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WO/2008/053878A1 |
This invention provides a surface treated copper foil which, without use of chromium in an antirust treated layer in an electrolytic copper foil, is excellent in good properties after fabrication into a printed wiring board, for example,...
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WO/2008/047509A1 |
This invention provides a plating apparatus which can apply at a high speed a magnetic alloy plating having a uniform thickness and a homogeneous composition on the surface of a shaft-shaped member. A plating apparatus (1) has a plating ...
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WO/2008/044763A1 |
A tab lead material which comprises a thin metal sheet material and which, when used in a laminate package type cell or capacitor, has improved adhesion to a film material to be bonded to this tab lead material. It is intended to thus he...
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WO/2008/041516A1 |
The surface of a metal base is electroplated by utilizing an induction codeposition phenomenon using at least one of carbon dioxide and inert gas, an electroplating liquid containing a metal powder dispersed therein, and a surfactant in ...
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WO/2008/041484A1 |
[PROBLEMS] To provide an elastic contact for improving strength of bonding to a connecting electrode of an electronic component such as an IC package and to provide a method for bonding between metal terminals. [MEANS FOR SOLVING PROBLEM...
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WO/2008/041720A1 |
With respect to a metal clad laminate having a flexible polymer film provided at at least one portion of the surface thereof with a metal layer, any warp of the laminate can be inhibited by carrying out heating and cooling treatments und...
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WO/2008/035961A2 |
The invention provides a device for electrochemically depositing a material on at least one side of a plate-shaped substrate having a circumferential edge, said device comprising an electrolytic bath with an electrolytic solution therein...
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WO/2008/032784A1 |
A copper-based deposited alloy board for contact material having differences between three tensile strengths, namely, tensile strength along the rolling direction, tensile strength along the direction sloping with an angle of 45° from t...
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WO/2008/023974A1 |
The present invention relates to a device (1, 501) for treating a plate-shaped substrate (21) in a bath (7, 7' ' ) comprising a bath (7, 7' ' ), a process container (55, 503) for at least one substrate (21), transfer means (32,33,36,37,4...
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WO/2008/023561A1 |
A nickel-plated stainless-steel wire which has satisfactory lubricity on tools and excellent processability. The nickel-plated stainless-steel wire is one produced by plating a raw stainless-steel wire with nickel and drawing the plated ...
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WO/2008/012862A1 |
Simple means for unfailing prevention of whisker occurrence even when leaving is made at room temperature for 5000 hr after tin or tin alloy plating. There is provided a whisker preventive agent for tin or tin alloy plating, comprising (...
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WO/2008/013535A1 |
A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of...
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WO/2008/009325A1 |
A device (20) for the surface treatment of a workpiece (1), in particular electroplating, cleaning and the like, is described, which device comprises a space (3, 17) which is complementary to at least one cross section of the workpiece (...
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WO/2008/009439A1 |
A clamping device for a printing cylinder with two holding devices (11) on a common axis, each of which has a recess (17) to receive one end (19) of the printing cylinder, with their recesses (17) directed towards one another, and which ...
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WO/2008/004558A1 |
Without the use of conventional chemicals, such as chromic acid, not only resin surface roughening but also conductivity imparting is attained for resin molding by a dry process. Accordingly, deterioration of the resin surface of resin m...
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WO/2008/001533A1 |
A negative electrode (10) for use in a non-aqueous electrolyte secondary battery comprises an active material layer (12) containing a particle (12a) of an active material. At least a part of the surface of the particle (12a) is coated wi...
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WO/2008/001892A1 |
A metal wire rod plating insoluble anode which can electroplate a plurality of metal wire rods concurrently and can make uniform a plating deposition amounts in these metal wire rods constantly and for an extended period. For this purpos...
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WO/2008/001807A1 |
A metal wire rod plating insoluble anode which can make uniform a plating deposition amounts in a plurality of metal wire rods constantly and for an extended period, can contribute to simplifying a plating facility and to facilitating a ...
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WO/2008/001536A1 |
A negative electrode (10) for use in a non-aqueous electrolyte secondary battery comprises an active material layer (12) containing a particle (12a) of an active material. At least a part of the surface of the particle (12a) is coated wi...
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WO/2007/147818A2 |
The invention relates to an apparatus (10) and to a method for depositing a metal coating on an electrically conductive substrate (16) in a continuous way. The apparatus comprises at least one plating vessel (11) for receiving an electro...
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WO/2007/145164A1 |
A rolled copper or copper alloy foil having a roughened surface comprising fine copper particles, characterized by being obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing cop...
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WO/2007/142747A2 |
There is provided an apparatus for plating a portion of a work piece. The apparatus comprises a fixture having a cavity formed therein. The cavity is dimensioned to receive the portion of the work piece. An attaching means is provided fo...
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WO/2007/140949A1 |
The invention relates to an apparatus (1) for electrolytic deposition of an electrically conductive layer on a substrate (6) on which a starter layer (7) suitable for electroplating is located at least in regions. The apparatus (1) has a...
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WO/2007/139072A1 |
Disclosed is a Cu-Zn alloy strip which is improved in thermal separation resistance for Sn plating. Also disclosed is such a Cu-Zn alloy strip plated with Sn. Specifically disclosed is a Cu-Zn alloy strip consisting of 15-40% by mass of ...
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WO/2007/137445A1 |
In a component (10) consisting of two work pieces (10, 20) which are non-positively joined via joining surfaces (11, 21), at least one surface in the joint area of the work piece (10) has a surface structure with structural elevations (1...
