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WO/2021/220697A1 |
The present invention enables rapid and accurate computation of an electric charge amount in a substrate. This charged particle beam drawing method comprises: a step (S100) for virtually dividing, into mesh-like regions, a drawing region...
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WO/2021/221979A1 |
Generators and methods for igniting a plasma in a plasma chamber are disclosed. The generator includes an ignition profile generator that includes a data interface configured to receive a voltage value and a time value for each of N data...
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WO/2021/221862A1 |
Systems and methods are provided herein for etch features on a substrate, while maintaining a near-unity critical dimension (CD) shrink ratio. The features etched may include, but are not limited to contacts, vias, etc. More specifically...
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WO/2021/222085A1 |
Systems and methods are described herein for electron-beam lithography. In some aspects, a photo electron emitter and channel array assembly (PEECAA) may include a photo-electron emitting cathode having a uniform planar surface and an ar...
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WO/2021/220458A1 |
This radiation analysis system comprises a transition edge sensor that detects radiation, a current detection mechanism that detects a current flowing in the transition edge sensor, and a computer sub-system that processes a current dete...
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WO/2021/221850A1 |
A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material;...
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WO/2021/216275A1 |
A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move rela...
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WO/2021/216092A1 |
Certain aspects of the present disclosure provide techniques, systems, and methods for process control and monitoring in dynamic plasma lifting condition, by plasma spectrum. In some cases, multiple runs of changing plasma intensity data...
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WO/2021/213560A1 |
The object of the invention is a sample display method by means of a scanning electron microscope comprising at most one active objective lens (7) located above a first scanning element (8) and a second scanning element (9). The subject ...
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WO/2021/216449A1 |
Exemplary semiconductor processing chambers may include a gasbox. The chambers may include a substrate support. The chambers may include a blocker plate positioned between the gasbox and the substrate support. The blocker plate may defin...
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WO/2021/216445A1 |
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel ...
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WO/2021/213870A1 |
The present disclosure relates to an inspection tool having a charged particle source to provide a charged particle beam, a sample holder to hold a sample, and a scanning system configured to scan the charged particle beam over an area o...
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WO/2021/216180A1 |
A scanning system includes a scanning chamber; a first rotary drive disposed in the scanning chamber and configured to rotate around a first axis; a second rotary drive disposed in the scanning chamber and configured to rotate around the...
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WO/2021/216289A1 |
Methods and apparatus for cleaning a showerhead are provided. For example, the methods includes moving a substrate support including a heater disposed therein from a substrate processing position a first distance away from the showerhead...
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WO/2021/214185A1 |
The present invention is directed towards an apparatus and method to detect electromagnetic radiation or signals emitted by plasma comprising a sensor unit, the sensing unit comprising a first sensor for detecting electromagnetic radiati...
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WO/2021/216557A1 |
Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material...
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WO/2021/215335A1 |
A method for manufacturing an electron source according to the present disclosure includes (A) a step of preparing a first member provided with a columnar portion configured using a first material having an electron emission characterist...
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WO/2021/215330A1 |
An electron source according to the present disclosure comprises: a columnar part that is made of a first material having electron emission characteristics; and a cylindrical part that is disposed to surround the columnar part and is mad...
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WO/2021/211479A1 |
An electron beam system and method are provided. The system includes a detector having a detector face configured to detect back-scattered electrons reflected off of a sample. The system further includes an annular cap disposed on the de...
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WO/2021/210382A1 |
The present invention addresses the problem of providing an electron gun with which the lifespan of a photocathode can be extended.　The problem can be solved by this electron gun that includes: a substrate on a first surface of which a...
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WO/2021/211536A1 |
An isolation valve assembly including a valve body having an inlet and an outlet. The isolation valve includes a seal plate disposed within an interior cavity of the valve body. The seal plate is movable between a first position allowing...
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WO/2021/210087A1 |
Provided is a technique by which sample observation throughput can be reduced. A conveyance device 2 is equipped with: a holder 24 for holding a mesh MS on which a sample to be analyzed using a charged particle ray device 3 is mounted; a...
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WO/2021/209390A1 |
An impedance matching circuit (11), a plasma supply system (1) comprising such an impedance matching circuit, and a method for operating such an impedance matching circuit, in particular in such a plasma supply system comprising a series...
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WO/2021/209865A1 |
The present disclosure provides techniques for suppression of hydrogen degradation. In some embodiments, a method for decreasing the amount or rate of hydrogen degradation of a material, includes: (a) exposing a material to gaseous hydro...
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WO/2021/211582A1 |
Input impedance networks and associated methods are disclosed. An input impedance network comprises a source-terminal-pair configured to couple to a power source, a recovered-power-terminal-pair configured to couple to a power sink, a tr...
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WO/2021/211278A1 |
Methods and apparatus for cleaning a process kit configured for processing a substrate are provided. For example, a process chamber for processing a substrate can include a chamber wall; a sputtering target disposed in an upper section o...
