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WO/2010/027507A2 |
A process for removing a washable PSA laminate from a substrate is provided. The process comprises contacting the washable PSA laminate with water and optionally, a base, at a temperature sufficient to remove the washable PSA laminate fr...
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WO/2010/027017A1 |
Disclosed is an electroconductive connecting material that electrically connects terminals for respective electronic members to each other. The electroconductive connecting material has a laminate structure comprising a curable resin co...
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WO/2010/024094A1 |
Disclosed are: a thermally conductive pressure-sensitive adhesive sheet which has long-lasting flexibility, has a satisfactory level of strength, has high thermal conductivity and high electronic conductivity, is lightweight, and is inex...
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WO/2010/021505A2 |
The present invention relates to an adhesive agent, a preparation method thereof, a polarizing plate, and a liquid crystal display. The present invention provides: an adhesive agent with excellent durability, adhesiveness, releasability,...
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WO/2010/017276A2 |
A biomedical sensor system is disclosed that includes a plurality of electrodes and a contiguous adhesive material that is in contact with each of the plurality of electrodes. In certain embodiments a method is provided that includes the...
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WO/2010/007817A1 |
An anisotropic conductive adhesive which comprises an epoxy adhesive comprising an epoxy compound and a hardener and conductive particles dispersed in the adhesive, the anisotropic conductive adhesive giving a cured adhesive which satisf...
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WO/2010/001900A1 |
Disclosed is a circuit connection material which is interposed between opposing circuit electrodes so as to electrically connect opposing electrodes in the direction of pressure when pressure is applied to the circuit electrodes. The ci...
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WO/2010/000096A1 |
Provided is a semiconductor packaging applicable conductive composition using silver coated material flakes as a conductive filler, curable epoxy, acrylate, bismaleimide chemical,or the like or their combination as organic resin, and the...
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WO/2009/157315A1 |
Disclosed is a heat-conductive pressure-sensitive adhesive sheet having a high heat conductivity and excellent flame retardancy. A heat-conductive pressure-sensitive adhesive composition constituting the heat-conductive pressure-sensiti...
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WO/2009/145005A1 |
An adhesive film formed from a binder composition that contains an epoxy compound, a hardening agent, and a non-conductive filler, whereby said adhesive film-which is used to flip-chip-mount a semiconductor chip onto a wiring substrate-c...
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WO/2009/133897A1 |
Disclosed is a connecting material that, even when joined at a curing temperature of 200°C or below without applying a load, has a high coefficient of thermal conductivity and has a satisfactory bonding strength even when a cured produc...
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WO/2009/133901A1 |
Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging t...
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WO/2009/131920A2 |
A (meth)acrylic pressure-sensitive adhesive foam reduced in the amount of a foaming adjuvant compared with the conventional foam and having a high air bubble content, and a method for producing the same are provided. The foam includes a ...
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WO/2009/131101A1 |
Disclosed is a conductive resin composition which can secure sufficient reliability in reliability test even when a low-cost conductive powder is used. The conductive resin composition can be suitably used for conductive adhesives and th...
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WO/2009/128530A1 |
Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molec...
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WO/2009/128514A1 |
Disclosed is an adhesive material tape (10) comprising a tape-like backing (1) having a first surface (F1) and an opposing second surface (F2), and an adhesive layer (2) formed on the first surface (F1) of the backing (1) and containing ...
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WO/2009/128645A2 |
Disclosed are an anti-static adhesive composition, and a polarizing plate and/or a surface protective film fabricated using the same. More particularly, an anti-static adhesive composition for imparting enhanced anti-static properties, i...
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WO/2009/119324A1 |
Disclosed is an anisotropic conductive film which has improved adhesion strength to circuit members, thereby enabling high conduction reliability. A joined structure and a method for producing the joined structure are also disclosed. Spe...
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WO/2009/120376A2 |
A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fug...
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WO/2009/115004A1 |
An aqueous binder for lithium ion battery and the preparation method thereof are provided. It belongs to the field of manufacture of energy storage components such as battery, etc. The said aqueous binder for lithium ion battery is an aq...
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WO/2009/115069A2 |
The invention relates to a method for the automated production of circuit carriers, comprising the following steps: - providing a substrate (1) for accommodating electronic components (2), - applying an electrically conductive, metal-con...
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WO/2009/115610A1 |
The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerisation accelerator.
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WO/2009/104312A1 |
Disclosed is a microencapsulated silane coupling agent, which comprises: an adduct particle produced from an epoxy compound and an imidazole silane coupling agent; and an ethyl cellulose film which covers around the adduct particle, wher...
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WO/2009/102933A1 |
A fluid absorbing pressure sensitive adhesive composition and adhesive articles including the fluid absorbing adhesive that have particular utility in the medical field, and in particular, for use with wound dressings is provided. The ad...
