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WO/2007/069466A1 |
A rubber/cord composite object (9) which comprises: metallic cords (10) comprising plated wires (17E) obtained by forming a brass deposit layer (16) on the surface of uncoated wires (15) and drawing the plated wires; and a rubber (12) bo...
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WO/2007/063951A1 |
A rubber/cord composite object (9) which comprises: metallic cords (10) comprising plated wires (17E) obtained by forming a brass deposit layer (16) on the surface of uncoated wires (15) and drawing the plated wires; and a rubber (12) bo...
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WO/2007/061112A1 |
Disclosed is a circuit member (20) comprising a lead frame member (1) which has a die pad portion (3), a lead portion (6) to be electrically connected with a semiconductor chip (30) and an outer frame portion (2) for supporting the die p...
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WO/2007/057528A1 |
The invention relates to a method for producing a non-developable surface printed circuit and to the thus obtained printed circuit. According to said invention, each electrically conductive pattern (7) of a printed circuit (2) comprises ...
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WO/2007/049456A1 |
Exposed portion of the ends of the internal electrodes on a predetermined surface of a multilayer body constituting a multilayer electronic component are directly electrolytically plated, and thus an external electrode for electrically i...
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WO/2007/046327A1 |
This invention provides a negative electrode for a rechargeable battery with a nonaqueous electrolyte, which negative electrode comprises an active material layer containing a material that can occlude and release lithium. When the mater...
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WO/2007/040191A1 |
A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Tl, Ge, Pb, Sb and Bi continuously or discontinuously in such...
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WO/2007/034921A1 |
Disclosed is a contact pin having a base which is composed of a conductive material and an outermost layer which is composed of a material in which Sn is dissolved and dispersed when heated.
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WO/2007/031276A1 |
This invention relates to a process for producing tinplate comprising the steps of providing a cold rolled and annealed steel strip; cleaning and pickling the steel strip; providing the steel strip with a tin layer; applying a coating la...
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WO/2007/026970A1 |
A threaded joint for steel pipes comprised of a pin 1 and a box 2 each having a threaded portion (1a, 2a) and an unthreaded metal contact portion (1b, 2b) exhibits adequate leakage resistance and galling resistance when used for makeup o...
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WO2002029137A9 |
An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in...
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WO/2007/026562A2 |
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WO/2007/024331A1 |
One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs) . The system comprises a deposition chamber sealed from- ambient air. A mixture of phosphor material and solution ...
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WO/2007/021358A1 |
We describe a process to produce ultra-small structures of between ones of nanometers to hundreds of micrometers in size, in which the structures are compact, nonporous and exhibit smooth vertical surfaces. Such processing is accomplishe...
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WO/2007/017279A1 |
In order to treat solar cells (26) in an electroplating device (30), they can be inserted into a grid-like or tray-like picking-up device (11). They are thus mechanically held and electrical contact is made with them via contacts (24). I...
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WO/2007/015692A1 |
Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the gro...
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WO/2007/010982A1 |
Disclosed is a rolling bearing which contains no harmful substance and thus causes no environmental contamination. Specifically disclosed is a retainer for rolling bearings which is made of a cold-rolled steel sheet and holds a rolling e...
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WO/2007/009448A1 |
The present invention relates to a contacting unit (2) for use in the electrodepositing of a conductive layer on a carrier (7), which can be connected as a cathode and/or as an anode, characterized in that the contacting unit (2) is surr...
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WO/2007/006755A1 |
What is specified is a method for removing a layer (2) comprising metal from a workpiece (1) by means of an electrochemical treatment in which the workpiece (1) is introduced as a working electrode into an electrolytic treatment solution...
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WO/2007/007870A1 |
A blackening surface treated copper foil capable of improving a phenomenon of causing clouding of the surface of an adhesive layer exposed between mesh circuits on completion of etching of a conductive mesh used for shielding a plasma di...
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WO/2007/004581A1 |
Disclosed is an Sn-plated copper alloy bar having good fatigue characteristics wherein deterioration of fatigue characteristics due to Sn plating is prevented. In a copper alloy bar which is provided with an Sn or Sn alloy plating film b...
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WO/2007/002956A1 |
A method for forming a composite metal layer on a substrate comprises providing nanocrystalline particles of a first metal, adding the nanocrystalline particles to a plating bath that contains ions of a second metal to form a colloid-lik...
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WO/2006/137555A1 |
A conductive surface 5 of a film 4 is plated with copper by allowing the film 4 to pass through a plating solution 7 in a plating bath 6 while conveying the film in a direction indicated by the arrow. Air knife devices 20A and 20B are di...
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WO/2006/137240A1 |
This invention provides a copper foil for a printed wiring board, comprising a heat-resistant treatment layer formed on a copper foil in its unroughened surface as a face of bonding to a resin, a chromate film layer provided on the heat-...
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WO/2006/134665A1 |
[PROBLEMS] To provide a member provided with coating that is capable of suppressing any whisker generation. [MEANS FOR SOLVING PROBLEMS] Coating (3) containing multiple crystal grains (3a) consisting of tin or a tin alloy is superimposed...