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WO/2021/211483A1 |
An electron beam system for wafer inspection and review of 3D devices provides a depth of focus up to 20 microns. To inspect and review wafer surfaces or sub-micron-below surface defects with low landing energies in hundreds to thousands...
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WO/2021/211612A1 |
Embodiments of a process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a multi-cathode processing chamber includes: a first rotatable shield coupled to a first shaft, wherein the fir...
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WO/2021/211269A1 |
An apparatus for a transformer isolator used for transferring power to an element of a substrate support used in a plasma chamber is provided. A primary of the transformer isolator includes a primary base plate configured to electrically...
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WO/2021/204740A1 |
Systems and methods of imaging a sample using a charged- particle beam apparatus are disclosed. The charged-particle beam apparatus may include a compound objective lens (307) comprising a magnetic lens (307M) and an electrostatic lens (...
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WO/2021/206287A1 |
A plasma etching method is disclosed. The plasma etching method comprises: a first step of vaporizing liquid perfluoroisopropyl vinylether (PIPVE); a second step of supplying, to a plasma chamber in which an object to be etched is arrang...
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WO/2021/205729A1 |
A multi-electron beam inspection device (100) according to one aspect of the present invention is characterizing by comprising: a multi-detector (222) having a plurality of detection sensors for detecting, among multi-secondary electron ...
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WO/2021/206919A1 |
Exemplary semiconductor processing chambers may include a gasbox. The chambers may include a substrate support. The chambers may include a blocker plate positioned between the gasbox and the substrate support. The blocker plate may defin...
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WO/2021/204012A1 |
Disclosed are a magnetic structure in a semiconductor device, and the semiconductor device. The magnetic structure is arranged outside a reaction chamber of the semiconductor device in a surrounding manner, and comprises: an annular supp...
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WO/2021/207608A1 |
Gas distribution assemblies and process chamber comprising gas distribution assemblies are described. The gas distribution assembly includes a gas distribution plate, a lid and a primary O-ring. The primary O-ring is positioned between a...
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WO/2021/206767A1 |
Methods and apparatus for processing a substrate positioned on a substrate support assembly are provided. For example, a substrate support assembly includes an electrostatic chuck having one or more chucking electrodes embedded therein f...
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WO/2021/204733A1 |
The disclosure relates to apparatus and methods for manipulating charged particle beams. In one arrangement, an aperture assembly is provided that comprises a first aperture body and a second aperture body. Apertures in the first apertur...
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WO/2021/207002A1 |
Multiple, sequential pulses of radiofrequency power are supplied to an electrode of a plasma processing chamber to control a plasma within the plasma processing chamber. Each of the pulses of radiofrequency power includes a first duratio...
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WO/2021/207418A1 |
Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/o...
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WO/2021/205728A1 |
A multielectron beam inspection device (100) of an embodiment of the present invention is characterized by being provided with: a secondary-electron image acquisition mechanism (150) for irradiating a sample (101) having a pattern formed...
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WO/2021/205526A1 |
This charged particle gun has a bolt to which a charged particle source is attached, a nut that is screwed together with the bolt and thereby holds the charged particle source, and a nut seat surface in contact with the nut. The nut incl...
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WO/2021/207115A1 |
Apparatuses for collection of upstream and downstream transmission electron microscopy (TEM) cathodoluminescence (CL) emitted from a sample exposed to an electron beam are described. A first fiber optic cable carries first CL light emitt...
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WO/2021/204739A1 |
An improved apparatus and method for facilitating inspection of a wafer are disclosed. An improved method for facilitating inspection of a wafer comprises identifying a plurality of repeating patterns from reference image data associated...
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WO/2021/204734A1 |
A charged-particle tool comprising: a condenser lens array configured to separate a beam of charged particles into a first plurality of sub-beams along a respective beam path and to focus each of the sub-beams to a respective intermediat...
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WO/2021/206998A1 |
Exemplary semiconductor processing chambers may include a substrate support positioned within a processing region of the semiconductor processing chamber. The chamber may include a lid plate. The chamber may include a gasbox positioned b...
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WO/2021/202129A1 |
A magnetic field sensor for measuring magnetic field of a current applied to a lower electrode defined within a plasma chamber includes a conductor element disposed along a length of a tubular housing. A plurality of slots is defined on ...
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WO/2021/202492A1 |
A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixtur...
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WO/2021/196397A1 |
A working platform of an ion implanter, comprising an EFEM (1), two Loadlocks (21/22), a VTM (3) and a PTM (4); the EFEM (1), the Loadlocks (21/22) and the VTM (3) are sequentially arranged in a first direction, the two Loadlocks (21/22)...
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WO/2021/202193A1 |
In accordance with an embodiment, a method of plasma processing includes etching a refractory metal by flowing oxygen into a plasma processing chamber, intermittently flowing a passivation gas into the plasma processing chamber, and supp...
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WO/2021/199164A1 |
The present disclosure proposes a diagnostic system capable of properly identifying the cause of even an error for which multiple factors or multiple compound factors may be accountable. The diagnostic system according to the present dis...
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