention relates to conductive particles, and to conductive particles which are used for a testing connector disposed between a test device and a testing device so as to electrically connect a terminal of the test device and...
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WO/2024/014668A1 |
The present invention relates to conductive particles and, more specifically, to conductive particles applied to a connector for inspection that is disposed between terminals of a device to be inspected and a pad of an inspection device ...
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WO/2024/014782A1 |
The present invention relates to an electroconductive contact pin, and the objective of the present invention is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized fi...
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WO/2024/014890A1 |
A disc for inspecting a multilayer ceramic condenser according to an embodiment of the present invention may comprise: a metal plate including a unit plate and a plurality of blocks coupled to one surface of the unit plate and having an ...
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WO/2024/000761A1 |
A manufacturing method for a hybrid probe card, and a probe card, which are applied to the technical field of semiconductor testing. The method comprises: optimizing the probe size of a probe card according to a signal of at least one si...
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WO/2023/247540A1 |
The invention relates to a current measuring resistor (1) for measuring an electric current (I), comprising two plate-shaped connection parts (2, 3), which are made of an electrically conductive conductor material, for introducing or dis...
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WO/2023/247541A1 |
The invention relates to a current measuring resistor (1) for measuring an electric current (I), comprising two plate-shaped connection parts (2, 3), which are made of a conductor material, and a plate-shaped resistor element (4), which ...
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WO/2023/222110A1 |
A processing system is provided which includes a substrate (80); an array of thin pins (81-85) positioned on the substrate; a holding member (12) configured to hold the substrate; an electrolyte tank (21) configured to receive an electro...
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WO/2023/214784A1 |
Disclosed is a probe-head enabling a plurality of devices being inspected to be measured simultaneously. The probe-head, according to the present invention, comprises: an elastic body formed by laminating a plurality of elastic layers; a...
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WO/2023/211659A1 |
A method of forming a probe (3500), comprises providing a first (3500-U) and a second probe module (3500-L), having respective compliant elements (3521-U, 3521-L) functionally joining respective probe arms that directly or indirectly hol...
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WO/2023/200094A1 |
A probe pin according to an embodiment of the present invention comprises: an upper plunger including a first tip configured to be in contact with a circuit to be inspected to transmit and receive an electrical signal to and from the cir...
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WO/2023/186555A1 |
The invention relates to a device for repairing a test contact assembly, comprising a test contact carrier (14) and a plurality of test contacts (16), which are arranged spaced apart from one another on at least one contact surface (18) ...
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WO/2023/172046A1 |
The present invention provides a metal molded article, a manufacturing method therefor, and an inspection device having same, enabling having high reliability and degree of freedom in shape, improving inspection reliability for an inspec...
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WO/2023/169781A1 |
The invention relates to a battery terminal clamp comprising a receiving body (72) for a battery terminal and a stop (76) extending from the receiving body (72) and adapted to restrict rotational movement of an assembly (54) connected to...
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WO/2023/163271A1 |
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a low-friction probe head comprising: a probe; a block provided with a receiving hole in which the probe is received; a...
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WO/2023/140648A1 |
A pogo pin according to the present invention is a pogo pin which establishes an electrical connection by means of a first probe and a second probe and is variable in length with compressive elasticity. In the first probe (10), a cylinde...
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WO/2023/136439A1 |
The present invention relates to a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit...
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WO/2023/113214A1 |
The present invention provides a method for manufacturing a conductive member for a rubber socket, comprising the steps of: preparing a first substrate having a first groove; filling the first groove with a ferromagnetic material and a d...
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WO/2023/101224A1 |
The present invention provides a rubber socket for testing a semiconductor element and a manufacturing method thereof, the rubber socket comprising: a body having a plurality of through-holes formed to extend therethrough in the height d...
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WO/2023/080422A1 |
An electroluminescence inspection apparatus is disclosed. The disclosed electroluminescence inspection apparatus comprises: a first substrate; and a plurality of electrode members which are arranged on one surface of the first substrate ...
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WO/2023/050501A1 |
The present disclosure relates to a power supply mode determination method and apparatus, and a transmission control system and an electronic device. The method comprises: acquiring a sampling voltage signal of a power supply grid; deter...
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WO/2023/033442A1 |
The present invention provides a method for manufacturing a molded metal product, the method enabling manufacture of a plurality of molded metal products all at once in different layer levels of a single mold.
