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WO/2023/146808A1 |
Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an elec...
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WO/2023/146486A1 |
The subject of the invention is an irrigation system in corrosion and polishing machines (8) and relates to cooling of the discs by preventing the heating, burning and corrosion problems of the process-induced discs by ensuring that the ...
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WO/2023/139834A1 |
A chuck device (2) is configured to hold a wafer (W) during planarization of the wafer employing anodization. The chuck device includes a chuck cover (22), a suction section (23), and an energization section (24). The suction section (23...
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WO/2023/135118A1 |
This disclosure generally relates to a grinding jig (1) for holding a blade (100) of a tool in a grinding machine (200), the grinding machine (200) comprising a grinding means (210) and a support means (220). The grinding jig (1) compris...
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WO/2023/133110A1 |
Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pa...
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WO/2023/119703A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/121152A1 |
The present invention relates to a polishing device for delayering, the polishing device comprising: a stage which is installed to move along the X-axis and the Y-axis, and is rotatable about its own axis; a holder installed above the st...
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WO/2023/119847A1 |
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in...
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WO/2023/115111A1 |
A method of operating an automated machine including operating an oscillating tool over a surface of a workpiece in order to provide a finish to the surface, switching off oscillating motion of a head of the tool, recalibrating dimension...
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WO/2023/109579A1 |
The present invention relates to the field of grinding and polishing, and provides a paint surface reciprocating grinding and polishing abrasive paper system. The paint surface reciprocating grinding and polishing abrasive paper system s...
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WO/2023/112680A1 |
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the s...
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WO/2023/112464A1 |
This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/...
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WO/2023/111529A1 |
A machine tool (30) for machining two workpieces (48, 50) comprises a machine base (32), a first tool mount (37), first and second workpiece mounts (44, 46) with respective drives (69, 71), and a controller (72) arranged to control the f...
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WO/2023/103242A1 |
A plate polishing method, wherein a multi-section intelligent swing polishing machine is used for polishing; the multi-section intelligent polishing machine comprises a rack (1); a conveying device (2) and a plurality of fixed supports (...
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WO/2023/102887A1 |
Described herein are examples of material removal machines with work tables separated by an air gap. In some examples, the air gap may provide space for a material removal tool of the material removal machine to extend between and substa...
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WO/2023/100744A1 |
The present invention pertains to a method which is for manufacturing a glass substrate and which involves: fixing, to the surface of a pedestal, at least a part of a glass plate provided with a main face having a curved surface that has...
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WO/2023/098342A1 |
Provided in the present application are a grinding mechanism and a grinding robot, which relate to the technical field of robot building. The grinding mechanism comprises: a base; a spline nut mounted on the base; a spline shaft arranged...
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WO/2023/101842A1 |
A fixture is provided for converting a distance-controlled milling machine to a pressure-controlled regime, suitable for localized polishing. Methods of performing localized polishing utilizing the fixtures are also provided.
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WO/2023/073249A1 |
A workpiece holding head (10) has a housing (50), in/on which a holding arrangement (48) and a support arrangement (49) for an optical workpiece (14) are accommodated. The holding arrangement has a rubber-elastic sealing sleeve (52) whic...
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WO/2023/066310A1 |
Disclosed are a device and method for rail web rust removal before steel rail welding. The device comprises a rust removal power apparatus and a grinding and rust removal apparatus; the grinding and rust removal apparatus comprises a rus...
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WO/2023/066824A1 |
Disclosed is a retainer (10) for processing optical workpieces each having two workpiece surfaces and a workpiece rim therebetween. The retainer comprises a holding assembly (72) and a support assembly (73) for the workpiece. A rubber-el...
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WO/2023/068124A1 |
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holdi...
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WO/2023/062973A1 |
In a processing machine 1, a Z-axis electric motor 39 moves a main shaft 37 in a Z direction. A Z-axis position sensor 69 detects a position of the main shaft 37 in the Z direction. A rotation sensor 71 detects rotation of the main shaft...
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WO/2023/052421A1 |
The present invention relates to a method for grinding an elongate workpiece (14), comprising the following steps: - clamping the workpiece (14), wherein the workpiece (14) is supported at a first workpiece end (82) in a first workpiece ...
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WO/2023/047682A1 |
The present invention relates to a polishing device, a substrate processing apparatus, and a polishing method. This polishing device comprises a polishing unit 22. The polishing unit 22 comprises: a holding and rotating unit 35 that rota...
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WO/2023/047683A1 |
The present invention relates to a polishing method, and a substrate processing apparatus. This polishing method comprises: a rotation step for rotating a substrate W in a horizontal posture; an etching step for supplying an etching liqu...
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WO/2023/025577A1 |
The present invention relates to a profiled structure for a component of a power tool, wherein the profiled structure has a front side and a rear side, and wherein the profiled structure has at least two beads on one of the two sides and...
