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WO/2023/128067A1 |
The present invention relates to an epoxy resin composition that is stable at high temperatures, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dispensing coating met...
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WO/2023/124484A1 |
The present invention provides a resin composition and use thereof. The resin composition comprises a combination of resin and hollow glass microspheres, said hollow glass microspheres comprising the following components in percentage by...
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WO/2023/127800A1 |
An epoxy resin composition containing an epoxy resin (A) and a curing agent (B) having heteroatoms, the molecular weight α of the curing agent (B) having the heteroatoms being 200≤α≤1200, and the value of α/β, which is the ratio ...
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WO/2023/128236A1 |
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2023/126298A1 |
The present invention relates to a one-component thermosetting epoxy resin composition, comprising a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins...
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WO/2023/128247A1 |
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2023/128068A1 |
The present invention relates to an epoxy resin composition that has a high refractive index and high adhesiveness, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dis...
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WO/2023/125784A1 |
The present invention relates to a resin composition, and a prepreg and the use thereof. The resin composition comprises the following components, in parts by weight: 50 to 150 parts of a modified epoxy resin, 40 to 120 parts of a modifi...
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WO/2023/123845A1 |
The present invention provides an epoxy resin composition. A curing agent containing a disulfide bond is used in the composition for curing an epoxy resin to obtain the curing temperature of the composition; a slurry prepared from the ep...
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WO/2023/126312A1 |
Presently claimed invention is directed to a polymer (D) obtained by reacting a) at least one epoxide (E) having an average functionality of ≥ 3.0 and a number average molar weight in the range of from 250 to 25000 g/mol as determined ...
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WO/2023/117111A1 |
The invention relates to an especially recyclable composite material which consists of at least two material layers (1, 4) bonded by a layer (2) of adhesive. For an easy and clean separation of the two material layers the adhesive consis...
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WO/2023/120738A1 |
This sealing material composition comprises an epoxy resin, a curing agent, an inorganic filler material, and a silicone compound. In results of 1H NMR measurement carried out in CDCl3, when the chemical shift integral value of the silic...
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WO/2023/119850A1 |
The present invention provides an aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), a curing accelerator (γ), and a silane coupling agent (δ), in which: (α) contains a copolymer (X), a polyepoxy...
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WO/2023/116907A1 |
The invention provides a polymer composition, a polymer masterbatch composition and sheet materials comprising or produced from said compositions. Said polymer composition comprises: 90 parts by weight to 99 parts by weight of a polymer ...
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WO/2023/119107A1 |
The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fib...
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WO/2023/119106A1 |
The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fib...
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WO/2023/117112A1 |
The invention relates to a compound material, especially a recyclable composite material which consists of at least two material layers (1, 2) bonded by a layer (2) of adhesive. For an easy and clean separation of the two material layers...
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WO/2023/120455A1 |
The present invention provides a thermoplastic polyester resin composition which contains 0.1 part by weight to 10 parts by weight of (B) a compound which has two or more functional groups that are reactive with a carboxyl group in each ...
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WO/2023/119854A1 |
[Problem] The purpose of the present invention is to provide a two-part curable resin composition that has excellent room temperature curability and is capable of suppressing coloring of the cured product. [Solution] A two-part curable r...
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WO/2023/120739A1 |
An epoxy resin composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound; and the silicone compound is configured so as to satisfy the relational expression (visco...
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WO/2023/115768A1 |
The present invention relates to the field of functional polymer materials, and specifically provides a continuous fiber-reinforced thermoplastic helmet shell material and a preparation method. According to the continuous fiber-reinforce...
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WO/2023/112798A1 |
[Problem] To provide: a composition for forming a light-scattering layer, in which the precipitation of titanium oxide particles, which are large particles for light scattering purposes and having high refractive indexes, is prevented; a...
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WO/2023/112703A1 |
The present invention addresses the problem of providing a liquid composition capable of forming a hard coat layer having excellent toughness. A liquid composition according to the present invention includes a polymer obtained by perform...
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WO/2023/109165A1 |
The present invention belongs to the field of underfill materials for chips, and relates to a high-Tg reworkable underfill material capable of realizing rapid filling at room temperature, and a preparation method therefor and the use the...
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WO/2023/113560A1 |
The present invention relates to an adhesive coating composition for an electrical steel sheet, an electrical steel sheet laminate using same, and a method for manufacturing same, wherein the adhesive coating composition for an electrica...
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WO/2023/103323A1 |
The embodiments of the invention disclose an adhesive, and a die attach film and a preparation method therefor. The adhesive comprises, in parts by mass, 20-60 parts of an epoxy resin, 20-30 parts of a phenoxy resin, 5-10 parts of an ind...
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WO/2023/106283A1 |
The purpose of the present invention is to obtain a colored resin composition with which it is possible to form a film in which dye migration is suppressed during a film formation process as well as over time in a heated environment afte...