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WO/2007/139133A1 |
This invention provides a plated steel plate for a battery can, which can impart stable and good electric contact to the outer surface of a battery can, can reduce damage to a plated surface in the preparation of a battery can by draw pr...
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WO/2007/135972A1 |
There is provided a copper foil provided with a carrier sheet, in which the carrier and the copper layer can be peeled from each other even when it is used for the fabrication of a printed circuit board in which press work is performed a...
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WO/2007/136024A1 |
[PROBLEMS] To provide a method of pretreatment for plating in which lead, etc. dissolved in an etchant are prevented from being electrodeposited (readhering) to a lead-containing copper alloy as a work to be plated without the necessity ...
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WO/2007/132529A1 |
A metal composite film that excels in heat resistance and adhesion, being suitable for use in a flexible printed wiring board capable of minute wiring formation; and a process for producing the same. There is provided a metal composite f...
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WO/2007/129979A1 |
The present disclosure relates to a material for valve leafs of flapper valves, the material comprising a metallic base material and a metallic coating. The valve leaf material has improved fatigue resistance and can be produced by proce...
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WO/2007/129132A1 |
A semiconductor package (24; 26) comprises a semiconductor component (1) including a circuit carrier (2; 27) , a semiconductor chip (3) and a plurality of electrical connections (4) . An adhesion promotion layer (22) is disposed on at le...
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WO/2007/130838A2 |
Disclosed are coating compositions, such as primer compositions, suitable for providing corrosion protection to metal substrates, as well as related coated articles and methods.
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WO/2007/119382A1 |
In an electric contact material, a conductive base body is provided with a first layer composed of a noble metal having an arithmetic average roughness Ra=(A)μm or an alloy having a noble metal as a main component; and a second layer, w...
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WO/2007/119522A1 |
Disclosed is a silver coated composite material for movable contacts, which comprises a base composed of an alloy mainly containing iron or nickel, a foundation layer which is formed on at least a part of the surface of the base and comp...
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WO/2007/116775A1 |
The present invention provides a washing apparatus which washes a web while conveying the web. The washing apparatus includes a squirting component which ejects fresh washing liquid at the web and a first washing tank which is disposed a...
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WO/2007/116774A1 |
A washing apparatus provided with a washing liquid-holding reservoir and the component which supplies washing liquid to the washing liquid-holding reservoir. At an electroplate solution, a conductive surface of a web is caused to touch a...
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WO/2007/116667A1 |
At least two rotating bodies face each other by having a web in between so that only the end portion of the web, which is made conductive, is brought into contact with pressure. At least one of the rotating bodies is a power feeding elec...
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WO/2007/116717A1 |
Disclosed is a silver coated composite material for movable contacts, which comprises a base composed of an alloy mainly containing iron or nickel, a second intermediate alloy layer which is formed on the base and mainly composed of copp...
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WO/2007/105635A1 |
This invention provides a surface treated electrolytic copper foil, which has a low profile on an equal or higher level as compared with a low-profile surface treated electrolytic copper foil which has been supplied on the conventional m...
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WO/2007/101363A1 |
An automatic device for plating inside the hollow work-pieces is disclosed. The device includes one or more jig-units, it is characterized in that: each jig-unit includes a carrying pulley that can move along the fixed direction; a vibra...
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WO/2007/099210A1 |
The invention provides a method and a device for reliable, rapid, simple, easily implementable and reproducible electrochemical microstructuring and/or nanostructuring. For this purpose, the subject of the invention is a method for elect...
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WO/2007/097338A1 |
Provided is a plating material (5) wherein a base layer (2) composed of Ni or the like is arranged on a conductive base body (1), an intermediate layer (3) composed of copper or a copper alloy is arranged on the base layer, and an outerm...
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WO/2007/097335A1 |
[PROBLEMS] To provide a method of plating capable of forming a filled via of 7 μm or less surface unevenness degree. [MEANS FOR SOLVING PROBLEMS] The thickness of diffusion layer (region wherein the concentration of plating components a...
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WO/2007/097356A1 |
[PROBLEMS] A ultrafine coaxial line which is very fine and is provided with stable conductivity and excellent high frequency characteristics and a production method therefore, and a ultrafine coaxial barrel which can be fined in diameter...
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WO/2007/095434A2 |
An electrophoretic coating for a non-cylindrical component, such as a faucet, utilizes a flexible anode and sleeve assembly. The flexible anode and sleeve assembly may be inserted into the interior of the faucet, and can bend around the ...
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WO/2007/091602A1 |
A process for the production of rare earth permanent magnets having copper plating films on the surfaces by using a novel copper electroplating solution which can form copper plating films on the surfaces of rare earth permanent magnets ...
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WO/2007/088600A1 |
A process for producing a ceramic electronic part, in which in the formation of Sn plating layer, leaching of Ba from electronic part body is suppressed and in which not only is any cohesion between electronic part bodies by the Sn plati...
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WO/2007/087795A2 |
An oligodynamically effective device is disclosed, comprising a copper- or silver-containing surface (10) and a noble metal coating (12) applied thereto which is permeable to moisture and in particular has a cluster, microporous and/or m...
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WO/2007/086510A1 |
[PROBLEMS] To propose a plating apparatus in which the plating metal hardly deposited on the cathode feed roller even if the cathode feed roller is disposed in the plating bath. [MEANS FOR SOLVING PROBLEMS] Current is supplied to the pla...
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WO/2007/073339A1 |
The invention relates to a device and a method for metallic electrolytic coating of an object (1) of electrically conductive material, wherein the object has at least two surface portions that are desired to be coated with layers of diff...
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