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JP2021020410A |
To provide a silicone rubber surface modified sheet suitable for efficiently obtaining a silicone rubber molding with a modified surface.A surface modified sheet X has a release sheet 10, and a surface modification layer 20 thereon. The ...
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JP2021014495A |
To provide: an active energy ray-curable release agent composition which has good release force, residual adhesion ratio, and solvent resistance, can be coated on a hard-to-coat substrate such as polyethylene and the like, and does not c...
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JP6828410B2 |
To provide an acid group-containing (meth) acrylate resin that has high developability and forms a cured product with excellent heat resistance and dielectric properties, a curable resin composition containing the same, an insulation mat...
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JP6825887B2 |
To provide a novel photocurable composition containing (meth)acryl-modified polybutadiene, and a cured product thereof.A photocurable composition contains the following (A), (B) and (C). (A) is a polymer of the following formula where Gi...
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JPWO2019151509A1 |
To provide an active energy ray-curable composition having excellent curability, adhesion to a cured product and a substrate, and light transmission. An active energy ray-curable composition containing a vinyl polymer, a (meth) acryloyl ...
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JP6821725B2 |
A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a...
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JP6819104B2 |
To provide an unsaturated group-containing alkali-developable resin having excellent developability and excellent heat resistance of a cured product.The present invention provides a resin comprising a compound having a molecular structur...
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JP6815488B2 |
There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming a...
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JP6816262B2 |
The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can...
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JP6810905B2 |
To provide a photosensitive resin composition for a relief printing plate precursor capable of achieving both of printing durability and gradation print reproducibility in a highlight part.The photosensitive resin composition for a relie...
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JP6813135B1 |
The present invention relates to a reaction product (I) of an epoxy resin (A), an unsaturated monobasic acid (B), and a polybasic acid anhydride (C), an epoxy resin (D), and an unsaturated monobasic acid (E). ) And, an acid group-contain...
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JP6813560B2 |
The invention relates to a poly alkyl(meth)acrylate polymer comprising a combination of polybutadiene-based monomers having different average molecular weight, lubricant compositions comprising the polymer, a method for manufacturing the...
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JP6811416B2 |
To provide a resin composition for a solder resist, which exhibits high adhesiveness to a circuit board and reduces warpage of a circuit board.The resin composition for a solder resist comprises (A) an epoxy resin, (B) a carboxyl group-c...
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JP6808976B2 |
To provide a color filter that eliminates color change due to light irradiation under low oxygen concentration and a minute amount of water, which has been the problem in using a phthalocyanine pigment for a color filter for a liquid cry...
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JP6803304B2 |
An object of the present invention is to provide a monomer having a polysiloxane structure and capable of providing a polymer having sufficient compatibility and hydrolysis resistance, while having high oxygen permeability useful for an ...
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JP2020200427A |
To provide a polyphenylene ether-containing resin composition which is excellent in heat resistance of a cured product and to provide an electronic circuit substrate material, a resin film, a prepreg and a laminate formed using the same....
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JP6800522B2 |
To provide an ultraviolet curable silicone resin composition which can exhibit excellent curability by ultraviolet irradiation and provides a cured product having a small compression set.There is provided an ultraviolet curable silicone ...
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JP6800440B2 |
A photocurable resin composition includes: a first reactive compound that forms a glass phase through curing; a second reactive compound that is compatible with the first reactive compound and forms a rubber phase through curing; and a p...
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JP2020195932A |
To provide a method for producing a film having high adhesion between a film and a solid surface where the film is formed.A method for producing a film containing a hydrophobic modified cellulose fiber, a curable resin and an organic med...
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JP6797866B2 |
A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type pho...
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JP6797354B2 |
The present invention provides: an acid group-containing (meth)acrylate resin that is characterized by including at least one amide bond, at least one imide bond, at least one ester bond, at least one (meth)acryloyl group, and at least o...
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JP2020535271A |
The present application relates to polymer film-metal complexes, methods of preparing polymer film-metal complexes, and the use of such complexes. The metal can be in the form of nanoparticles or film. The method is to deposit the compos...
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JP2020193298A |
To provide a resin molding with high heat-resistance while maintaining flexibility, in a single film of a resin molding of at least several dozen μm thick, composed of a photocurable composition, and also to provide a manufacturing meth...
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JP6793471B2 |
To provide, for example, a sealant for a liquid crystal dropping method that has a high adhesive strength to a substrate of a liquid crystal display panel despite a reduction in width of the frame of a sealing member, and can suppress co...
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JP2020532612A |
The present invention relates to a modified polyfluorinated poly (arylene ether ketone) that can be crosslinked to produce a high performance thermosetting resin useful for low dielectric constant semiconductor applications. The present ...
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JP6784257B2 |
To provide a fluorinated compound capable of imparting excellent antifouling properties (oily ink repellency and fingerprint-stain removability) and abrasion resistance of the antifouling properties to an object (such as a hard coat laye...
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JP6782742B2 |
To provide a crystal radical polymerizable composition for sealing an on-vehicle power semiconductor element, which is superior in fluidity and satisfactory in handleability.A crystal radical polymerizable composition for sealing a power...
