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WO/2019/221262A1 |
The purpose of the present invention is to provide a composite material that has improved strength and contains an epoxide resin. This problem can be solved by a curable epoxide composition, the curable epoxide composition containing an ...
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WO/2019/215533A1 |
Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a ...
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WO/2019/212218A1 |
Photonic sintered nanoink is provided. The photonic sintered nanoink may comprise: a photonic sintered precursor including conductive nanoparticles and an oxide film surrounding the conductive nanoparticles; a polymeric binder resin; and...
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WO/2019/208569A1 |
The present invention addresses the problem of providing an adhesion method wherein the use of a curable resin composition with a viscosity that is less dependent on temperature results in exceptional workability. The problem is solved b...
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WO/2019/203572A1 |
The present invention relates to: a resin composition for semiconductor adhesion, comprising a thermoplastic resin, a thermosetting resin, a curing agent, and a compound having a specific structure; and a semiconductor adhesive film manu...
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WO/2019/198545A1 |
The present invention provides an adhesive that can manifest surface tackiness to improve temporary adhesiveness, that can furthermore manifest exceptional adhesive strength by means of increased adhesion following temporary adhesion, th...
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WO/2019/188372A1 |
Provided are an anisotropic conductive adhesive with which it is possible to obtain high connection reliability even in the case of pressure bonding under a low pressure condition, and a connecting body manufacturing method. The anisotro...
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WO/2019/183753A1 |
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one photo-base generator. The epoxy based composition according to the present inv...
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WO/2019/189617A1 |
The present invention is a resin composition containing a component (A), a component (B), and a component (C), the component (A) being a modified polyolefin-based resin, the component (B) being a compound having a cyclic ether group, and...
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WO/2019/189618A1 |
The present invention pertains to an electronic device-sealed body comprising an electronic device and an adhesive-cured layer that seals between a UV-impermeable functional film and the electronic device; a sheet-shaped adhesive that is...
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WO/2019/189616A1 |
The present invention is a resin composition which comprises a modified polyolefin resin as a component (A), a compound having a cyclic ether group as a component (B), and a photocationic polymerization initiator as a component (C), wher...
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WO/2019/188283A1 |
[Problem] To provide an adhesive composition which is capable of bonding and aging at low temperature and has excellent adhesion, electrolyte resistance, heat resistance, durability, and moldability. [Solution] This adhesive composition ...
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WO/2019/188641A1 |
Provided is an adhesive composition that favorably adheres to members of different materials, such as metals and plastics (and, in particular, non-polar plastics such as polypropylene) and the like, and that has excellent shear adhesive ...
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WO/2019/189238A1 |
An adhesive composition which contains an adhesive resin, core-shell polymer particles (A) that have a volume average particle diameter of 10-300 nm, and polymer particles (B) that have a volume average particle diameter of 400-10,000 nm...
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WO/2019/188436A1 |
A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after ...
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WO/2019/188284A1 |
[Problem] To provide an adhesive composition which is capable of bonding and aging at low temperature and has excellent adhesion, electrolyte resistance, heat resistance, durability, and moldability. [Solution] This adhesive composition ...
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WO/2019/187414A1 |
Provided is an adhesive for electronic components, which exhibits good fillet moldability, has a good coating form, can achieve a high bonding strength even with small chips, and exhibits good viscosity and thixotropy. This resin composi...
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WO/2019/187478A1 |
After grinding is performed on a semiconductor wafer 1, the semiconductor wafer 1 is fixed on an electrostatic chuck 9 so as to cause the front-surface S side of the semiconductor wafer 1 to face the electrostatic chuck 9. Next, a maskin...
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WO/2019/181862A1 |
Provided is a monomer mixture which is rapidly cured even in a high humidity environment, and which is used for the purpose of forming a cured product that exhibits excellent adhesion not only to plastics but also to metals and glass. A ...
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WO/2019/181336A1 |
[Problem] To provide an aqueous dispersion composition which exhibits excellent adhesion not only to polyolefin base materials but also to other plastic base materials, and which is thus useful in applications such as coating materials, ...
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WO/2019/182001A1 |
A film-like adhesive having the following characteristics: (I) when an initial detected temperature of the melt viscosity of the film-like adhesive after being stored for 168 hours at 40°C is T168, and when the initial detected temperat...
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WO/2019/179636A1 |
The present invention relates to a pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition has a latent reactive, thermally activatable curing agent for producing a structural ...
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WO/2019/181789A1 |
This sealing adhesive contains an epoxy resin, a curing agent, an inorganic filler, and a triazine thiol compound.