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WO/2009/101249A1 |
A method for improving electrical conductivity and/or adhesion of an electrical coupling formed in a metal foil conductor, the metal foil conductor being formed by the reel to reel technique on a flexible substrate, comprises exposing th...
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WO/2009/102371A2 |
A method of bonding an electrically conductive silicone gasket includes activating selected surfaces of the electrically conductive silicone gasket, applying a sealant having a corrosion inhibitor to at least a portion of the activated s...
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WO/2009/096459A1 |
Disclosed is a resin composition for use in an electrostatic adsorption method adopted in electrostatically adsorbing a workpiece such as a semiconductor wafer or an insulating substrate. The resin composition contains an acrylic compoun...
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WO/2009/090997A1 |
Disclosed is a curable electromagnetic shielding adhesive film having a curable conductive polyurethane-polyurea adhesive layer (I) and a curable insulating polyurethane-polyurea resin composition layer (II). The curable conductive polyu...
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WO/2009/092064A2 |
Disclosed is an electrically conductive adhesive that includes an electrically conductive powder, a heat-curable silicone resin, and a solvent.
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WO/2009/084651A1 |
Disclosed are: an adhesive composition having excellent properties; and others. Specifically disclosed is an adhesive composition characterized by comprising bis(fluorosulfonyl) imide. The adhesive composition has properties equivalent o...
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WO/2009/085631A2 |
Disclosed are adhesive tapes which include a flake conductive filler material. According to the disclosed invention, the adhesive tapes comprising a flake conductive filler that can be changed depending on the light-shielding pattern of ...
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WO/2009/078469A1 |
Disclosed are insulator-covered conductive particles, each of which comprises a conductive particle having a base particle and many metal plating layers covering at least a part of the base particle surface, and insulating fine particles...
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WO/2009/077638A1 |
The present invention relates to a label comprising a substrate having a face side and a rear side, and an adhesive layer arranged on the rear side of the substrate. The adhesive layer is non-tacky but activatableto become tacky. The adh...
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WO/2009/078409A1 |
Provided is a circuit connecting material, which is arranged between circuit electrodes facing each other, pressurizes the facing circuit electrodes and electrically connects the electrodes in the pressurizing direction. The circuit conn...
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WO/2009/079216A1 |
A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive prec...
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WO/2009/066883A1 |
The present invention provides an adhesive composition, which may have a short aging time resulting in high productivity and permit the formation of an adhesive layer exhibiting good antistatic performance, and an optical member and a su...
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WO/2009/063255A1 |
An LED device comprising at least one LED chip (3); and a heatsink (7), wherein the LED chip (3) is thermally coupled to the heat sink (7) using a silver based thermally conductive substrate (5).
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WO/2009/060686A1 |
Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the b...
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WO/2009/061673A2 |
Optical adhesives that also diffuse visible light include a blend of an adhesive matrix which is an optical adhesive and a block copolymer. The adhesive may be a pressure sensitive adhesive and contains either acid or basic functionality...
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WO/2009/057612A1 |
Disclosed is a circuit connecting material for electrically connecting two circuit members each with a circuit electrode formed thereon in such a state that the circuit electrodes are disposed to face each other. The circuit connecting m...
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WO/2009/058630A2 |
Disclosed is a thermally conductive adhesive comprising an adhesive polymer resin, a thermally conductive filler and a microhollow filler. The adhesive comprising a microhollow filler that can form a porous structure, in addition to a th...
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WO/2009/054387A1 |
Disclosed is a coated conductive powder which is useful as a conductive filler for an anisotropic conductive adhesive that is particularly used for electrically connecting circuit boards or circuit components. Also disclosed is a conduct...
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WO/2009/054410A1 |
Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (5...
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WO/2009/054386A1 |
Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable o...
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WO/2009/044706A1 |
A circuit-connecting material for connecting a first circuit member comprising a first substrate and a first circuit electrode formed on the main surface thereof to a second circuit member comprising a second substrate and a second circu...
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WO/2009/044801A1 |
This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesi...
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WO/2009/044732A1 |
Disclosed is an adhesive composition which is used for bonding circuit members with each other and electrically connecting circuit electrodes of the circuit members with each other. This adhesive composition contains an adhesive componen...
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WO/2009/044678A1 |
Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit elec...
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WO/2009/041445A1 |
Disclosed is a conductive anaerobically curable adhesive which is excellent in storage stability and adhesiveness. Specifically disclosed is an anaerobically curable composition characterized by consisting of (a) a compound having at lea...
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WO/2009/041526A1 |
Disclosed is a conductor-connecting member wherein an adhesive layer (3) is formed on at least one surface of a metal foil (1). The metal foil (1) has a plurality of projections (2) having substantially the same height and integrated wit...
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