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WO/2023/048209A1 |
This resin composition contains a phenol carbonate resin (A) and an epoxy resin (B), wherein the molar ratio (epoxy groups / terminal hydroxyl groups) of the epoxy groups of the epoxy resin (B) to the terminal hydroxyl groups of the phen...
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WO/2023/047702A1 |
The present invention provides a liquid compression molding material which is composed of an epoxy resin composition that contains (A) an epoxy resin, (B) a curing accelerator, (C) a filler and (D) an elastomer, wherein the blending rati...
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WO/2023/043930A1 |
A fire-resistant two-part system comprising a first component and a second component. The first component comprises one or more fire resistance improving additives. The second component comprises one or more acids.
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WO/2023/042727A1 |
Provided is a rubber composition which can attain an improved balance among the scorch time of the unvulcanized form and the hardness, tensile strength, and freeze resistance of the vulcanizate. The rubber composition comprises a chlorop...
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WO/2023/038775A1 |
The present invention relates to a composition comprising an aqueous dispersion of a thermosettable compound and polymer particles functionalized with aminoalkyl ester groups. The composition is useful as a two-component waterborne curin...
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WO/2023/037862A1 |
Provided is a thermally conductive composition comprising: a curable component; a curing agent for curing the curable component; and a metal filler. The metal filler includes thermally conductive particles and low-melting-point metal par...
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WO/2023/039504A1 |
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an...
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WO/2023/030989A1 |
The invention relates to a method for producing a vulcanizable composite material, having the steps of: a) producing or providing a textile reinforcement, b) treating the textile reinforcement with an aqueous dispersion in order to activ...
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WO/2023/033404A1 |
The present disclosure relates to a thermoplastic resin composition, a method for preparing same, and a molded product comprising same and, more specifically, to a thermoplastic resin composition, a method for preparing same, and a molde...
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WO/2023/029257A1 |
Disclosed in the present application are a recoverable nano-composite material, and a preparation method therefor and the use thereof. The preparation method comprises: providing a reinforcement material which comprises a conductive mate...
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WO/2023/033919A1 |
Provided herein is a two-component adhesive composition showing excellent adhesive strength after heat and humidity exposure.
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WO/2023/032467A1 |
Provided are: a resin composition having excellent sensitivity during pattern processing and having excellent adhesion to inorganic materials; a resin composition film; and a semiconductor device employing the same. The resin composition...
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WO/2023/032680A1 |
[Problem] To provide a silica sol which, as the dispersoid, contains silica particles that include an epoxy group or an epoxy group-containing organic group and an alkoxy group, and that is stably dispersed in an organic solvent; and a c...
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WO/2023/030454A1 |
The present invention provides a thermosetting resin composition, comprising an epoxy curing agent, an epoxy resin component, a free radical initiator, a reactive diluent, a toughening agent, and a polyurethane compound. The epoxy resin ...
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WO/2023/032943A1 |
A heat-curable composition including a main agent with a glycidyl ether group, and a solid latent curing agent, wherein the particle size prior to heat curing is 40 μm or less.
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WO/2023/032986A1 |
The purpose of the present invention is to provide a silica which has a low dielectric loss tangent and excellent uniform dispersibility in a resin, while achieving high safety. The present invention relates to a material for forming a f...
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WO/2023/032971A1 |
An epoxy resin composition for compression molding which comprises an epoxy resin including a polycyclic structure and/or two or more cyclic structures, a hardener, and an inorganic filler, the content of the inorganic filler being 87.0 ...
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WO/2023/032860A1 |
In a chart regarding this curable resin composition which is obtained by performing dynamic viscoelasticity measurement of a cured resin product of the curable resin composition and in which tan δ is the vertical axis and the horizontal...
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WO/2023/030988A1 |
The invention relates to a method for producing a vulcanizable composite material, comprising the steps of: a) producing or providing a textile reinforcement, b) treating the textile reinforcement with an aqueous dispersion in order to a...
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WO/2023/026584A1 |
A film-like adhesive agent comprising an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), wherein the contained amount of the epoxy resin curing agent (B) in the film-like adhesive agent is 0.30-12.0 mass%, the ...
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WO/2023/025534A1 |
Polymer compositions are provided, as are processes of preparing them. Compositions comprising the polymer composition and up to 60 wt.% of at least one filler are also provided, as are articles, parts and composite materials comprising ...
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WO/2023/027158A1 |
The present invention provides a thermally conductive composition which has excellent thermal conductivity, processability, and long-term reliability. The thermally conductive composition comprises: 100 parts by mass of an epoxy resin ...
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WO/2023/026850A1 |
The present invention addresses the problem of providing: a novel benzoxazine compound which has excellent heat resistance, and is able to be cured under low-temperature conditions; a resin starting material composition which contains th...
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WO/2023/026817A1 |
The present disclosure relates to a thermosetting resin composition including a first resin which is a thermosetting resin, and compound particles. The compound particles contain a second resin and an inorganic filler, and the amount of ...