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WO/2019/176554A1 |
Provided are an underfill material whereby high connection reliability can be obtained, and a method for manufacturing a semiconductor device using the same. The underfill material contains an epoxy compound, an epoxy curing agent, and a...
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WO/2019/177134A1 |
[Problem] To provide an active energy ray-curable adhesive composition that exhibits an excellent adhesive strength to a variety of plastic films and in particular provides an excellent adherence between hydrophilic plastic films and an ...
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WO/2019/170747A1 |
The invention relates to a heat-activatable foamable honeycomb core splice adhesive having improved fire retardancy, particularly with respect to smoke toxicity and smoke opacity (smoke density).
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WO/2019/172227A1 |
This adhesive composition comprises a resin component and a modified amine-based curing agent that is solid at ordinary temperature. The resin component contains a bismaleimide compound, a urethane-modified polyester resin, and a bisphen...
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WO/2019/167824A1 |
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver ...
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WO/2019/167675A1 |
Provided are: an endoscope adhesive agent which is a two-liquid type and has a main agent and a curing agent, wherein the main agent contains epoxy resin (A), and the epoxy resin (A) contains an epoxy resin (a) having an average degree o...
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WO/2019/167819A1 |
A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity pro...
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WO/2019/167460A1 |
An adhesive for a semiconductor, said adhesive being to be used for at least partly sealing connection parts of a semiconductor device wherein electrodes in respective connection parts of a semiconductor chip and a wiring circuit board a...
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WO/2019/166579A1 |
The present invention relates to a new elasticizing additive, to be introduced into a polymerizable material, particularly an epoxy resin, and formed with it, a structural adhesive obtained by reaction of a first reaction component made ...
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WO/2019/163804A1 |
Provided are: a curable composition giving a cured object which has high strength, high rigidity, and flexibility; and the cured object obtained by curing the curable composition. The curable composition is a multi-pack type curable comp...
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WO/2019/164568A1 |
Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable b...
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WO/2019/159566A1 |
[Problem] Provided is a conductive adhesive capable of suppressing erosion on polycarbonate, and forming a cured product having excellent conductivity at low temperature. Also provided is a conductive adhesive capable of forming a cured ...
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WO/2019/155355A1 |
A resin composition, including a radical-polymerizable compound, a cation-polymerizable compound, a photo radical photopolymerization initiator, and a photo cation photopolymerization initiator; wherein the resin composition has a range ...
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WO/2019/156154A1 |
The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resi...
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WO/2019/156253A1 |
The present invention provides: an adhesive sheet that, before a peeling step, stays fully and stably stuck to a back surface of a lead frame and a back surface of a sealing resin and does not leak sealing resin, even after being subject...
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WO/2019/150995A1 |
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having a weight-average molecular weight of 200,000 to 1,300,000, and having at least one type of functional group selected f...
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WO/2019/150433A1 |
Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having at least one type of functional group selected from a group consisting of a carboxy group and a hydroxy group; and a s...
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WO/2019/150446A1 |
Disclosed is an adhesive composition which comprises one or more thermosetting resins, a hardener, and an elastomer, wherein the thermosetting resins comprise an epoxy resin having an alicyclic ring. Also disclosed is a filmy adhesive ob...
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WO/2019/150449A1 |
The present invention pertains to a semiconductor device production method which is provided with: a first die bonding step for electrically connecting a first semiconductor element onto a substrate via a first wire; a lamination step fo...
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WO/2019/150448A1 |
Provided is a method for manufacturing a semiconductor device comprising: a first mounting step of electrically connecting a first semiconductor element through a first wire on a substrate; a lamination step of attaching a film adhesive ...
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WO/2019/146672A1 |
The purpose of the present invention is to provide: a resin composition and a cured product of the same which, after curing, has excellent impact resistance when dropped as well as excellent solvent resistance; an adhesive for an electro...
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WO/2019/142950A1 |
A liquid crystal screen protector for a smart device and an attaching device therefor are disclosed. The liquid crystal screen protector for a smart device according to the present invention comprises: a protector part attached to at lea...
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WO/2019/139112A1 |
Particles of a hardener comprising a urea compound for epoxy resins are provided. When the particles are contained in an epoxy resin composition, excellent storage stability and heating stability can be imparted to the epoxy resin compos...
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WO/2019/138988A1 |
Provided is an alicyclic epoxy compound product used for the purpose of forming a cured product having excellent heat resistance and transparency. An alicyclic epoxy compound product according to the present invention is characterized in...
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WO/2018/143189A9 |
The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface...
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WO/2019/135857A1 |
Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles...
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WO/2019/127172A1 |
This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present inventio...
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