| Document |
Document Title |
|
WO/2005/002773A1 |
For the purpose of ensuring that the pressure and corrosion resistance of microstructure components is high enough, that the component’s tightness against fluid exiting from the component or fluid spilling over into adjacent microchann...
|
|
WO/2005/002742A1 |
A method for producing process equipment having a wear surface having extended resistance to one or more of abrasion, erosion, or corrosion, associated with fillers or solids processed by said process equipment includes applying to said ...
|
|
WO/2005/003409A1 |
By conducting electrolysis in an electrolytic solution containing an organic solvent using a semiconductor on which a catalyst metal is formed non-uniformly as a cathode, a nanocarbon material is formed on the surface of the catalyst metal.
|
|
WO/2005/001896A2 |
A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the...
|
|
WO/2004/111312A2 |
The invention relates to a method for producing contact surfaces for electrical contacts, whereby a metal is electrodeposited on a copper-based substrate. The metal is deposited on a substrate together with a dummy material that can be e...
|
|
WO/2004/110698A2 |
Tools having mounting modules with registration systems are disclosed. The mounting includes positioning elements for precisely locating a reactor and a workpiece transport that moves workpieces to and for the reactor. The relative posit...
|
|
WO/2004/108346A1 |
The present invention is directed to a process for forming a drug delivery device (10) by electroplating onto a substrate a porous layer (12) having pores (14) of a controlled size and density and loading a drug into the pores (14). Pref...
|
|
WO/2004/107422A2 |
A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilic...
|
|
WO/2004/104430A1 |
Accordingly, this invention provides a fastener system (8) which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener (8) is disclosed that has a co...
|
|
WO/2004/101873A1 |
The invention relates to a previously known water-permeable drum for hydrodynamically needling webs of textile materials such as nonwovens, tissue, cloth, knitted fabrics, or similar in order to reinforce and structure said textile mater...
|
|
WO/2004/100185A1 |
It is an object of the present invention to provide a method of coating an electric wire by which an insulated wire having a high dielectric breakdown voltage can be obtained. A method of coating an electric wire, comprising a step (I) o...
|
|
WO/2004/097929A2 |
The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a deg...
|
|
WO/2004/094701A2 |
It is an object of the present invention to provide a system and method for monitoring, dosing and distribution of a chemical composition in a material treatment process, the chemical composition containing at least one additive for main...
|
|
WO/2004/094703A2 |
Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using c...
|
|
WO/2004/094702A2 |
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating ce...
|
|
WO/2004/092452A1 |
A two layer flexible copper-clad laminate which is manufactured by the direct metallization method and has a polyimide resin film base material, a seed layer formed on one surface of the base material, and a copper layer formed on the se...
|
|
WO/2004/090199A1 |
An electrochemical method of forming nanocoated particles includes the steps of suspending a plurality of host core particles in a solution, providing a plurality of cations in the solution, and electrochemically forming a plurality of n...
|
|
WO/2004/081255A1 |
Formation of a Cu film on a fine pattern provided with a Cu diffusion preventing film, in which the surface of the Cu diffusion preventing film over a substrate to be treated is cleaned according to the cleaning method using a supercriti...
|
|
WO/2004/081262A1 |
In order to electroplate workpieces comprising high-aspect ratio holes a method is disclosed comprising the steps bringing the workpiece and at least one anode into contact with a metal plating electrolyte, and applying a voltage between...
|
|
WO/2004/078411A2 |
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conduc...
|
|
WO/2004/079055A1 |
A method for producing a rare-earth permanent magnet, which comprises laminating a first protective layer comprising nickel and a second protective layer comprising nickel and sulfur on a magnet base material comprising a rare earth elem...
|
|
WO/2004/076724A1 |
A method for producing a surface-treated Al sheet, which comprises forming a Zn layer on the surface of an Al substrate by the displacement plating and then forming a Ni layer and an Sn layer by plating on the Zn layer, or further compri...
|
|
WO/2004/073890A1 |
A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immersed in a first immersion tin solution comprising a tin metal and a complexing agen...
|
|
WO/2004/075266A2 |
Embodiments of the invention generally provide a method for immersing a substrate into a fluid solution. The method includes loading a substrate into a receiving member configured to support the substrate in a face down orientation, tilt...
|
|
WO/2004/074554A1 |
According to the invention, the cylinder bearing surfaces are treated using pre-treatment and coating baths, by means of jet devices (5, 11), equipped with lances that can be introduced into the cylinder bores (1'). The jet devices (5, 1...
|
|
WO/2004/072331A2 |
An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and pe...
|
|
WO/2004/070087A1 |
A composite copper foil which comprises a copper foil and, provided on at least one surface thereof, a smooth layer made of copper and/or silver; a method for producing a composite copper foil, which comprises rolling an ingot of a coppe...
