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WO/2005/095678A2 |
The present invention includes a method of electroplating an object, where the objects are stacked in at least one sleeve and the objects have an interior surface, that upon stacking, form a stack conduit. The sleeves are then racked to ...
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WO/2005/091340A1 |
A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receiver and/or process semi-conductor wafers. The top of the process chamber also includ...
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WO/2005/081657A2 |
A copper foil (96) for lamination to a dielectric substrate (92) is coated with a laser ablation inhibiting layer (100) having an average surface roughness (RZ) of less than 1.0 micron and an average nodule height of less than 1.2 micron...
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WO/2005/083157A1 |
A surface-treated copper foil that exhibits an excellent gray and can be worked by the common copper etching process; and an electromagnetic wave shielding conductive mesh for PDP produced with the use of the surface-treated copper foil....
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WO/2005/076977A2 |
The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circul...
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WO/2005/078823A1 |
Disclosed is a plated steel sheet for battery containers which enables to obtain a battery having excellent discharge characteristics without forming a conductive layer mainly composed of graphite or the like over the inner surface of a ...
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WO/2005/077677A1 |
The invention includes methods for removing embedded beab-blast media from physical vapor deposition components (14). The components comprise a material within which the bead-blast media is embedded. The components are subjected to an et...
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WO/2005/076680A2 |
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of - immersing the substrate with the pattern present thereon in an elect...
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WO/2005/073437A1 |
A composite chromium plating film containing hard particles in fine cracks in the form of a network formed on the film, wherein the above fine cracks account for 10 to 20 area % of the surface thereof, the above fine cracks distribute in...
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WO/2005/074347A1 |
Disclosed is an electromagnetic shielding sheet (1) comprising a transparent base (11) and a line portion (107) formed on the transparent base (11) and defining an opening portion (105). The line portion (107) has a mesh-like metal layer...
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WO2004099460B8 |
The invention concerns method for producing galvanically enhanced moulded elements optionally lighted by transparency. The inventive method consists in coating the surface of a moulded element (1) made of thermoplastic, thermosetting pla...
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WO/2005/073435A1 |
A sealing agent and method of sealing, in which there is no problem of environmental pollution and anticorrosion performance equivalent or superior to that of the prior art can be realized by treatment therewith without detriment to sold...
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WO/2005/072040A1 |
An electromagnetic shielding sheet (1) comprises a first anti-rust layer (23A), a first blackened layer (25A), a metal layer (21) and a second anti-rust layer (23B) sequentially formed on a transparent base (11) via an adhesive (13). A s...
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WO/2005/068688A2 |
A stable FePt plating solution is provided. Further a process for electroplating is provided for producing an FePt magnetic material having especially strong coercive force and excellent properties by use of the plating solution. The pla...
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WO/2005/067354A1 |
A printed wiring board comprising, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer is characterized in that the bottom width of the conductive metal layer is s...
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WO/2005/066391A1 |
A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.
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WO/2005/067362A1 |
An excellent copper foil for used for the electromagnetic wave shield, provided on the front of a display, and having low apparent brightness and chromaticity, few patterns, and little unevenness. An electromagnetic wave shield filter pr...
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WO/2005/064044A1 |
A surface-treated copper foil that is free from powder fall, having a bronzing-treated layer of uniform color tone and that does not contain foreign metals becoming an etching inhibiting factor so as to attain further facilitation of etc...
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WO/2005/064043A2 |
Process for high speed metal strip electrotinning wherein the strip is plated by anodically dissolving tin anodes facing the strip into an electroplating solution, and depositing said anodically dissolved tin on at least part of the stri...
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WO2004081261B1 |
The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connecte...
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WO/2005/060379A2 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to co...
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WO/2005/059206A2 |
The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces 1, such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces are transported on a conv...
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WO/2005/052221A1 |
The invention relates to a device for oxidising the internal surfaces of hollow parts comprising a power supply, a bath-electrolyzer which is provided with electrolyte input and output, whose body is connected to said power supply and wh...
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WO/2005/049895A1 |
A copper electrolysis solution for production of electrolytic copper foil, with which a foil of low roughness wherein the configuration and size of heaps of rough surface of deposited foil are uniformalized can be obtained while substant...
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WO/2005/050760A1 |
A plated steel plate for battery case, a battery case using the plated steel plate, and a battery using the battery case are provided. The plated steel plate is capable of realizing a battery having excellent discharge characteristics, a...