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WO/2023/277452A1 |
The present invention provides an electrically conductive contact pin which is formed by stacking a plurality of metal layers together and a method for manufacturing the electrically conductive contact pin, wherein metal layers made of t...
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WO/2023/277524A1 |
A probe member for inspection, according to one embodiment of the present invention, comprises: a contact part having one side formed to be sharp and of a first metal, so as to be in contact with an object to be inspected; and a body par...
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WO/2022/260371A1 |
The present invention provides an electrically conductive contact pin formed by laminating a plurality of metal layers, wherein the electrically conductive contact pin has improved physical or electrical properties.
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WO/2022/250384A1 |
A conductive connecting member, for electrically connecting a test subject and a test device by having one end coming into contact with the test subject and the other end coming into contact with the test device, according to one embodim...
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WO/2022/235005A1 |
The present invention relates to a probe array gripper and probe array bonding equipment comprising same. The probe array gripper of the present invention grasps a probe array on which a plurality of probe pins are fixedly arranged, and ...
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WO/2022/231259A1 |
A probe pin, mounted on a probe card, comprises: a body part; and a top part and a tip part each formed at both ends of the body part, wherein the body part comprises: a first side surface and a third side surface that are opposite to ea...
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WO/2022/220484A1 |
The present invention relates to a molded article for a semiconductor device test socket comprising a polyimide resin and a method for manufacturing same, characterized in that excellent mechanical properties, surface resistance stabilit...
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WO/2022/215906A1 |
The present invention provides an electrically conductive contact pin, an inspection device comprising same, and a method for manufacturing an electrically conductive contact pin, wherein the electrically conductive contact pin is formed...
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WO/2022/216090A1 |
The present invention provides an electrically conductive contact pin formed by stacking a plurality of metal layers, and a manufacturing method therefor, the electrically conductive contact pin being pressed by pressing force concentrat...
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WO/2022/217175A1 |
In an aspect, an apparatus includes a package (100). The package includes a substrate (104), a plurality of components (102) located on a top surface of the substrate, a plurality of ball pads (302) located on a bottom surface of the sub...
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WO/2022/211344A1 |
The present invention relates to an electrically conductive contact pin and a method for manufacturing same, which improve the physical or electrical properties of an electrically conductive contact pin formed by laminating a plurality o...
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WO/2022/211343A1 |
The present invention relates to an electrically conductive contact pin formed by laminating a plurality of metal layers, and provides an electrically conductive contact pin having improved physical or electrical properties, and a manufa...
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WO/2022/211450A1 |
A contactor for connection and signal transmission between conductors comprises: a core unit formed to extend in the longitudinal direction, contain conductive particles, and be elastically modifiable; an insulation unit formed to encomp...
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WO/2022/186679A1 |
The present invention relates to a method for manufacturing a contactor which electrically connects a pad of a subject and a pad of an inspection device with each other, the method comprising the steps of: preparing a mold equipped with ...
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WO/2022/186680A1 |
A flexible contactor, according to the present invention, electrically connects a pad of a test subject and a pad of a test device to one another, and is characterized by comprising: first elastic parts comprising first conductive partic...
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WO/2022/181951A1 |
The present invention provides an alignment module and an alignment transfer method for electrically conductive contact pins, whereby the electrically conductive contact pins can be inserted into guide holes of a guide plate all at once ...
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WO/2022/182177A1 |
The present invention provides an electrically-conductive contact pin assembly and a manufacturing method therefor, in which an electrically-conductive contact pin and a housing are manufactured at once by using a MEMS process, such that...
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WO/2022/177390A1 |
A method for manufacturing an electro-conductive contact pin according to the present invention comprises the steps of: filling a first metal in a first opening pattern formed on a mold having the first opening pattern formed thereon to ...
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WO/2022/175458A1 |
Disclosed herein is a method for producing a probe card, the method comprising the steps: Providing a carrier board, wherein the surface of the carrier board has at least one probe guiding portion; and Generating a probe on the probe gui...
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WO/2022/177118A1 |
The present invention provides a method for aligning and transporting molded articles or electrically conductive contact pins, which allows molded articles or electrically conductive contact pins to be collectively aligned without the ne...
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WO/2022/164173A1 |
The present invention has been made to solve a problem of electrode pads, a pitch interval between which has recently become narrower so that, due to the densely formed electro-conductive pins, when an electro-conductive contact pin come...
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WO/2022/149783A1 |
Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sid...
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