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WO/2023/019774A1 |
The present invention relates to a hot pressing device for an ACF glue film coupling structure and a process thereof. The hot pressing device comprises a transfer module and a first mounting plate connected to the transfer module; a nega...
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WO/2023/013146A1 |
The present invention enables accommodating diced workpieces in a tubular container while eliminating use of a moving mechanism for moving a processing table and comprises: a processing table which holds a workpiece; a first holding mech...
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WO/2023/013147A1 |
The present invention simplifies device structure, reduces footprint, and prevents scattering of processing fluid. This processing device comprises: a processing table 2A, 2B for holding a sealed substrate W; a first holding mechanism 3 ...
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WO/2023/005257A1 |
A floating non-contact ultrasonic reinforced flexible sub-aperture polishing apparatus and a polishing method therefor. The polishing apparatus comprises a flexible tool (101), a horn (102), an ultrasonic transducer (103), an electricall...
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WO/2023/000607A1 |
Provided is an assistive processing apparatus for a special-shaped self-aligning bearing grinding machine for aerospace, comprising a transition disc (2), balance blocks (3), a pressing plate (4), a stop block assembly, and a centering s...
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WO/2023/003724A1 |
Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radial...
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WO/2023/283905A1 |
A processing and polishing apparatus for the production of medical instruments, comprising a base (1), a machine table (2), a clamping assembly and an atomizing assembly. The atomizing assembly is provided on the top of the machine table...
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WO/2022/011402A9 |
The invention relates to a device for sharpening blades (1) comprising: a base (2) with a sharpening means (3); an arm (7) which at one end is mounted on a carrier (5) so as to be pivotable about a pivot axis (6) and which has at least t...
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WO/2023/277103A1 |
A production method according to the present disclosure comprises: a grinding step in which a group 13 element nitride crystal is contained in an opening of a plate-like carrier, and at least one main surface of the crystal is ground; an...
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WO/2022/256998A1 |
A drill bit grinding machine, comprising a base (1), a motor box (2) provided on the base, and a motor provided in the motor box. A grinding wheel (3) is provided at an end of an output shaft of the motor; a grinding seat (4) having a gr...
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WO/2022/256971A1 |
A milling cutter grinding machine, relating to the technical field of machinery, and comprising a machine body (1) and a motor mounted in the machine body (1). A grinding housing (2) and a mounting base (3) are arranged at the top of the...
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WO/2022/257234A1 |
A cylinder grinding device and method, and a recording medium, relating to the technical field of grinding devices. The cylinder grinding device comprises a conveying disc and a conveying mechanism. The conveying disc is disposed in a gr...
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WO/2022/252253A1 |
A centering non-deformation hole grinding pitch circle clamp, comprising a clamp body (1); an inner cam (2) is centeringly assembled on the clamp body (1), and a plurality of centering spigots (3) and positioning curved surfaces (4) are ...
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WO/2022/252293A1 |
Disclosed is a gear-machining surface grinding device, the device comprising a bottom plate and a top cover, wherein a top housing is mounted on the top of the bottom plate, and a center line of the top housing and a center line of the b...
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WO/2022/255924A1 |
The invention relates to a steady rest (1) for supporting an elongated workpiece (2), comprising a middle arm (4) moveable in its axial direction by a power means and two pivotally movable outer arms (5, 6). An arrangement provides a sep...
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WO/2022/251798A1 |
A tool for a floor machine. The tool includes a base having a plurality of slots, and a cleaning element provided in each of the slots. The cleaning elements are oriented along a secant or chord of the base. The cleaning elements have ab...
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WO/2022/244794A1 |
This method for processing a semiconductor wafer comprises: a step in which a semiconductor wafer comprising a body section and a rim section having a protruding section with a greater thickness than the body section is prepared; a step ...
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WO/2022/234609A1 |
The invention concerns a tool for surface finishing containing a body (20) to which there is attached a surface finishing element (30) which in turn includes at least one abrasive member (31) equipped with a respective abrasive surface (...
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WO/2022/227276A1 |
An automatic coaxial positioning apparatus used for securing for sand roller outer circle machining, which comprises a tapered surface shaft sleeve (1), an elastic dual-head tapered tube (2), and a tapered head top tube (3); the tapered ...
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WO/2022/229387A1 |
The invention relates to a pneumatic actuator. According to one embodiment, the actuator has the following: a housing having a pressure chamber; a rod inserted into the pressure chamber of the housing from the outside; a rod seal which i...
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WO/2022/222280A1 |
A rotary ultrasonic grinding machine tool, comprising a rotary ultrasonic grinding spindle (1), an ultrasonic power transmission device (2), a spindle clamping and lifting device (3), and a part clamping and feeding device (4), wherein t...
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WO/2022/214666A1 |
A system (50) for handling a structural member (44) of a blade (10) of a wind turbine (2), comprising a member support (52) configured for supporting the structural member (44), the member support (52) being configured to be mounted to a...
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WO/2022/210721A1 |
The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. T...
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