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WO/2005/042804A2 |
A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during ...
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WO/2005/042807A1 |
A composite material (20) useful for the manufacture of a circuit has a support layer (12'), a metal foil (16) layer having opposing first and second sides and a thickness of 15 microns or less and a release layer (14) effective to facil...
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WO/2005/042809A2 |
The invention concerns mechanical retaining contacts (10) applied on a workpiece (4) placed on a substrate (1) by a double actuating mechanism (11, 42) which closes the circle of contacts (10) before lowering them onto the surface of the...
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WO/2005/040459A2 |
Disclosed are electroplating compositions and methods for filling recessed microstructures of a microelectronic workpiece (101), such as a semiconductor wafer, with metallization. The electroplating compositions may comprise a mixture of...
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WO/2005/038094A2 |
Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure...
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WO/2005/033376A2 |
A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substr...
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WO/2005/033377A2 |
An electroplating tool (200) is operated in combination with a controller (250), which automatically determines the individual currents for a multi-anode configuration (102A, …, 102N) of the plating tool. The calculation of the anode c...
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WO/2005/028706A1 |
A composite material having high mechanical strength and excellent wear resistance and a method of manufacturing the composite material. The composite material is formed by densely filling a metal in the clearances of a three-dimensional...
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WO/2005/028717A1 |
A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume po...
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WO/2005/028728A2 |
The invention relates to a machine for forming a pattern on a non-woven cloth comprising a rotatable drum (29) encompassed by an apron (30) which is coated with a nickel or copper layer.
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WO/2005/026415A1 |
In order to permit continuous electrolytic treatment of small electrically conductive structures that are electrically insulated against each other on electrically insulating foil material, a device for electrolytically treating electric...
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WO/2005/021820A1 |
The invention relates to a method for producing a hardened profile part from a hardenable steel alloy having cathodic corrosion protection, whereby: a) a coating is applied to a sheet made of a hardenable steel alloy; b) the coating is e...
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WO/2005/021822A1 |
The invention relates to a method for producing a hardened steel part having a cathodic corrosion protection, whereby: a) a coating is applied to a sheet made of a hardenable steel alloy in a continuous coating process; b) the coating is...
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WO/2005/021821A1 |
The invention relates to a method for producing hardened parts from sheet steel, comprising the following method steps: a) shaping formed parts made from a sheet steel provided with a cathodic corrosion protection, whereby; b) before, du...
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WO/2005/018688A1 |
The invention relates to a sanitary hose provided with an antimicrobial finish on the inner wall thereof in the form of at least one metallic layer, from which biocide metal ions are released. Said sanitary hose is a connecting hose for ...
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WO/2005/018311A2 |
A stainless steel fishhook coated with gold or silver. The stainless steel includes at least 10.5 % by weight chromium and not more than 1.2 % by weight carbon. If gold plated, it is plated with gold of at least 10 karat. If silver coate...
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WO/2005/019504A1 |
A method of preparing a printed or daubed image characterized by comprising the first step of printing or daubing a specified printed or daubed image on the surface of a printing or daubing matter by a printing ink or a liquid mixture fo...
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WO/2005/016017A1 |
There are disclosed lecithin products that can impart emulsion capacity and emulsion stability to emulsions, and also emulsions containing the lecithins that have good emulsion capacity and good emulsion stability.
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WO/2005/018021A1 |
A battery case-use surface-treated steel sheet excellent in batery performance, a battery case and a battery using it. The battery case is obtained by forming, on the surface corresponding to a battery case’s inner surface of a steel s...
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WO/2005/015623A2 |
The present invention is a method and system to reduce defects in conductive surfaces during electrochemical processes. The system includes a first power supply and a second power supply. The first powers supply is configured to supply a...
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WO/2005/015627A1 |
The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semicond...
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WO/2005/010241A1 |
A surface-treated copper foil exhibiting excellent black color which can be worked by the customary copper etching process; and a conductive mesh for PDP produced from such a surface-treated copper foil. In particular, use is made of, fo...
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WO/2005/007933A1 |
Embodiments of the invention provide an electrochemical plating cell (100). The plating cell includes a fluid basin (101), (102) having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane (112) positio...
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WO/2005/008759A1 |
Embodiments of the invention teach a method for depositing a copper seed layer to a substrate surface, generally to a barrier layer. The method includes placing the substrate surface into a copper solution, wherein the copper solution in...
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WO/2005/005692A1 |
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer....
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