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WO/2021/199468A1 |
The purpose of the present invention is to provide: a laminate which does not contain hexavalent chromium and has excellent corrosion resistance and abrasion resistance; and a laminate manufacturing method. To achieve the purpose, a lami...
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WO/2021/197950A1 |
The present invention provides a composition comprising copper ions, an acid, and at least one polyaminoamide comprising, a group of formula (L1) [A-B-A'-Z]n[Y-Z]m (L1) wherein B is a diacid fragment of formula (L2) A, A' are amine fragm...
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WO/2021/199087A1 |
A galvanic process for the electrodeposition of a protective layer, which comprises a step of coating with a protective layer at least one object immersed in a galvanic bath comprising an aqueous solution. The aqueous solution comprises ...
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WO/2021/191334A1 |
The invention relates to a method for electrodepositing a grey or black layer on an electrical circuit. Said electrical circuit is, for example, a printed circuit-type electrical circuit for producing a module designed to be integrated i...
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WO/2021/193696A1 |
An electroplating solution comprising (A) a soluble salt containing at least a first tin salt, (B) an acid or a salt thereof, and (C) a surfactant. When electrolysis is carried out at an anodic current density of 0.7 A/dm2, the maximum v...
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WO/2021/181901A1 |
Provided are: a silver-plated material having superior fretting wear properties than ever before; and a method for manufacturing the silver-plated material. The silver-plated material is manufactured by forming a base plating layer 12 ma...
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WO/2021/176769A1 |
An electrolyte for titanium plating, said electrolyte containing: at least one kind of alkali metal ions selected from the group consisting of lithium ions, sodium ions and potassium ions; at least one kind of halide ions selected from t...
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WO/2021/175935A1 |
The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate,...
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WO/2021/177231A1 |
A Ni-plated steel sheet according to one embodiment of the present invention comprises a base steel sheet and a Ni-plated layer provided to a surface of the base steel sheet. The Ni-plated layer includes a Ni-Fe alloy layer formed on the...
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WO/2021/171818A1 |
The present invention provides: a silver-plated material which has higher hardness than ever before, while having excellent wear resistance; and a method for producing this silver-plated material. A method for producing a silver-plated m...
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WO/2021/170460A1 |
The invention relates to a piston ring having a main body. The main body has an inner peripheral surface, a first flank surface, a second flank surface and an outer peripheral surface. A first hard chromium layer having a network of crac...
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WO/2021/166581A1 |
A terminal material for a connector, the terminal material comprising a substrate in which at least a surface layer thereof comprises copper or a copper alloy, a nickel plating layer that comprises nickel or a nickel alloy and is formed ...
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WO/2021/166965A1 |
A silver plating material 10 in which a silver plating film 2 is formed on a substrate 1. In the silver plating material 10, the silver plating film 2 has a layered crystal structure in which a plurality of sheet-form layers are layered.
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WO/2021/166964A1 |
A silver-plated material having a silver coating film formed on a base material. In the silver-plated material, the silver coating film contains 0.05 to 0.25% by mass of sulfur. The plated material can be produced by subjecting the base ...
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WO/2021/158402A1 |
Methods, inks, apparatus, and systems for forming metal features on semiconductor substrates are provided herein. Advantageously, the techniques herein do not require the use of photoresist, and can be accomplished without many of the pr...
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WO/2021/157696A1 |
Provided is a thermal spray wire as a thermal spray material that is used with a continuous arc thermal spraying unit, the thermal spray wire having good electroconductivity and being configured for continuous, stable arc thermal sprayin...
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WO/2021/153160A1 |
One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin salt; one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof...
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WO/2021/149821A1 |
Provided is a roughened nickel-plated sheet that has, as the surfacemost layer on at least one side of a metal substrate, a roughened nickel layer formed from a plurality of nickel projections. In observation using a focused ion beam mil...
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WO/2021/148312A1 |
The invention relates to a steel component (13) comprising a steel substrate (15) having an anti-corrosion coating (17) provided on at least one face of the steel substrate (15). The anti-corrosion coating (17) comprises an alloy layer (...
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WO/2021/148318A1 |
The invention relates to a composition in the form of an electrolyte for dissolving and/or separating metals, metal oxides, and/or metal alloys, comprising: butyltrimethylammonium-bis(trifluormethylsulfon-yl)imid (N1114 BTA), potassium a...
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WO/2021/143446A1 |
A metal surface treatment method, comprising the following steps: performing dry polishing treatment on the surface of a metal product by means of a biological abrasive; purifying the surface of the polished metal product; coating the su...
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WO/2021/144481A1 |
The present invention relates to a method for platinum-plating titanium lugs, which comprises steps of pre-treating the surface of the titanium lug before a step of electrodepositing the platinum, and to an electrochemical cell in which ...
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WO/2021/142357A1 |
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of...
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WO/2021/140688A1 |
Provided are: composite plated materials in which a composite plating layer formed from a composite material in which carbon particles are contained within an Ag layer is formed on a base material, the composite plated material being suc...