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JP2020531594A |
A silicone polymer photoinitiator formed by covalently bonding a polysiloxane polymer with a terminal or pendant photofading photoinitiator moiety is disclosed. The optically transparent adhesive composition of liquid silicones containin...
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JP6778254B2 |
A polyurethane (meth)acrylate oligomer, having a tri-block symmetric structure BAB, comprises a polyether central block A linked by two urethane bonds to respectively two terminal hydrophobic blocs B based on hydrophobic polyester oligom...
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JP6774936B2 |
The invention relates to aqueous polyurethane - vinyl polymer hybrid dispersions comprising, as building blocks, hydrophobically modified hydroxy-functional polyesters A, acids B that have further groups which react with isocyanates unde...
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JP6773809B2 |
The invention relates to a method for preparing polyorganosiloxanes functionalized by (meth)acrylate groups, preferably acrylate groups.
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JP6773420B2 |
To provide a pigment dispersion composition for color filters that can make a pigment finer and also gives the pigment excellent dispersion stability.A pigment dispersion composition for color filters comprises alkali-soluble resin, a pi...
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JP6768703B2 |
Described are aqueous polymer dispersions for composite film lamination, comprising a dispersed polymer and a dissolved polymer, and also a multistage process for preparing them from ethylenically unsaturated, radically polymerizable mon...
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JP6764846B2 |
To provide a resin particle and a toner which are excellent in low temperature fixability, glossiness, hot offset resistance, charging properties and crushability, and satisfy all of flowability of the toner, heat resistant storage prope...
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JP2020158760A |
To provide: materials for three-dimensional printing that can be used to easily print completely integrated functional objects with limited post-processing and post-assembly; and processes for preparing the same.A material for three-dime...
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JP6764033B2 |
A method for making a pressure sensitive adhesive curable composition is performed at a temperature no greater than 35° C. The method includes the steps of 1) mixing starting materials including A) >0 to 40 weight parts of a polyorganos...
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JP6762189B2 |
To provide a curable polyorganosiloxane composition for forming a cured coating film having a low viscosity, good coating properties without a solvent, high hardness, excellent scratch resistance or the like.There is provided a curable p...
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JP6764134B2 |
There is provided a novel photosensitive adhesive composition. A photosensitive adhesive composition comprising the following components (A), (B), (C), and (D):Component (A): a polymer having a structural unit of the following formula (1...
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JP6762188B2 |
To provide a curable polyorganosiloxane composition for forming a cured coating film having a low viscosity, good coating properties without a solvent, high hardness, excellent scratch resistance or the like.There is provided a curable p...
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JP6764470B2 |
Provided are: a maleimide resin which contains a small amount of a ring-unclosed amic acid; and a cured product which is obtained by curing a curable resin composition using this maleimide resin, and which has excellent thermal decomposa...
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JP2020152854A |
To provide a curable polymer which can be cured at relatively low temperature, and from which a polar functional group is removed as much as possible; and to provide a method of producing the curable polymer.The curable polymer is a reac...
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JP2020152855A |
To provide a material capable of giving a resin substrate low in dielectric constant and dielectric loss tangent.A thermosetting resin composition contains: 5-100 pts.mass of a thermosetting resin whose main chain is a polymer of at leas...
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JP2020152771A |
To provide ultraviolet curable organopolysiloxane that has excellent convenience and is prevented from causing surface curing inhibition even when the ultraviolet curable organopolysiloxane is cured in atmosphere, to provide a compositio...
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JP6759139B2 |
To provide a resin composition for coil impregnation capable of obtaining a cured product which improves crazing resistance and hydrolysis resistance, is excellent in heat resistance and oil resistance and has high adhesive force, and to...
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JP2020147616A |
To provide a method for producing a cured product, in which a composition including a (meth)acrylic polymer is cured by using a UV-LED lamp.In a method for producing a cured product, a composition including 100 pts.wt. of a below mention...
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JP6757177B2 |
To provide a protective film which hardly deforms or fractures while maintaining low moisture permeability exhibited at a thin film condition and can have good adhesion with a polarizing plate using an energy ray-curable adhesive or a wa...
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JP6755803B2 |
The present invention provides a photo cured product having both excellent toughness and high strength, and also provides a photocurable composition for forming said photocured product. The present invention provides a photocurable compo...
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JP6755986B2 |
Provided is an energy ray-curable resin composition which is capable of providing a cured product having extremely excellent vibration damping properties when cured. An energy ray-curable resin composition which is characterized by conta...
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JP6755500B2 |
The invention provides a powder pre-preg comprising as sole resin a vinyl ester resin having a Tg in the range of -5 to +30°C and a melt viscosity @100°C in the range of 2 to 75 dPa.s, which can be used in making a composite at a tempe...
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JP2020140090A |
To provide a method for manufacturing an image display device enabling work of adhesion between an image display unit and a housing to be completed in a sufficiently short time, thereby greatly contributing to productivity improvement.Th...
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