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WO/2023/105955A1 |
The present disclosure pertains to a polyalkylene terephthalate resin composition that contains 100 parts by mass of a polyalkylene terephthalate resin (A) and 0.10-10 parts by mass of an epoxy compound (B) that satisfies formula (1). In...
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WO/2023/103230A1 |
The present invention relates to the technical field of buoyancy materials, and in particular to an assembled buoyancy block and a manufacturing method therefor. The manufacturing method for the assembled buoyancy block comprises: A) hea...
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WO/2023/099307A1 |
The invention relates to a method of treatment of a fiber-reinforced epoxy composite which comprises contacting the fiber-reinforced epoxy composite with a bio-basedsolvent S chosen from levoglucosenone and/or a levoglucosenone derivativ...
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WO/2023/097771A1 |
An epoxy molding compound of a modified silicon dioxide grafted epoxy resin, and a preparation method therefor. The epoxy molding compound comprises: (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; (D) a silane couplin...
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WO/2023/100923A1 |
The present invention provides an electromagnetic interference suppressing material which comprises a powdered carbon material and a base material containing at least one substance that is selected from among organic materials and inorga...
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WO/2023/099435A1 |
The present invention relates to a curable epoxy resin composition comprising at least one epoxy resin, at least one epoxy resin curing agent, in particular selected from polyamines, and at least one silane selected from the group consis...
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WO/2023/101497A1 |
Disclosed are a curable composition, a dam structure fabricated therefrom, and a display device including the dam structure. The curable composition disclosed in the present invention includes: an acrylate-based compound in the form of a...
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WO/2023/100722A1 |
Provided is an epoxy resin from which a cured product exhibiting excellent dielectric characteristics and also having favorable mechanical characteristics is obtained. The epoxy resin is characterized by having a structure represented by...
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WO/2023/095785A1 |
The present invention addresses the problem of providing a photosensitive resin composition that has high sensitivity, can be formed into a cured article having high bending resistance, and can achieve high reliability when the cured art...
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WO/2023/095466A1 |
The present invention provides a resin sheet or the like, which enables the achievement of a cured product that has high relative magnetic permeability and excellent mechanical strength. The present invention provides a resin sheet which...
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WO/2023/088806A1 |
The invention relates to thermoplastic mixtures, containing: A) 30 to 100 wt.% of a thermoplastic blend consisting of: A-1) 65 to 75 wt.% of a polyester, A-2) 5 to 25 wt.% of a HD or LD polyethylene, A-3) 3 to 10 wt.% of an ionomer compo...
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WO/2023/090317A1 |
The present invention provides a curable resin composition that yields a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by c...
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WO/2023/091662A1 |
A method comprising combining polycarbonate thermoplastic with a decomposition initiator to decompose polycarbonate, heating the polycarbonate thermoplastic and decomposition initiator to a temperature between 120°C and 250°C for the r...
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WO/2023/090026A1 |
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excel...
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WO/2023/090215A1 |
This resin composition contains a polyphenylene ether compound (A), a styrenic block copolymer (B), a polybutadiene compound (C), and a curing agent (D). The polyphenylene ether compound (A) has at least one of a group represented by for...
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WO/2023/090239A1 |
A copolymer according to the present invention comprises a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth)acrylic monomer unit C other than the (meth)acrylic mono...
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WO/2023/090308A1 |
[Problem] To provide a resin composition that not only has excellent defoaming properties but also has excellent foam suppressing properties. [Solution] A resin composition containing a resin (X) (excluding a copolymer (Y) described late...
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WO/2023/090457A1 |
Provided are adhesive particles capable of sufficiently enhancing adhesiveness, suppressing peeling from base materials, and highly accurately controlling a gap between the base materials. Adhesive particles (1) according to the presen...
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WO/2023/088097A1 |
The present invention relates to a flame-retardant epoxy resin composition, comprising on the basis of the total weight of the composition: A) 25-65 wt% of epoxy resin, B) 16-30 wt% of brominated epoxy resin, the brominated epoxy resin h...
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WO/2023/089878A1 |
[Problem] To provide an epoxy resin composition that has excellent injection properties and thermal conductivity for a cured product and can be used to produce a semiconductor device that has high operation reliability. [Solution] An epo...
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WO/2023/090241A1 |
An inorganic filler according to the present invention has a zeta potential of -15 mV or lower at a pH of 7. A heat dissipation member according to the present invention contains a resin and an inorganic filler according to the present i...
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WO/2023/090374A1 |
This resin composition obtained using a crystalline thermoplastic resin and regenerated carbon fibers, ensures sufficient mechanical strength and exhibits excellent productivity and flame resistance. A molded article and pellets formed f...
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WO/2023/090456A1 |
Provided are adhesive particles capable of sufficiently increasing the adhesiveness. Adhesive particles according to the present invention contain a compound having a structure represented by formula (1). (1): R1-(SiOpR3R4q)n-R2 In f...
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