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WO/2021/141987A1 |
Nickel-gold alloys as well as methods of forming the same are provided. In one aspect, an article is provided. The article comprises a nickel-gold alloy. Gold is present in the nickel-gold alloy at a gold concentration no greater than 10...
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WO/2021/128417A1 |
The present invention relates to the field of electroplating, and specifically relates to a copper plating additive for a semiconductor. Preparation raw materials of the additive at least comprise a component A; and by mass concentration...
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WO/2021/131339A1 |
The purpose of the present invention is to provide a zinc-nickel-silica composite plating bath that has been improved in terms of: covering power for articles having a complex shape; and corrosion resistance of a low current density port...
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WO/2021/131340A1 |
The purpose of the present invention is to provide a zinc nickel electroplating bath that is difficult to bring burnt deposits and is difficult to bring a deposit of nickel hydroxide onto a cathode.　The present invention pertains to a ...
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WO/2021/125635A1 |
The present invention provides an electrogalvanized steel sheet and a method for manufacturing same, the electrogalvanized steel sheet having superb whiteness, and an attractive exterior surface due to reduction in surface scales.
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WO/2021/123059A1 |
The present inventions refers to a method for reducing the concentration of iron ions in a trivalent chromium electroplating bath, the method comprising the following steps: (i) providing the trivalent chromium electroplating bath compri...
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WO/2021/123129A1 |
The present invention is directed to a method for depositing a zinc-nickel alloy on a substrate, the method comprising the steps: (a) providing the substrate, (b) providing an aqueous zinc-nickel deposition bath as a catholyte in a depos...
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WO/2021/125525A1 |
The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50mg/m 2 o...
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WO/2021/126287A1 |
This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a pe...
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WO/2021/122932A1 |
The present invention refers to an electroplating composition for depositing a chromium coating on a substrate, the composition comprising: (i) trivalent chromium ions, (ii) at least one complexing agent for the trivalent chromium ions, ...
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WO/2021/117852A1 |
This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more, while being represented by general formula (1) or (2). In formulae (1) and (2), each of x and y represents an arbitrary natural number.
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WO/2021/117882A1 |
This alkaline zinc-iron plating bath contains a zinc compound, an alkali hydroxide, a metal salt including iron, and a complexing agent, the complexing agent being an aliphatic compound comprising five or more hydroxy groups. Due to an i...
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WO/2021/118972A1 |
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH a...
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WO/2021/111919A1 |
The present invention provides: an electrolytic copper plating solution which contains (A) sulfate ions, (B) a compound represented by general formula (1) and (C) copper ions, wherein the content of the component (B) is from 0.3 to 50 pa...
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WO/2021/110872A1 |
A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an...
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WO/2021/110822A1 |
The invention relates to the field of metal ion capture, and more particularly the selective capture of Ni(ll) nickel ions, by a polymeric compound made from a polymer chosen from the styrene polymers and the chloropolymers. In the polym...
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WO/2021/107161A1 |
A nickel-plated steel plate according to an embodiment of the present invention comprises a base material steel plate and a nickel-plated layer provided to a surface of the base material steel plate, and the ratio of tin content to nicke...
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WO/2021/107397A1 |
The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method for manufacturing the carrier foil-attached metal foil, and a laminate for forming a prin...
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WO/2021/106291A1 |
Provided is a method for suppressing, by using a zinc alloy plating apparatus, an increase in zinc concentration in a plating solution, when producing a zinc alloy plating member in which nickel is used as an alloying element. The platin...
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WO/2021/101177A1 |
Provided in one embodiment of the present invention is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 ...
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WO/2021/097988A1 |
Disclosed in the present invention is a manufacturing method for a hub type electroplating ultrathin diamond cutting disc, comprising the following steps of: forming a layer of insulating electrophoretic paint on a surface of an alloy sh...
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WO/2021/101909A1 |
An interconnect structure of a semiconductor device includes a conductive via and a barrier layer lining an interface between a dielectric layer and the conductive via. The barrier layer is selectively deposited along sidewalls of a rece...
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WO/2021/101176A1 |
An embodiment of the present invention provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8-12.5, a texture coefficient of (220) face (TC (220)) of 0.49-1.28, a tensile strength of 2...
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WO/2021/095909A1 |
The present invention provides a composition which is for plating a nickel-phosphorus alloy, and is composed of, based on the total volume of the composition, 1 to 15% of a decyl alcohol ethoxylated, phosphated aqueous solution having a ...
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WO/2021/091250A1 |
One embodiment of the present invention provides an electrolytic copper foil including a copper layer and having a weight deviation of 5% or less in the width direction calculated by following Equation 1, a tensile strength of 25 to 62 k...
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WO/2021/084853A1 |
This metal material for a sliding contact has a substrate formed from copper or a copper alloy, and a Pd-containing layer that is formed as an outermost layer on at least one part of the substrate and that contains 95 mass% or more of Pd...
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