|
|
WO/2004/065664A1 |
A plating device capable of selectively depositing metal plating films such as copper layers in fine recessed parts for wiring formed of circuit-shaped trenches and via holes, comprising an electrode head (701) having an anode (704), a p...
|
|
WO/2004/063426A1 |
A metal plating coating film substantially free of lead, characterized in that it comprises an alloy layer or simple metal layer having Hv value of 60 or more as an undercoat layer and alloy layer or simple metal layer having a Hv value ...
|
|
WO2003044248A9 |
The inventive device is used for electrolytic treatment and hardening the surfaces of the defective sections of the heat exchange tubes (HET) of steam generators of nuclear power stations. Said device comprises reservoirs with electrolyt...
|
|
WO/2004/059041A1 |
The present invention provides a method of forming a biaxially textured gold buffer layer (14) on a substrate(16) by electrodeposition. A superconducting material (12) may be deposited onto the biaxially textured goldlayer (14). The biax...
|
|
WO2004006228B1 |
A silver-based alloy composition for use as a reflective or semi-reflective coatings or layer(s) for use in optical data storage media, low emissivity glass, transparent conductive displays, and electro-chromic mirrors, or other reflecti...
|
|
WO/2004/057061A1 |
For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phe...
|
|
WO/2004/057060A2 |
Embodiments of the invention generally provide an electrochemical processing system configured to provide multiple chemistries for a single plating process. The multiple chemistries are generally delivered to individual plating cells pos...
|
|
WO/2004/055247A1 |
Electroplating station (S) has a mesh (11) located at a throat section (12) of passageway (4) shortly before the start of the guide (7) thereby to cause and/or enhance the production of vortices by guide (7) and/or the serrations. At its...
|
|
WO2004010464B1 |
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first (60) and second (70) regions is provided. The first an...
|
|
WO/2004/053455A2 |
A method of plating bath composition control. The method may include analysis of a plating bath to determine byproduct concentrations and changing the composition of the plating bath as a result thereof. Additionally, plating bath soluti...
|
|
WO/2004/053202A1 |
A method of forming a copper interconnect, comprising forming an opening in a dielectric layer disposed on a substrate, forming a barrier layer over the opening, forming a seed layer over the metal layer, and forming a copper-noble metal...
|
|
WO/2004/053193A1 |
In one aspect, a copper foil (14, 60) for lamination to a dielectric substrate (62) includes a layer (64) deposited on a surface of the copper foil (14, 60). The layer (64) is formed from chromium and zinc ions or oxides and is treated w...
|
|
WO/2004/052547A2 |
A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For. solder joints, after reflow the solder ...
|
|
WO/2004/050937A2 |
The invention relates to a method for coating piston rings (10) for internal combustion engines, wherein at least the bearing surface of the piston ring is provided with an anti-abrasion and anti-corrosion coating (12) by means of a PVD ...
|
|
WO/2004/052062A1 |
The invention relates to a printed circuit which is equipped with electrically conductive tracks and which can be obtained by means of gravure printing. Gravure printing can be used to obtain conductive tracks of a very small thickness, ...
|
|
WO/2004/048825A1 |
A gland packing comprising a gland packing base material having its surface provided with a crystallized coating of orientated solid lubricant. It is preferred that the axial resistance per contact area of the gland packing at a fastenin...
|
|
WO/2004/046426A1 |
A method and apparatus are described for performing both electroplating of a metal layer and CMP planarization of the layer on a substrate. The apparatus includes a table (10) supporting a polishing pad (20); the table and pad have a plu...
|
|
WO/2004/046418A1 |
A substrate processing apparatus preferably used for plating a substrate or for processing a substrate by dipping it in a process liquid is disclosed. The processing apparatus (1) comprises a loading/unloading area (100) for taking in or...
|
|
WO/2004/044273A1 |
The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with ...
|
|
WO/2004/044270A1 |
An anode for a cell suitable for electrometallurgical processes for depositing onto a sheet, wire or other object in motion across said cell a metallic coating containing ions of the metal or metals to be deposited wherein said anode is ...
|
|
WO/2004/042790A2 |
A method for producing a superconductor having a high copper to superconductor composition (Cu/SC) ratio by cross-sectional area. An assembly is prepared formed of one or more fine filaments of a superconductor composition or of a precur...
|
|
WO/2004/040044A1 |
A metal plating structure, characterized in that it comprises a metal plating film and, incorporated therein, a fine carbon fiber or a derivative thereof, wherein the fine carbon fiber represents a carbon fiber having a diameter of appro...
|
|
WO/2004/039137A1 |
A plasma display panel-use copper foil excellent in shielding performance, characterized by being provided with a black nickel-plated layer having &Dgr L ≤ -85.00 where &Dgr L = 0: white and &Dgr L = -100: black on a color difference m...
|