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WO/2023/022541A1 |
The present invention relates to a graft copolymer, and more particularly, to: a core-shell graft copolymer comprising a core containing a rubber polymer, and a shell formed by graft-polymerizing the rubber polymer with a graft monomer, ...
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WO/2023/021956A1 |
A heat-conductive silicone composition according to the present invention contains: (A) an addition reaction product between (a) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group per molecule and having a ...
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WO/2023/020222A1 |
A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by me...
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WO/2023/022148A1 |
The present invention provides: an epoxy composition configured for reduced viscosity, etc., where even when some heat is applied, progression of curing and a subsequent rise in viscosity are not promoted; an adhesive agent containing th...
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WO/2023/018274A1 |
The present invention relates to a graft copolymer and, specifically, to a graft copolymer composition, a curable resin composition comprising same, and methods for preparing the compositions, wherein the graft copolymer composition has ...
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WO/2023/017762A1 |
Provided are: a metal member–polyarylene sulfide resin member complex that has excellent air-tightness between a metal member and a polyarylene sulfide resin; and a production method therefor. The metal member–polyarylene sulfide r...
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WO/2023/017729A1 |
A fiber-reinforced composite material which is configured of a stitched reinforcing-fiber base and a cured resin obtained by curing an epoxy resin composition comprising a hardener A, a hardener B, a hardener C, an epoxy resin D, an epox...
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WO/2023/018304A1 |
The present invention relates to a graft copolymer and, specifically, to a graft copolymer composition, a curable resin composition comprising same, and methods for preparing the compositions, wherein the graft copolymer composition has ...
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WO/2023/013715A1 |
A curable composition containing an alkenylphenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and an acid anhydride D.
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WO/2023/013717A1 |
A curable composition which contains an alkenyl phenol, an epoxy-modified silicone, an epoxy compound other than the epoxy-modified silicone, and a cyclic carbodiimide compound.
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WO/2023/013712A1 |
The purpose of the present invention is to provide a curable composition, a prepreg, a metal foil clad laminated sheet, and a printed wiring board, which simultaneously achieve low thermal expansion, heat resistance (high glass transitio...
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WO/2023/013711A1 |
A thermosetting composition containing an alkenylphenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and an aromatic phosphorous compound P.
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WO/2023/013495A1 |
A resin composition having low warpage and excellent heat resistance, characterized by: containing, based on 100 total mass parts of (A)-(C), 25-48 mass parts of a polyphenylene sulfide resin (A) having an MVR measured at 295°C under 1....
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WO/2023/013732A1 |
The present invention provides a resin composition for fluxes, the resin composition enabling a cured product thereof to have improved moisture-resistant insulation properties. This resin composition for fluxes contains an epoxy resin (A...
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WO/2023/012214A1 |
The invention relates to an article (10) for reducing the adhesion of ice, comprising: - a substrate (11), made of metallic material, which has a surface (12) having at least locally a micro-textured zone (15) formed by a plurality of re...
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WO/2023/013716A1 |
A curable composition containing an alkenylphenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and an amino triazine novolac resin D.
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WO/2023/006005A1 |
Embodiments of the present application provide an epoxy resin, which has an aromatic polycyclic skeleton. An epoxy group having at least one alkoxysilyl group and at least two β-band substituents are grafted on the aromatic polycyclic s...
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WO/2023/008351A1 |
The present invention provides a transparent resin composition with which it is possible to form a cured product having excellent resistance to warping and yellowing. This transparent resin composition includes: (A) an epoxy resin that...
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WO/2023/006123A1 |
Disclosed in the present invention are a normal-temperature in-situ repair material for a drainage pipeline and a construction method therefor. The normal-temperature in-situ repair material comprises a material A and a material B. The m...
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WO/2023/008350A1 |
The present invention provides a transparent resin composition with which it is possible to form a cured product having excellent storage stability, as well as excellent resistance to yellowing and strong adhesion to glass. This transp...
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WO/2023/007894A1 |
A thermally conductive resin composition which contains an epoxy resin and a thermally conductive powder, wherein: the thermally conductive powder contains aluminum nitride, which has a silicon-containing oxide coating film on the surfac...
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WO/2023/008363A1 |
The present disclosure addresses the problem of providing a reaction curable composition that makes it possible to suppress reflection of light on the surface of a cured product by producing the cured product by curing the reaction curab...
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WO/2023/008424A1 |
This resin composition contains: a component (I), a polar group-containing resin (excluding component (II)); and a component (II), at least one type of modified conjugated diene-based polymer in which at least one type of polar group sel...
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WO/2023/002904A1 |
A resin composition for sealing according to the present invention comprises a coloring agent, a thermosetting resin, a curing agent, and an inorganic filler, wherein the coloring agent contains carbon particles in which the specific res...
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WO/2023/003257A1 |
The present invention relates to a polyphenylene sulfide composite resin and a molded product using same and, more specifically, a polyphenylene sulfide composite resin and a molded product using same, wherein the resin has excellent pro...
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WO/2023/000582A1 |
The present disclosure relates to a preparation method for a two-component epoxy resin adhesive and the two-component epoxy resin adhesive prepared thereby. The preparation method comprises the following steps: mixing an epoxy compound a...
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