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WO/2006/129540A1 |
An Nb-Al type superconducting wire which is in a state before transformation to an Nb3Al compound. It comprises an Nb-Al type wire in the state of a supersaturated solid solution, a nickel coating film as an interlayer, and a copper coat...
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WO/2006/129602A1 |
For industrially advantageous production of an electroformed copper/niobium composite piping material in which the electroformed copper layer and the niobium thin piping material are strongly boned to each other, a nickel thin-film is ap...
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WO/2006/129806A1 |
At first step S1, a passivation film (48) is removed by performing pickling on a separator (40) for fuel cell and then a new passivation film (42) is formed by performing heating at 200-280°C preferably. At second step S2, mechanical po...
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WO/2006/126518A1 |
Gravure cylinder-use copper plating method and device which can perform a uniform-thickness copper plating on a gravure cylinder over its entire length without causing defects such as rashes and pits regardless of the size of a gravure c...
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WO/2006/117920A1 |
Provided is a tin plating solution which is less susceptible to forming a sludge even after the storage for a long time and has a markedly long life as a plating solution. A tin plating solution for carrying out an electrolytic tin plati...
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WO/2006/114564A1 |
The invention provides a method of producing a mirror under a layer of hydrophilic colloid (8) onto a transparent conducting layer (4) by coating the layer of hydrophilic colloid (8) onto the conductive substrate (4), placing the coated ...
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WO/2006/112522A2 |
The surface-treated doctor blade (2) having nickel-phosphorus-based alloy plating which does not include irregularities (7) of planar diameter exceeding 50 µm at least at the blade edge end can have an improved conformability of blade e...
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WO/2006/109650A1 |
A press fit joining method of members constituting a metallic element component in which joining is carried out easily in good environment while exhibiting excellent mass productivity, reliability and strength. Cross-section at the press...
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WO/2006/108140A1 |
A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt i...
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WO/2006/098336A1 |
Disclosed is a plating method for electrolytically plating a film surface having a surface resistance of from 1 &ohm /&square to 1000 &ohm /&square continuously. This plating method is characterized in that the distance from the lowest p...
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WO/2006/098338A1 |
Disclosed is a plating method for electrolytically plating a film surface having a surface resistance of from 1 &ohm /&square to 1000 &ohm /&square continuously. This plating method is characterized in that the feed rate of the film is f...
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WO/2006/095683A1 |
Disclosed is a negative electrode collector for dry cells which enables to prevent generation of a hydrogen gas. In addition, this negative electrode collector for dry cells enables to manufacture an easily mass-producible dry cell havin...
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WO/2006/094755A1 |
The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said polyvinylammonium compound for electrolytically depositing a copper deposit as well...
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WO/2006/093155A1 |
The noise which radiates into a peripheral space outside a connector between substrates from a plurality of connecting terminals connecting the substrates is suppressed. The facing substrates are electrically connected by connecting term...
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WO/2006/090785A1 |
A stacked unit (20) is formed by inserting an anode plate between a fuel side separator and an air side separator so that the anode plate faces the separators. A plating liquid and a dispersion wherein supercritical CO2 for enhancing dif...
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WO/2006/088526A1 |
A stainless steel tube fittings, or components threof, are color coded by providing an oxide coating of a different color on one or more its surfaces, the colored oxide coating having a thickness of ≤000Å.
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WO/2006/087743A1 |
A hollow anode (A) for an apparatus for the galvanic coating of the running surfaces of cylinders is provided with a plurality of passages (P) formed in the top portion (T) thereof, the total area of the passages (P) being such as to ach...
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WO/2006/087585A1 |
A duct (10) for use in an ultrasonic treatment plant is made from a cylindrical steel pipe (12) by plating the bore with a corrosion-resistant metal layer (14). This is preferably done by honing the bore to ensure that it is circular, pl...
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WO/2006/084973A1 |
The invention relates to a method for treating surfaces of hollow parts, this method being a conversion treatment such as an anodizing, and to a method according to which the hollow pieces are completely immersed inside at least one trea...
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WO/2006/080148A1 |
This invention provides a low profile electrolytic copper foil having a small surface roughness on the rough surface side (side remote from gloss surface) in the production of an electrolytic copper foil using a cathode drum, particularl...
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WO2006047500A9 |
An article of manufacture and a process for making the article by the anodization of aluminum and aluminum alloy workpieces to provide corrosion-, heat- and abrasion-resistant ceramic coatings comprising titanium and / or zirconium oxide...
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WO/2006/070452A1 |
A method for manufacturing a semiconductor device, which comprises providing a tank (21) for storing a plating solution in addition to a plating treatment tank (20), and arranging magnets (33a to 33d) in the plating solution storage tank...
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WO/2006/064803A1 |
[PROBLEMS] To improve the corrosion resistance by converting a pipe making step and a coating forming step to a continuous step and forming a corrosion-resistant coating having no pin-holes. [MEANS FOR SOLVING PROBLEMS] On the way of the...
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WO/2006/064711A1 |
In a face down type jet plating device, it is possible to prevent lowering of the plating quality caused by a minute solid foreign matter attributed to a black film. In the face down type plating device, a partition wall (7) is provided ...
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WO/2006/065580A2 |
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (107). The multi-layered wafer support apparatus includes a bottom film layer (201) and a top film layer (301). The bot...
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